METHOD OF MANUFACTURING PHOTOELECTRIC COMPOSITE SUBSTRATE
    2.
    发明申请
    METHOD OF MANUFACTURING PHOTOELECTRIC COMPOSITE SUBSTRATE 有权
    制作光电复合基板的方法

    公开(公告)号:US20140170784A1

    公开(公告)日:2014-06-19

    申请号:US14029838

    申请日:2013-09-18

    CPC classification number: G02B6/4245 G02B6/4214 G02B6/4239 G02B6/43

    Abstract: A method of manufacturing a photoelectric composite substrate, includes: aligning and fixing an optical element having a solder terminal to an optical waveguide for forming a path of an optical signal on a printed circuit board; mounting the optical waveguide, to which the optical element is fixed, on the printed circuit board; and welding the solder terminal to an electrode of a package installed on the printed circuit board or an electrode of the printed circuit board.

    Abstract translation: 一种制造光电复合基板的方法,包括:将具有焊接端子的光学元件对准和固定到用于在印刷电路板上形成光信号路径的光波导; 将光学元件固定到其上的光波导安装在印刷电路板上; 并将焊接端子焊接到安装在印刷电路板上的封装的电极或印刷电路板的电极上。

    CIRCUIT BOARD AND ELECTRONIC DEVICE
    3.
    发明申请
    CIRCUIT BOARD AND ELECTRONIC DEVICE 审中-公开
    电路板和电子设备

    公开(公告)号:US20150116962A1

    公开(公告)日:2015-04-30

    申请号:US14587556

    申请日:2014-12-31

    CPC classification number: H05K1/181 H05K1/18 H05K2201/099

    Abstract: An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.

    Abstract translation: 一种电子设备包括一个包括多个端子的电子部件和一个安装有电子部件的电路板。 电路板包括板体,布置在板体上的多个电极焊盘,每个电极焊盘通过焊料连接到每个端子;第一阻焊剂,形成在电路板主体上,并具有多个第一开口 每个所述第一开口容纳每个所述电极焊盘;以及第二阻焊剂,形成在所述第一阻焊层上,并且具有多个第二开口,每个所述第二开口大于每个所述第一开口, 第一个开口。

    METHOD AND DEVICE FOR MANUFACTURING OPTICAL TRANSMISSION DEVICE, AND OPTICAL TRANSMISSION DEVICE
    5.
    发明申请
    METHOD AND DEVICE FOR MANUFACTURING OPTICAL TRANSMISSION DEVICE, AND OPTICAL TRANSMISSION DEVICE 有权
    用于制造光传输装置的方法和装置以及光传输装置

    公开(公告)号:US20140270631A1

    公开(公告)日:2014-09-18

    申请号:US14136218

    申请日:2013-12-20

    Abstract: A method for manufacturing an optical transmission device, includes: arranging a plurality of optical waveguides including waveguide mirrors, a transmission-side optical module and a reception-side optical module on one side of a substrate; photographing, with a photographic device, at least one waveguide mirror, and the transmission-side optical module or the reception-side optical module corresponding to the waveguide mirror, from another side of the substrate via an opening formed in the substrate; detecting optical-axis centers of the transmission-side optical module or optical-axis centers of the reception-side optical module, and central positions of reflective surfaces of the waveguide mirrors corresponding to the detected optical-axis centers, from a result of the photographing; and aligning and fixing a position relationship between the optical waveguides and the transmission-side optical module or the reception-side optical module based on a result of the detecting.

    Abstract translation: 一种光传输装置的制造方法,其特征在于,包括:在基板的一侧配置多个波导管,包括波导反射镜,透射侧光学模块和接收侧光学模块; 通过形成在基板中的开口从基板的另一侧,利用照相装置拍摄至少一个波导反射镜和对应于波导反射镜的发送侧光学模块或接收侧光学模块; 根据拍摄结果,检测发送侧光学模块的光轴中心或接收侧光学模块的光轴中心以及与所检测的光轴中心对应的波导反射镜的反射表面的中心位置 ; 并且基于检测结果对准和固定光波导与发射侧光学模块或接收侧光学模块之间的位置关系。

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