公开(公告)号：US20070201204A1

公开(公告)日：2007-08-30

申请号：US11707350

申请日：2007-02-16

申请人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

摘要翻译： 液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。 每个电子服务器包括一个或多个发热装置。 集成到每个电子服务器上是一种基于液体的冷却系统。 每个基于液体的冷却系统包括服务器泵和通过流体管线耦合在一起的一个或多个微通道冷板（MCP）。 用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。 排料板通过热界面材料连接到底盘冷板。 在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

公开(公告)号：US07599184B2

公开(公告)日：2009-10-06

申请号：US11707350

申请日：2007-02-16

申请人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

摘要翻译： 液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。 每个电子服务器包括一个或多个发热装置。 集成到每个电子服务器上是一种基于液体的冷却系统。 每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。 用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。 排料板通过热界面材料连接到底盘冷板。 在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

公开(公告)号：US20070201210A1

公开(公告)日：2007-08-30

申请号：US11707332

申请日：2007-02-16

申请人： Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

摘要翻译： 安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。 为了确保良好的热接触，在两个热交换器，排料盘和底盘冷板之间施加压力。 用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。 安装机构包括互锁机构，其防止施加的力传递到电子服务器的其余部分。 在不隔离该力的情况下，该力被施加到电子服务器和/或机架机架，可能断开电子服务器和机架之间的电连接，以及向电子服务器和机架机架提供机械应力。 安装机构还耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。 这是一个故障安全程序，因为不需要单独的过程来接合电子服务器冷却回路。

公开(公告)号：US07539020B2

公开(公告)日：2009-05-26

申请号：US11707332

申请日：2007-02-16

申请人： Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

发明人： Norman Chow ,  Paul Tsao ,  Douglas E. Werner ,  Mark McMaster ,  Girish Upadhya ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

IPC分类号： H05K7/16

CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

摘要翻译： 安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。 为了确保良好的热接触，在两个热交换器，排料盘和底盘冷板之间施加压力。 用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。 安装机构包括互锁机构，其防止施加的力传递到电子服务器的其余部分。 在不隔离该力的情况下，该力被施加到电子服务器和/或机架机架，可能断开电子服务器和机架之间的电连接，以及向电子服务器和机架机架提供机械应力。 安装机构还耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。 这是一个故障安全程序，因为不需要单独的过程来接合电子服务器冷却回路。

公开(公告)号：US07000684B2

公开(公告)日：2006-02-21

申请号：US10680584

申请日：2003-10-06

申请人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin ,  Mark McMaster ,  James Lovette

发明人： Thomas W. Kenny ,  Mark Munch ,  Peng Zhou ,  James Gill Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin ,  Mark McMaster ,  James Lovette

IPC分类号： F28F7/00

CPC分类号： F04B17/00 ,  F04B19/006 ,  F28D15/00 ,  F28D15/0266 ,  F28D21/0015 ,  F28D2021/0029 ,  F28F3/02 ,  F28F3/086 ,  F28F3/12 ,  F28F13/06 ,  F28F13/185 ,  F28F2210/10 ,  F28F2245/04 ,  F28F2260/02 ,  G06Q20/20 ,  H01L23/473 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

摘要翻译： 热交换器及其制造方法包括用于冷却热源的界面层。 界面层耦合到热源并被配置成使流体从中流过。 热交换器还包括耦合到界面层的歧管层。 歧管层包括至少一个第一端口，其耦合到第一组个体化的孔，其将流体通过第一组。 歧管层包括耦合到第二组个体化孔的至少一个第二端口，其将流体通过第二组。 第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。 优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

公开(公告)号：US20090046423A1

公开(公告)日：2009-02-19

申请号：US12221961

申请日：2008-08-07

申请人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

发明人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

摘要翻译： 电子外壳的后面板包括一个或多个热交换器。 后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。 可以通过在诸如标准门的铰链上使门打开来提供这种接近。 在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。 在一些实施例中，每个部分像标准门一样旋转打开。 在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。 在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。 在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

公开(公告)号：US07104312B2

公开(公告)日：2006-09-12

申请号：US10698304

申请日：2003-10-30

申请人： Kenneth Goodson ,  Thomas Kenny ,  Peng Zhou ,  Girish Upadhya ,  Mark Munch ,  Mark McMaster ,  James Horn

发明人： Kenneth Goodson ,  Thomas Kenny ,  Peng Zhou ,  Girish Upadhya ,  Mark Munch ,  Mark McMaster ,  James Horn

IPC分类号： F28F7/00

CPC分类号： F28F3/048 ,  F04B19/006 ,  F28D15/00 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.

摘要翻译： 一种控制与热交换器的热交换表面接触的热源的温度的方法，其中所述热交换表面沿着平面基本上对齐。 该方法包括将第一温度流体引导到热交换表面，其中第一温度流体沿着热交换表面与热源进行热交换。 该方法包括从热交换表面引导第二温度流体，其中流体被引导以最小化沿着热源的温度差。 通过优化和控制热交换器中的流体和热电阻来最小化温差。 对流体的阻力受传热特征，多个泵，固定和可变阀以及流体路径中的流量阻抗元件，流体的压力和流量控制等因素的尺寸，体积和表面积的影响。

公开(公告)号：US20050211418A1

公开(公告)日：2005-09-29

申请号：US10882132

申请日：2004-06-29

申请人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin ,  Mark McMaster ,  James Lovette

发明人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin ,  Mark McMaster ,  James Lovette

IPC分类号： F04B17/00 ,  F04B19/00 ,  F28D15/00 ,  F28D15/02 ,  F28F3/02 ,  F28F3/08 ,  F28F3/12 ,  F28F13/18 ,  G06Q20/00 ,  H01L23/473 ,  H04L29/06 ,  F28F7/00

CPC分类号： H01L23/4735 ,  F04B17/00 ,  F04B19/006 ,  F28D15/00 ,  F28D15/0266 ,  F28D21/0015 ,  F28D2021/0029 ,  F28F3/02 ,  F28F3/086 ,  F28F3/12 ,  F28F7/02 ,  F28F13/06 ,  F28F13/185 ,  F28F2210/10 ,  F28F2260/02 ,  G06F1/20 ,  G06Q20/20 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

摘要翻译： 热交换器及其制造方法包括用于冷却热源的界面层。 界面层耦合到热源并被配置成使流体从中流过。 热交换器还包括耦合到界面层的歧管层。 歧管层包括至少一个第一端口，其耦合到第一组个体化的孔，其将流体通过第一组。 歧管层包括耦合到第二组个体化孔的至少一个第二端口，其将流体通过第二组。 第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。 优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

公开(公告)号：US07188662B2

公开(公告)日：2007-03-13

申请号：US11049313

申请日：2005-02-01

申请人： Richard Grant Brewer ,  Girish Upadhya ,  Peng Zhou ,  Mark McMaster ,  Paul Tsao

发明人： Richard Grant Brewer ,  Girish Upadhya ,  Peng Zhou ,  Mark McMaster ,  Paul Tsao

IPC分类号： F28D7/02

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.

摘要翻译： 热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。 热交换器包括热量从热源传递到流体的界面层。 歧管层耦合到界面层。 歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。 歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径，用于从界面层移除流体。 优选地，热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。 上层可以包括多个突出特征和多孔结构中的至少一个。 优选地，多孔结构沿着界面层设置。

公开(公告)号：US07746634B2

公开(公告)日：2010-06-29

申请号：US12221961

申请日：2008-08-07

申请人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

发明人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

摘要翻译： 电子外壳的后面板包括一个或多个热交换器。 后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。 可以通过在诸如标准门的铰链上使门打开来提供这种接近。 在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。 在一些实施例中，每个部分像标准门一样旋转打开。 在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。 在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。 在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。