公开(公告)号：US12006221B2

公开(公告)日：2024-06-11

申请号：US17546488

申请日：2021-12-09

Applicant: CORNING INCORPORATED ,  Fundació Institut de Ciències Fotòniques (ICFO) ,  Institució Catalana de Recerca i Estudis Avançats

Inventor： Therese Francoise Arliguie ,  Theresa Chang ,  Miriam Marchena Martin-Francés ,  Prantik Mazumder ,  Valerio Pruneri ,  Frederic Christian Wagner

IPC: C01B32/194 ,  B05D1/00 ,  B05D3/12

CPC classification number: C01B32/194 ,  B05D1/005 ,  B05D3/12 ,  B05D2350/60 ,  B05D2505/50 ,  C01B2204/22

Abstract: A method of forming a functionalized device substrate is provided that includes the steps of: forming a conductive layer on a growth substrate; applying a polymeric layer to a device substrate, wherein a coupling agent couples the polymeric layer to the device substrate; coupling the polymeric layer to the conductive layer on the growth substrate; and peeling the growth substrate from the conductive layer.

公开(公告)号：US20220098094A1

公开(公告)日：2022-03-31

申请号：US17545493

申请日：2021-12-08

Applicant: CORNING INCORPORATED ,  ICFO

Inventor： Albert Carrilero ,  Prantik Mazumder ,  Valerio Pruneri

IPC: C03C15/00 ,  C30B29/60 ,  C30B29/06 ,  C30B29/18 ,  C30B11/12 ,  C01B33/12

Abstract: Provided herein are methods for forming one or more silicon nanostructures, such as silicon nanotubes, and a silica-containing glass substrate. As a result of the process used to prepare the silicon nanostructures, the silica-containing glass substrate comprises one or more nanopillars and the one or more silicon nanostructures extend from the nanopillars of the silica-containing glass substrate. The silicon nanostructures include nanotubes and optionally nanowires. A further aspect is a method for preparing silicon nanostructures on a silica-containing glass substrate. The method includes providing one or more metal nanoparticles on a silica-containing glass substrate and then performing reactive ion etching of the silica-containing glass substrate under conditions that are suitable for the formation of one or more silicon nanostructures.

公开(公告)号：US11225434B2

公开(公告)日：2022-01-18

申请号：US16891606

申请日：2020-06-03

Applicant: CORNING INCORPORATED ,  ICFO

Inventor： Albert Carrilero ,  Prantik Mazumder ,  Valerio Pruneri

IPC: C30B29/06 ,  C03C15/00 ,  C30B29/60 ,  C30B29/18 ,  C30B11/12 ,  C01B33/12

Abstract: Provided herein are methods for forming one or more silicon nanostructures, such as silicon nanotubes, and a silica-containing glass substrate. As a result of the process used to prepare the silicon nanostructures, the silica-containing glass substrate comprises one or more nanopillars and the one or more silicon nanostructures extend from the nanopillars of the silica-containing glass substrate. The silicon nanostructures include nanotubes and optionally nanowires. A further aspect is a method for preparing silicon nanostructures on a silica-containing glass substrate. The method includes providing one or more metal nanoparticles on a silica-containing glass substrate and then performing reactive ion etching of the silica-containing glass substrate under conditions that are suitable for the formation of one or more silicon nanostructures.

公开(公告)号：US11214491B2

公开(公告)日：2022-01-04

申请号：US16763479

申请日：2018-11-16

Applicant: CORNING INCORPORATED ,  INSTITUTE OF PHOTONICS SCIENCES

Inventor： Therese Francoise Arliguie ,  Theresa Chang ,  Miriam Marchena Martín-Francés ,  Prantik Mazumder ,  Valerio Pruneri ,  Frederic Christian Wagner

IPC: C01B32/194 ,  B05D1/00 ,  B05D3/12

Abstract: A method of forming a functionalized device substrate is provided that includes the steps of: forming a graphene layer on a growth substrate; applying a polyimide layer to a glass, glass-ceramic or ceramic substrate, wherein a coupling agent couples the polyimide layer to the said substrate; coupling the polyimide layer to the graphene layer on the growth substrate; and peeling the growth substrate from the graphene layer.

公开(公告)号：US20200308005A1

公开(公告)日：2020-10-01

申请号：US16763479

申请日：2018-11-16

Applicant: CORNING INCORPORATED ,  INSTITUTE OF PHOTONICS SCIENCES

Inventor： Therese Francoise Arliguie ,  Theresa Chang ,  Miriam Marchena Martín-Francés ,  Prantik Mazumder ,  Valerio Pruneri ,  Frederic Christian Wagner

IPC: C01B32/194 ,  B05D1/00 ,  B05D3/12

Abstract: A method of forming a functionalized device substrate is provided that includes the steps of: forming a graphene layer on a growth substrate; applying a polyimide layer to a glass, glass-ceramic or ceramic substrate, wherein a coupling agent couples the polyimide layer to the said substrate; coupling the polyimide layer to the graphene layer on the growth substrate; and peeling the growth substrate from the graphene layer.

公开(公告)号：US10155248B2

公开(公告)日：2018-12-18

申请号：US15044330

申请日：2016-02-16

Applicant: CORNING INCORPORATED ,  ICFO (THE INSTITUTE OF PHOTONIC SCIENCES) ,  ICREA (INSTITUTE CATALANA DE RECERCA I ESTUDIS AVANCATS)

Inventor： David Eugene Baker ,  Carme Gomez Carbonell ,  David Francis Dawson-Elli ,  Prantik Mazumder ,  Valerio Pruneri ,  Lili Tian

IPC: B05D3/00 ,  B32B33/00 ,  B05D3/02 ,  C23C14/18 ,  C23C14/58 ,  C03C17/06

Abstract: Described herein are improved dewetting methods and improved patterned articles produced using such methods. The improved methods and articles generally implement continuous ultra-thin metal-containing films or film stacks as the materials to be dewetted. For example, a method can involve the steps of providing a substrate that has a continuous ultra-thin metal-containing film or film stack disposed on a surface thereof, and dewetting at least a portion of the continuous ultra-thin metal-containing film or film stack to produce a plurality of discrete metal-containing dewetted islands on the surface of the substrate.

公开(公告)号：US09023457B2

公开(公告)日：2015-05-05

申请号：US13687227

申请日：2012-11-28

Applicant: Corning Incorporated ,  ICFO (The Institute of Photonic Sciences) ,  ICREA (Institute Catalana de Recerca I Estudis Avancats)

Inventor： Albert Carrilero ,  Prantik Mazumder ,  Johann Osmond ,  Valerio Pruneri ,  Paul Arthur Sachenik ,  Lili Tian

IPC: C23F1/02 ,  G03F7/00 ,  B08B17/06

CPC classification number: C23F1/02 ,  B08B17/065 ,  C03C15/00 ,  C03C17/06 ,  C03C2218/33 ,  C03C2218/34 ,  G03F7/00 ,  Y10S977/773 ,  Y10S977/89 ,  Y10T428/24355

Abstract: Described herein are various methods for making textured articles, textured articles that have improved fingerprint resistance, and methods of using the textured articles. The methods generally make use of masks comprising nanostructured metal-containing features to produce textured surfaces that also comprise nanostructured features. These nanostructured features in the textured surfaces can render the surfaces hydrophobic and oleophobic, thereby beneficially providing the articles with improved fingerprint resistance relative to similar or identical articles that lack the texturing.

Abstract translation: 本文描述了用于制造纹理制品，具有改善的耐指纹性的纹理制品以及使用纹理制品的方法的各种方法。 所述方法通常使用包含纳米结构的含金属特征的掩模以产生也包含纳米结构特征的纹理表面。 纹理表面中的这些纳米结构特征可以使表面疏水和疏油，从而有利地为制品提供相对于缺乏纹理的类似或相同制品的改进的指纹抗性。

公开(公告)号：US11891687B2

公开(公告)日：2024-02-06

申请号：US17038991

申请日：2020-09-30

Applicant: Corning Incorporated ,  ICFO—The Institute of Photonic Sciences ,  INSTITUCIÓ CATALANA DE RECERCA I ESTUDIS AVANÇATS

Inventor： Rinu Maniyara ,  Prantik Mazumder ,  Valerio Pruneri

IPC: C23C14/58 ,  C23C14/35 ,  C23C14/08 ,  H01B1/08

CPC classification number: C23C14/5806 ,  C23C14/086 ,  C23C14/35 ,  H01B1/08

Abstract: A method is provided for manufacturing an article comprising a transparent conductive material, wherein a transparent conductive material (e.g., indium tin oxide) is deposited onto a substrate (e.g., fused silica) by physical vapor deposition, then annealed at high temperature (i.e., at least 450° C.) in a nitrogen atmosphere. The resulting article comprises a transparent conductive material that reduces the trade-off between low resistivity (or sheet resistance) and high near infrared transmission. For example, the transparent conductive material thus obtained may possess a transmission of at least 80% at 1550 nm while having a resistivity of less than or equal to about 5×10−4 Ohm-cm and a Haacke figure of merit of at least about 40×10−4Ω−1. Also provided is a method for modulating the resistivity and/or the near infrared transmission of a transparent conductive material by annealing the transparent conductive material at a high temperature under nitrogen atmosphere.

公开(公告)号：US11807571B2

公开(公告)日：2023-11-07

申请号：US17545493

申请日：2021-12-08

Applicant: CORNING INCORPORATED ,  ICFO

Inventor： Albert Carrilero ,  Prantik Mazumder ,  Valerio Pruneri

IPC: C30B29/06 ,  C03C15/00 ,  C30B29/60 ,  C30B29/18 ,  C30B11/12 ,  C01B33/12

CPC classification number: C03C15/00 ,  C01B33/12 ,  C30B11/12 ,  C30B29/06 ,  C30B29/18 ,  C30B29/60 ,  C30B29/602 ,  C01P2004/13

Abstract: Provided herein are methods for forming one or more silicon nanostructures, such as silicon nanotubes, and a silica-containing glass substrate. As a result of the process used to prepare the silicon nanostructures, the silica-containing glass substrate comprises one or more nanopillars and the one or more silicon nanostructures extend from the nanopillars of the silica-containing glass substrate. The silicon nanostructures include nanotubes and optionally nanowires. A further aspect is a method for preparing silicon nanostructures on a silica-containing glass substrate. The method includes providing one or more metal nanoparticles on a silica-containing glass substrate and then performing reactive ion etching of the silica-containing glass substrate under conditions that are suitable for the formation of one or more silicon nanostructures.

公开(公告)号：US20230219840A1

公开(公告)日：2023-07-13

申请号：US18081790

申请日：2022-12-15

Applicant: CORNING INCORPORATED ,  ICFO- The Institute of Photonic Science ,  Institucio Catalana de Recerca i Estudis Avancats ( ICREA)

Inventor： Connie Li ,  Xinyuan Liu ,  Miriam Marchena Martín-Francés ,  Valerio Pruneri ,  Wageesha Senaratne ,  Zhen Song ,  Kamal Kishore Soni

IPC: C03C17/22 ,  C01B32/186 ,  C01B32/182

CPC classification number: C03C17/22 ,  C01B32/186 ,  C01B32/182 ,  C01B2204/02 ,  C01P2004/34 ,  C01P2004/64 ,  C01P2004/03 ,  C01P2004/62 ,  C03C2217/28 ,  C01B2204/04 ,  C01P2002/82 ,  C01P2002/85 ,  C03C2217/425 ,  C03C2218/328 ,  C03C2218/152 ,  C01B2204/32 ,  C03C2218/33 ,  C01P2004/02

Abstract: Disclosed herein are graphene coatings characterized by a porous, three-dimensional, spherical structure having a hollow core, along with methods for forming such graphene coatings on glasses, glass-ceramics, ceramics, and crystalline materials. Such coatings can be further coated with organic or inorganic layers and are useful in chemical and electronic applications.