CURABLE RESIN COMPOSITION, PRODUCTION METHOD OF IMAGE SENSOR CHIP USING THE SAME, AND IMAGE SENSOR CHIP
    1.
    发明申请
    CURABLE RESIN COMPOSITION, PRODUCTION METHOD OF IMAGE SENSOR CHIP USING THE SAME, AND IMAGE SENSOR CHIP 有权
    可固化树脂组合物,使用其的图像传感器芯片的生产方法和图像传感器芯片

    公开(公告)号:US20150259547A1

    公开(公告)日:2015-09-17

    申请号:US14725823

    申请日:2015-05-29

    Abstract: There is provided a curable resin composition which is capable of being coated so as to have a film thickness of 20 μm or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, and the infrared ray cut filter having a dye-containing layer having a film thickness of 20 μm or more formed from the curable resin composition, and a production method of image sensor chip comprising a step of coating the curable resin composition on a glass substrate to form a dye-containing layer, and a step of adhering the glass plate having the dye-containing layer formed on a solid-state imaging device substrate.

    Abstract translation: 提供一种固化性树脂组合物,其能够被涂覆以具有20μm以上的膜厚,并且含有在600〜850nm的波长范围内具有最大吸收波长的染料,并且红外线截止滤光片 具有由固化性树脂组合物形成的膜厚度为20μm以上的含有染料的层,以及图像传感器芯片的制造方法,其包括将固化性树脂组合物涂布在玻璃基板上以形成含染料层 以及粘附具有形成在固态成像器件基板上的含有染料的层的玻璃板的步骤。

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