公开(公告)号：US20240365478A1

公开(公告)日：2024-10-31

申请号：US18769438

申请日：2024-07-11

Applicant: BOE Technology Group Co., Ltd.

Inventor： Guoteng LI ,  Shuilang DONG ,  Xinhong LU ,  Liuqing LI ,  Jingshang ZHOU ,  Baoman LI ,  Zhao CUI ,  Yingwei LIU

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/16 ,  H05K3/40 ,  H05K5/00

CPC classification number: H05K3/4691 ,  H05K1/111 ,  H05K3/16 ,  H05K3/4007 ,  H05K5/0069 ,  H05K2203/0143 ,  H05K2203/0723 ,  H05K2203/1377

Abstract: Embodiments of the present disclosure provide a circuit board, a display apparatus, and a manufacturing method for a circuit board. The manufacturing method for the circuit board includes: providing a precursor substrate; forming seed patterns and an auxiliary seed pattern on a side of the precursor substrate, where the seed patterns are located in the patterned areas, the auxiliary seed pattern is located in the non-patterned area, and the seed pattern and the auxiliary seed pattern are separated from each other; and forming a pad at a position of the seed pattern and an auxiliary pattern at a position of the auxiliary seed pattern by an electroplating process.

公开(公告)号：US20220254972A1

公开(公告)日：2022-08-11

申请号：US17628926

申请日：2021-03-10

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xinhong LU ,  Zhanfeng CAO ,  Jingshang ZHOU ,  Liuqing LI ,  Ting ZENG ,  Yongfei LI ,  Qi QI

IPC: H01L33/62

Abstract: The present disclosure provides a driving substrate, including: a flexible substrate including a display region and a bendable region; a first conductive layer on the flexible substrate and including a first wire in the display region, and a connection wire at least partially in the bendable region; a flexible insulating layer including a first insulation pattern in the display region, and a second insulation pattern in the bendable region; a second conductive layer at a side of the flexible insulating layer far away from the flexible substrate; and a planarization layer at a side of the second conductive layer far away from the flexible substrate and having a hollow structure in the bendable region, wherein a thickness of a portion of the second insulating pattern covering the connection wire is d2, a thickness of the flexible substrate is d3, and d2≥2 μm and |d2−d3|≤3 μm.

公开(公告)号：US20250022987A1

公开(公告)日：2025-01-16

申请号：US18280482

申请日：2022-10-26

Applicant: Hefei BOE Ruisheng Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Jianying ZHANG ,  Jian TIAN ,  Chunjian LIU ,  Yajun MA ,  Jie LEI ,  Nan CHENG ,  Xinhong LU

IPC: H01L33/46

Abstract: A display substrate, a manufacturing method therefor and a display device are provided. The display substrate includes a substrate structure layer, the substrate structure layer includes a substrate material layer, a sacrificial layer and an optical film layer between the substrate material layer and the sacrificial layer which are stacked; a reflectivity of the optical film layer is greater than a transmittance of the optical film layer.

公开(公告)号：US20240096910A1

公开(公告)日：2024-03-21

申请号：US18522510

申请日：2023-11-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wei YANG ,  Xinhong LU

IPC: H01L27/12 ,  H01L29/66 ,  H01L29/786

CPC classification number: H01L27/1255 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/1251 ,  H01L27/1259 ,  H01L29/66757 ,  H01L29/66969 ,  H01L29/78675 ,  H01L29/7869 ,  H10K59/1213

Abstract: An OLED display device including a display area is provided. A first and second thin film transistors (TFTs) are arranged in the display area, the first TFT includes a first active layer, the second TFT includes a second active layer, a material of the first active layer is different from that of the second active layer. The OLED display device includes a substrate, the second active layer, a second gate of the second TFT, the first active layer, a first gate of the first TFT, a first source and drain of the first TFT, a second source and drain of the second TFT, a first data line in a same layer as the second source and drain, a first planarization layer on the first data line, and a second data line on the first planarization layer and electrically insulated from the first data line.

公开(公告)号：US20230378411A1

公开(公告)日：2023-11-23

申请号：US18028309

申请日：2021-01-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Xiaoyan ZHU ,  Xinhong LU ,  Ling LI ,  Hua HUANG

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167

Abstract: A driving backplate, a display panel, and a display device. The driving backplate comprises: a base substrate, comprising a display area and a fan-out area located on at least one side of the display area. The display comprises a plurality of pixel units arranged in an array, and a plurality of signal lines connected to the pixel units, and the plurality of signal lines extend in a first direction; the fan-out area comprises fan-out lines, the fan-out lines are connected to the signal lines, the fan-out line comprises a first end proximate to the display area and a second end distant from the display area, and the width of the first end is greater than the width of the second end; at least one signal line is connected to at least one fan-out line by means of a connecting line, and the connecting line extends in a second direction.

公开(公告)号：US20230043951A1

公开(公告)日：2023-02-09

申请号：US17790308

申请日：2021-08-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ke WANG ,  Zhanfeng CAO ,  Xinhong LU ,  Qi QI ,  Yan QU ,  Zhiwei LIANG ,  Yingwei LIU ,  Dapeng XUE ,  Guoqiang WANG ,  Jianguo WANG ,  Song LIU ,  Yongfei LI ,  Ting ZENG ,  Huan LIU ,  Wanru DONG ,  Heren GUI ,  Jian YANG ,  Haifeng HU ,  Yu JIANG ,  Peng XU ,  Weiwei CHU ,  Qi GAO

IPC: H01L33/62 ,  H01L25/075 ,  H01L21/48 ,  H01L23/498

Abstract: An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer . The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.

公开(公告)号：US20190123069A1

公开(公告)日：2019-04-25

申请号：US16166356

申请日：2018-10-22

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wei YANG ,  Hehe HU ,  Xinhong LU

IPC: H01L27/12 ,  H01L29/786 ,  H01L29/66

Abstract: The present disclosure relates to array substrate, preparation method thereof and display panel. An array substrate comprises: a first thin film transistor and a second thin film transistor over a substrate; wherein the first thin film transistor comprises a first portion of a first insulating layer, the first insulating layer comprises a first recess corresponding to the second thin film transistor, and the second thin film transistor is located in the first recess; and wherein a thickness of a second portion of the first insulating layer, which is below the bottom of the first recess, is smaller than that of the first portion of the first insulating layer.

公开(公告)号：US20230230983A1

公开(公告)日：2023-07-20

申请号：US18189569

申请日：2023-03-24

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wei YANG ,  Xinhong LU

IPC: H01L27/12 ,  H01L29/66 ,  H01L29/786

CPC classification number: H01L27/1255 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/1251 ,  H01L27/1259 ,  H01L29/66757 ,  H01L29/66969 ,  H01L29/78675 ,  H01L29/7869 ,  H10K59/1213

Abstract: A display device is disclosed. The display device includes a display area and a wiring area. The display area is disposed with a first thin film transistor which is an oxide thin film transistor and a second thin film transistor which is a low temperature poly-silicon thin film transistor. A distance between a first active layer of the first thin film transistor and a substrate is different from a distance between a second active layer of the second thin film transistor and the substrate. The first thin film transistor includes first vias that receive a first source/drain. The second thin film transistor includes second vias that receives a second source/drain. The wiring area is provided with a groove. The groove includes a first sub-groove and a second sub-groove that are stacked, and depths of the second vias are substantially equal to a depth of the second sub-groove.

公开(公告)号：US20220384492A1

公开(公告)日：2022-12-01

申请号：US17765355

申请日：2021-03-05

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xinhong LU ,  Zhanfeng CAO ,  Ke WANG ,  Jiushi WANG ,  Xiaoyan ZHU

IPC: H01L27/12 ,  H01L25/16

Abstract: An array substrate having a light-emitting unit region, a bonding region, and a bending region located between the light-emitting unit region and the bonding region. The light-emitting unit region is configured to be provided with light-emitting units. The bonding region is configured to bond a control circuit. The array substrate includes a base substrate located in the light-emitting unit region and the bonding region, a first organic material layer, a metal intermediate layer, and a second organic material layer. The first organic material layer is disposed on a side of the base substrate. The metal intermediate layer is disposed on a side of the first to organic material layer away from the base substrate. The second organic material layer is disposed on a side of the metal intermediate layer away from the base substrate.

公开(公告)号：US20220339855A1

公开(公告)日：2022-10-27

申请号：US17761039

申请日：2021-05-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shuqi LIU ,  Wenyue FU ,  Xinhong LU ,  Qi QI ,  Xiaojie PAN

IPC: B29C53/80 ,  H01L25/16 ,  B29C65/48 ,  B29C65/00 ,  B29C53/04

Abstract: A folding device and a folding method are provided. The folding device includes a bearing and fixing mechanism configured to bear and fix a main body portion of a to-be-folded device; a folding mechanism disposed on at least one lateral side of the bearing and fixing mechanism, the folding mechanism being configured to bear a to-be-folded portion of the to-be-folded device and fold the to-be-folded portion to one side in a thickness direction of the main body portion; a first driving mechanism configured to drive the folding mechanism to move along a direction perpendicular to a bearing surface, which bears the main body portion, of the bearing and fixing mechanism; and a second driving mechanism configured to drive the folding mechanism to move close to or away from the bearing and fixing mechanism along a direction parallel to the bearing surface.