公开(公告)号：US20160118358A1

公开(公告)日：2016-04-28

申请号：US14986925

申请日：2016-01-04

Applicant: GLOBALFOUNDRIES INC.

Inventor： Bing Dang ,  Michael A. Gaynes ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: H01L23/00

CPC classification number: H01L24/11 ,  C25D5/022 ,  C25D7/123 ,  H01L21/02107 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/11001 ,  H01L2224/11002 ,  H01L2224/11312 ,  H01L2224/1141 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1162 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/3436 ,  H05K2201/10734 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01026 ,  H01L2924/00

Abstract: Solder bumps are provided on round wafers through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned mask layer. Solder is injected over the pillars or BLM, filling the channels. Molten solder can be injected in cavities formed in round wafers without leakage using a carrier assembly that accommodates wafers that have been previously subjected to mask layer deposition and patterning. One such carrier assembly includes an elastomeric body portion having a round recess, the walls of the recess forming a tight seal with the round wafer. Other carrier assemblies employ adhesives applied around the peripheral edges of the wafers to ensure sealing between the carrier assemblies and wafers.

Abstract translation: 通过使用注射成型焊料在圆形晶片上提供焊料凸块。 在图案化掩模层的通道内的I / O焊盘上形成铜柱或极限极限冶金。 焊料注入柱子或BLM，填充通道。 可以使用容纳预先经过掩模层沉积和图案化的晶片的载体组件将熔融的焊料注入到圆形晶片形成的空腔中而不发生泄漏。 一个这样的载体组件包括具有圆形凹部的弹性体主体部分，凹部的壁与圆形晶片形成紧密密封。 其他载体组件使用施加在晶片的周边边缘周围的粘合剂，以确保载体组件和晶片之间的密封。

公开(公告)号：US10147694B2

公开(公告)日：2018-12-04

申请号：US14986925

申请日：2016-01-04

Applicant: GLOBALFOUNDRIES INC.

Inventor： Bing Dang ,  Michael A. Gaynes ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: H01L21/02 ,  H01L23/00 ,  C25D5/02 ,  C25D7/12 ,  H05K3/34

Abstract: Solder bumps are provided on round wafers through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned mask layer. Solder is injected over the pillars or BLM, filling the channels. Molten solder can be injected in cavities formed in round wafers without leakage using a carrier assembly that accommodates wafers that have been previously subjected to mask layer deposition and patterning. One such carrier assembly includes an elastomeric body portion having a round recess, the walls of the recess forming a tight seal with the round wafer. Other carrier assemblies employ adhesives applied around the peripheral edges of the wafers to ensure sealing between the carrier assemblies and wafers.

公开(公告)号：US09295166B2

公开(公告)日：2016-03-22

申请号：US14663754

申请日：2015-03-20

Applicant: GLOBALFOUNDRIES INC.

Inventor： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: H01L21/00 ,  H05K3/34 ,  H01L21/48 ,  B23K1/00 ,  B23K3/06 ,  H01L23/498 ,  H01L21/56 ,  H05K13/04 ,  H01L23/00

CPC classification number: H05K3/3436 ,  B23K1/0016 ,  B23K3/0638 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/11011 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81065 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/14 ,  H01L2924/20104 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/35 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2203/043 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly.