PHYSICAL MEMORY REGION BACKUP OF A VOLATILE MEMORY TO A NON-VOLATILE MEMORY

    公开(公告)号:US20190026026A1

    公开(公告)日:2019-01-24

    申请号:US15752250

    申请日:2015-08-28

    Abstract: In one example in accordance with the present disclosure, a system for backup of a physical memory region of volatile memory. The system may include: a non-volatile memory, a volatile memory, at least one processor to: execute an application that indicates a virtual memory region stored in the volatile memory, wherein the virtual memory region is associated with an application, determine a corresponding physical memory region of the volatile memory for backup based on the indicated virtual memory region, and at least one memory controller to: receive a backup signal for the physical memory region of the volatile memory, and responsive to receiving the backup signal, backup up the physical memory region of the volatile memory to a memory region of the non-volatile memory.

    THERMAL MANAGEMENT ASSEMBLY
    3.
    发明申请
    THERMAL MANAGEMENT ASSEMBLY 审中-公开
    热管理组件

    公开(公告)号:US20160357233A1

    公开(公告)日:2016-12-08

    申请号:US15120511

    申请日:2014-04-30

    Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

    Abstract translation: 根据一个示例的热管理组件可以包括第一热管理构件,其包括连续的第一主区域,不连续的第一连接区域和第一顶侧面。 热管理组件还可以包括第二热管理构件,其包括第二主区域,第二连接区域和第二顶侧。 第二主区域和第二连接区域是连续的。 热管理组件还可以包括连接构件,用于经由第一连接区域和第二连接区域将第一热管理构件和第二热管理构件连接到存储装置。 当第一热管理构件和第二热管理构件联接到存储装置时,第一顶侧和第二顶侧基本上与存储装置的顶侧在水平方向平齐。

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