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    PARTICLE DETECTION VIA RESONANT FREQUENCIES
    1.
    发明公开
    PARTICLE DETECTION VIA RESONANT FREQUENCIES 审中-公开

    公开(公告)号：US20230280262A1

    公开(公告)日：2023-09-07

    申请号：US18023718

    申请日：2020-09-09

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Viktor Shkolnikov ,  Joshua M. Yu ,  Matthew David Smith ,  Roberto A. Pugliese

    IPC: G01N15/14

    CPC classification number: G01N15/1484 ,  G01N15/1429

    Abstract: In one example in accordance with the present disclosure, a particle detection system is described. The particle detection system includes a microfluidic channel through which fluid is to flow. The fluid includes particles. The particle detection system also includes a sensing circuit to output a resonant frequency. The sensing circuit includes a pair of electrodes disposed within the microfluidic channel. Contents of a volume between the pair of electrodes changes a capacitance between the pair of electrodes. A change in the capacitance changes the resonant frequency output by the sensing circuit. The particle detection system also includes a controller to determine the contents of the volume based on the resonant frequency.

    CASSETTES WITH OFFSET VIAS
    3.
    发明申请
    CASSETTES WITH OFFSET VIAS 审中-公开

    公开(公告)号：US20200316592A1

    公开(公告)日：2020-10-08

    申请号：US16472694

    申请日：2017-02-03

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Gary G. Lutnesky ,  Matthew David Smith ,  Dennis R. Esterberg

    IPC: B01L3/00 ,  H01R12/71 ,  H05K1/11 ,  B01L3/02

    Abstract: A cassette may include a substrate, a die coupled to the substrate, and an electrical interconnection pad layout formed on a first side of the substrate. The electrical interconnection pad layout may include a first row of interconnect pads including at least one interconnect pad. Each interconnect pad of the first row of interconnect pads may be electrically coupled to one of a first set of vias. The electrical interconnection pad layout may also include a second row of interconnection pads including at least one interconnect pad. Each interconnect pad of the second row of interconnect pads being electrically coupled to one of a second set of vias. The second set of vias electrically coupled to the second row of interconnect pads are offset relative to an alignment of the interconnect pads of the first and second rows.

    Microfluidics sensing system
    7.
    发明授权
    Microfluidics sensing system 有权

    公开(公告)号：US10702867B2

    公开(公告)日：2020-07-07

    申请号：US15521230

    申请日：2015-06-29

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Joshua M. Yu ,  Matthew David Smith ,  Shameed Sait M A ,  Manish Giri

    IPC: B01L3/00 ,  G01N35/00 ,  G01N33/487 ,  G16H10/40

    Abstract: Example implementations relate to a microfluidics sensing system. For example, a microfluidics sensing system may include a portable computing device to execute a microfluidics application, a microfluidic chip coupled to the portable computing device, the microfluidic chip including a microfluidic pumping and sensing region to perform a test on a biologic sample, and a printed circuit board (PCB) on a microfluidic reader to instruct the microfluidic pumping and sensing region to perform the test based on a command received from the microfluidics application.

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