公开(公告)号：US20050034809A1

公开(公告)日：2005-02-17

申请号：US10861240

申请日：2004-06-03

申请人： Daniel Woodruff ,  Jeffry Davis ,  Randy Harris ,  David Mattson ,  James Erickson ,  Matthew Egloff

发明人： Daniel Woodruff ,  Jeffry Davis ,  Randy Harris ,  David Mattson ,  James Erickson ,  Matthew Egloff

IPC分类号： B24B20060101 ,  C12N15/31 ,  C23F1/00 ,  H01L21/00

CPC分类号： H01L21/6719

摘要： An integrated tool and automatic calibration systems that enable wet chemical processing chambers, lift-rotate units and other hardware to be quickly interchanged without having to recalibrate the transport system or other components to the replacement items. These tools are expected to reduce the down time associated with repairing or maintaining processing chambers and/or lift-rotate units so that the tools can maintain a high throughput. Several aspects of these tools are particularly useful for applications that have stringent performance requirements because components are more likely to require maintenance more frequently, and reducing the down time associated with maintaining such components will significantly enhance the integrated tool.

摘要翻译： 集成的工具和自动校准系统，使湿化学处理室，提升 - 旋转单元和其他硬件能够快速互换，而无需重新校准运输系统或其他组件到更换项目。 预计这些工具可以减少与修理或维护处理室和/或提升旋转单元相关联的停机时间，从而使工具能够保持高通量。 这些工具的几个方面对于具有严格性能要求的应用程序特别有用，因为组件更有可能需要更频繁的维护，并且减少与维护这些组件相关联的停机时间将显着增强集成工具。

公开(公告)号：US20050050767A1

公开(公告)日：2005-03-10

申请号：US10859748

申请日：2004-06-03

申请人： Kyle Hanson ,  Kert Dolechek ,  Paul McHugh ,  Gregory Wilson ,  Jeffry Davis ,  Randy Harris

发明人： Kyle Hanson ,  Kert Dolechek ,  Paul McHugh ,  Gregory Wilson ,  Jeffry Davis ,  Randy Harris

IPC分类号： B65G49/07 ,  C12N15/31 ,  C25D5/08 ,  C25D7/12 ,  C25D17/00 ,  C25D17/06 ,  F26B5/04 ,  H01L20060101

CPC分类号： C25D17/00 ,  C25D5/08 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004 ,  C25D17/008 ,  C25D17/06 ,  H01L21/6704 ,  H01L21/67173 ,  H01L21/67196

摘要： A wet chemical processing chamber comprising a fixed unit, a detachable unit releasably coupled to the fixed unit, a seal contacting the fixed unit and the detachable unit, and a processing component disposed in the fixed unit and/or the detachable unit. The fixed unit can have a first flow system configured to direct a processing fluid through the fixed unit and a mounting fixture for fixedly attaching the fixed unit to a platform or deck of an integrated processing tool. The detachable unit can include a second flow system configured to direct the processing fluid to and/or from the first flow system of the fixed unit. The seal has an orifice through which processing fluid can flow between the first and second flow systems, and the processing component can impart a property to the processing fluid for processing a surface on a microfeature workpiece having submicron microfeatures.

摘要翻译： 一种湿化学处理室，包括固定单元，可释放地联接到固定单元的可拆卸单元，接触固定单元和可拆卸单元的密封件，以及设置在固定单元和/或可拆卸单元中的处理部件。 固定单元可以具有构造成引导处理流体通过固定单元的第一流动系统和用于将固定单元固定地附接到集成处理工具的平台或甲板的安装夹具。 可拆卸单元可以包括构造成将处理流体引导到和/或从固定单元的第一流动系统引导的第二流动系统。 密封件具有孔口，处理流体可以通过该孔口在第一和第二流动系统之间流动，并且处理部件可以赋予处理流体以处理具有亚微米特征的微特征工件上的表面的性质。

公开(公告)号：US20060009047A1

公开(公告)日：2006-01-12

申请号：US11056704

申请日：2005-02-11

申请人： Paul Wirth ,  Jeffry Davis ,  Randy Harris

发明人： Paul Wirth ,  Jeffry Davis ,  Randy Harris

IPC分类号： H01L21/00

CPC分类号： H01L21/67173 ,  H01L21/67098 ,  H01L21/67196 ,  H01L21/67775

摘要： A modular apparatus for thermally processing a microelectronic workpiece is provided. The modular apparatus comprises a mounting module having a rotatable carousel assembly configured to support at least one workpiece. A driver is coupled to the carousel assembly and rotates the carousel assembly, moving the workpiece between a loading station, a heating station and a cooling station. The thermal processing modular apparatus has a front docking unit for removeably connecting it to a load/unload module and a rear docking unit for removeably connecting it to a wet chemical processing tool, or another tool for otherwise processing a workpiece. A transport system (i.e., robot) services the modular tool units that can be automatically calibrated to work with individual processing components of the tool units.

摘要翻译： 提供了一种用于热处理微电子工件的模块化装置。 模块化装置包括安装模块，该安装模块具有构造成支撑至少一个工件的可旋转转盘组件。 驱动器联接到转盘组件并旋转转盘组件，在加载站，加热站和冷却站之间移动工件。 热处理模块化装置具有用于可移除地将其连接到装载/卸载模块的前对接单元和用于将其可移除地连接到湿式化学处理工具的后对接单元，或用于另外处理工件的另一工具。 运输系统（即，机器人）为可自动校准的模块化工具单元提供服务，以与工具单元的各个处理部件一起工作。

公开(公告)号：US20050061438A1

公开(公告)日：2005-03-24

申请号：US10860593

申请日：2004-06-03

申请人： Jeffry Davis ,  Randy Harris

发明人： Jeffry Davis ,  Randy Harris

IPC分类号： B01D63/00 ,  C23F1/00 ,  C25D17/00 ,  G01M3/04

CPC分类号： H01L21/6723 ,  B01D61/425 ,  C25D17/00 ,  H01L21/67005 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/68707

摘要： An integrated tool that enables wet chemical processing chambers, lift-rotate units and other hardware to be quickly interchanged without having to recalibrate the transport system or other components to the replacement items. These tools are expected to reduce the down time associated with repairing or maintaining processing chambers and/or lift-rotate units so that the tools can maintain a high throughput. Several aspects of these tools are particularly useful for applications that have stringent performance requirements because components are more likely to require maintenance more frequently, and reducing the down time associated with maintaining such components will significantly enhance the integrated tool.

摘要翻译： 集成的工具，使湿化学处理室，提升 - 旋转单元和其他硬件能够快速互换，而无需重新校准运输系统或其他组件到更换项目。 预计这些工具可以减少与修理或维护处理室和/或提升旋转单元相关联的停机时间，从而使工具能够保持高通量。 这些工具的几个方面对于具有严格性能要求的应用程序特别有用，因为组件更有可能需要更频繁的维护，并且减少与维护这些组件相关联的停机时间将显着增强集成工具。

公开(公告)号：US06575689B2

公开(公告)日：2003-06-10

申请号：US10159879

申请日：2002-05-29

申请人： Randy Harris ,  David Peterson ,  Jeffry Davis

发明人： Randy Harris ,  David Peterson ,  Jeffry Davis

IPC分类号： B65B2102

CPC分类号： H01L21/67057 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/138

摘要： A process system for processing semiconductor wafers includes a stocker module, and immersion module, and a process module. A process robot moves on a lateral rail to transfer wavers between the modules. The immersion module is separated from the other modules, to avoid transmission of vibration. Immersion tanks are radially positioned within the immersion module, to provide a compact design. An immersion robot moves batches of wafers on an end effector between the immersion tanks. The end effector may be detachable from the immersion robot, so that the immersion robot can move a second batch of wafers, while the first batch of wafers undergoes an immersion process.

公开(公告)号：US20070125404A1

公开(公告)日：2007-06-07

申请号：US11294921

申请日：2005-12-05

申请人： Jeffry Davis ,  Randy Harris

发明人： Jeffry Davis ,  Randy Harris

IPC分类号： B08B7/00 ,  B08B3/00

CPC分类号： B08B9/0826 ,  H01L21/67028 ,  H01L21/67379 ,  H01L21/67766 ,  H01L21/67775 ,  H01L21/68707 ,  Y10S414/137 ,  Y10S414/14

摘要： The invention provides an apparatus for cleaning and drying a container for semiconductor workpieces. The apparatus comprises a load port with a fixture that receives a dirty container and delivers it to a deck assembly with a carrier that removably receives the container for further handling. While the container is received by the carrier, a robot with a first end effector removes the container door and places it on a portion of the carrier. The robot includes a second end effector that engages the carrier and elevates the carrier and container for insertion into a process chamber. The process chamber includes a rotor with at least one receptacle wherein the rotor is rotated to create both high pressure and low pressure regions. Once the container and carrier are loaded into the rotor, the rotor is rotated and means for cleaning injects a processing fluid onto the container and carrier. After a rinse stage and while the rotor is rotating, the means for drying delivers air across the container and carrier. Upon completion of the drying stage, the robot removes both the container and the carrier from the process chamber and reassembles the door to the container such that container can be returned to use.

摘要翻译： 本发明提供一种用于清洁和干燥半导体工件的容器的装置。 该装置包括具有固定装置的装载端口，该装置接收脏污的容器并将其传送到具有可移除地容纳容器以进一步处理的载体的甲板组件。 当容器被承载件容纳时，具有第一端部执行器的机器人移除容器门并将其放置在承载件的一部分上。 机器人包括第二端部执行器，其接合载体并提升载体和容器以插入处理室。 处理室包括具有至少一个容器的转子，其中转子旋转以产生高压和低压区域。 一旦容器和载体被装载到转子中，则转子旋转，并且用于清洁的装置将处理流体注入到容器和载体上。 在冲洗阶段之后，当转子旋转时，干燥装置将空气穿过容器和载体。 干燥阶段完成后，机器人从处理室中移除容器和载体，并将门重新组装到容器上，使得容器可以返回使用。

公开(公告)号：US20050063798A1

公开(公告)日：2005-03-24

申请号：US10860592

申请日：2004-06-03

申请人： Jeffry Davis ,  Randy Harris

发明人： Jeffry Davis ,  Randy Harris

IPC分类号： B65G1/00

CPC分类号： B65G1/00

摘要： Interchangeable workpiece handling apparatuses and associated tools for processing microfeature workpieces are disclosed. In one embodiment, an apparatus includes a device support having a first alignment surface at an alignment plane. A processing chamber is received in an aperture at the alignment plane. A workpiece handling device is positioned proximate to the processing chamber and includes a workpiece support, a drive unit operatively coupled to the workpiece support to move the workpiece support along a generally linear motion axis, and a mounting portion coupled to the workpiece support and having a second alignment surface removably mated with the first alignment surface. In a particular embodiment, the workpiece handling device is supported relative to the device support only at or above the alignment plane. Accordingly, the workpiece handling device can be easily removed from the device support and need not impede access to components beneath the alignment plane.

摘要翻译： 公开了可互换的工件处理装置和用于加工微型工件的相关工具。 在一个实施例中，一种装置包括具有在对准平面处的第一对准表面的装置支撑件。 处理室被容纳在对准平面的孔中。 工件处理装置位于处理室附近，并且包括工件支撑件，可操作地联接到工件支撑件的驱动单元，以沿着大致线性的运动轴线移动工件支撑件，以及联接到工件支撑件的安装部分， 第二对准表面可拆卸地与第一对准表面配合。 在特定实施例中，工件处理装置仅在对准平面上或上方支撑相对于装置支撑。 因此，工件处理装置可以容易地从装置支撑件移除，并且不需要阻碍对准对准平面下方的部件。

公开(公告)号：US06439824B1

公开(公告)日：2002-08-27

申请号：US09611507

申请日：2000-07-07

申请人： Randy Harris ,  David Peterson ,  Jeffry Davis

发明人： Randy Harris ,  David Peterson ,  Jeffry Davis

IPC分类号： B65B2102

CPC分类号： H01L21/67057 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/138

摘要： A process system for processing semiconductor wafers includes a stocker module, and immersion module, and a process module. A process robot moves on a lateral rail to transfer wavers between the modules. The immersion module is separated from the other modules, to avoid transmission of vibration. Immersion tanks are radially positioned within the immersion module, to provide a compact design. An immersion robot moves batches of wafers on an end effector between the immersion tanks. The end effector may be detachable from the immersion robot, so that the immersion robot can move a second batch of wafers, while the first batch of wafers undergoes an immersion process.

摘要翻译： 用于处理半导体晶片的处理系统包括储料器模块和浸没模块以及处理模块。 过程机器人在横向轨道上移动以在模块之间传递波浪。 浸没模块与其他模块分离，以避免振动传播。 沉浸池径向定位在浸没模块内，以提供紧凑的设计。 浸没式机器人在浸没池之间的端部执行器上移动批次的晶片。 末端执行器可以从浸没机器人脱离，使得浸没式机器人可以移动第二批晶片，同时第一批晶片经历浸没过程。

公开(公告)号：US20060105580A1

公开(公告)日：2006-05-18

申请号：US10987049

申请日：2004-11-12

申请人： Paul Wirth ,  Jeffry Davis

发明人： Paul Wirth ,  Jeffry Davis

IPC分类号： H01L21/31

CPC分类号： H01L21/67109 ,  H01L21/67748 ,  Y10S438/907 ,  Y10S438/908

摘要： An apparatus for thermally processing a microelectronic workpiece is provided. The apparatus comprises a rotatable carousel assembly configured to support at least one workpiece. A driver is coupled to the carousel assembly and rotates the carousel assembly, moving the workpiece between a loading station, a heating station and a cooling station. The loading, heating and cooling stations are radially positioned and approximately equally spaced about a center axis of the carousel assembly. The heating station includes a heating element and an actuator for moving the heating element into thermal engagement with the workpiece in the heating station. The cooling station includes a cooling element and an actuator for moving the cooling element into thermal engagement with the workpiece in the cooling station. A process fluid distribution manifold for delivering process fluid to the workpieces at each station extends through a central opening in the carousel assembly. A non-oxidizing gas is delivered through the manifold to create an oxygen free environment during the thermal process.

公开(公告)号：US06572320B2

公开(公告)日：2003-06-03

申请号：US09907523

申请日：2001-07-16

申请人： Jeffry Davis

发明人： Jeffry Davis

IPC分类号： B25J1508

CPC分类号： H01L21/67769 ,  H01L21/67754 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S414/141

摘要： An automated workpiece processing system has a transfer robot including an end effector having arms which move linearly towards each other to pick up a workpiece. Each arm has two workpiece contactors for engaging the edges of the workpiece. The contactors are positioned equally distant from the workpiece edges. The arms are moved linearly together, while they remain parallel to each other. The contactors contact the edges of the workpiece without causing sliding or displacement of the workpiece. Transfer robot movement or pre-positioning of the end effector is minimized, expediting handling of workpieces within the automated system.