公开(公告)号：US20050040524A1

公开(公告)日：2005-02-24

申请号：US10909029

申请日：2004-07-30

申请人： Han-Ping Pu ,  Chang-Fu Lin ,  Chien-Ping Huang

发明人： Han-Ping Pu ,  Chang-Fu Lin ,  Chien-Ping Huang

IPC分类号： H01L23/498 ,  H01L23/48

CPC分类号： H01L23/49816 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15311

摘要： A chip carrier for a semiconductor chip is provided. A plurality of solder pads for bump soldering are formed on a chip mounting surface of the chip carrier, to allow a flip chip to be mounted and electrically connected to the chip carrier. A solder mask layer is formed on the chip carrier, wherein a plurality of openings are provided in the solder mask layer to expose the solder pads, and an outwardly opening extended portion is formed respectively from the openings corresponding to the solder pads having a relatively narrower pitch therebetween, so as to prevent formation of voids during an underfill process for filing a gap between the flip chip and the chip carrier.

摘要翻译： 提供了一种用于半导体芯片的芯片载体。 在芯片载体的芯片安装表面上形成用于凸块焊接的多个焊盘，以允许倒装芯片安装并电连接到芯片载体。 在芯片载体上形成焊料掩模层，其中在焊料掩模层中设置多个开口以露出焊盘，并且从对应于具有相对较窄的焊盘的开口分别形成向外开口的延伸部分 间隔，以防止在底部填充过程中形成空隙，以便在倒装芯片和芯片载体之间填充间隙。

公开(公告)号：US07057276B2

公开(公告)日：2006-06-06

申请号：US10690921

申请日：2003-10-21

申请人： Chang-Fu Lin ,  Han-Ping Pu ,  Chien-Ping Huang

发明人： Chang-Fu Lin ,  Han-Ping Pu ,  Chien-Ping Huang

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L23/367 ,  H01L23/3672 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2224/05599

摘要： A semiconductor package with a heat sink is provided. At least one chip and a heat sink attached to the chip are mounted on a substrate. At least one slot is formed through at least one corner of the heat sink at a position attached to the substrate. An adhesive material is applied between the heat sink and substrate and over filled in the slot with an overflow of the adhesive material out of the slot. The adhesive material over filled in the slot provides an anchoring effect and increases its contact area with the heat sink to thereby firmly secure the heat sink on the substrate. Further, the slot formed at the corner of the heat sink can alleviate thermal stresses accumulated at the corner of the heat sink and thereby prevent delamination between the heat sink and the substrate.

摘要翻译： 提供了具有散热器的半导体封装。 连接到芯片的至少一个芯片和散热片安装在基板上。 在连接到基板的位置处，通过散热器的至少一个角部形成至少一个槽。 将粘合剂材料施加在散热器和衬底之间并且在填充在槽中并且粘合剂材料溢出出槽之外。 填充在槽中的粘合剂材料提供锚定效果并增加其与散热器的接触面积，从而将散热器牢固地固定在基板上。 此外，形成在散热器角落处的槽可以减轻积聚在散热器拐角处的热应力，从而防止散热器和基板之间的分层。

公开(公告)号：US06980438B2

公开(公告)日：2005-12-27

申请号：US10759863

申请日：2004-01-16

申请人： Chien-Ping Huang ,  Han-Ping Pu ,  Chin-Te Chen ,  Chang-Fu Lin

发明人： Chien-Ping Huang ,  Han-Ping Pu ,  Chin-Te Chen ,  Chang-Fu Lin

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/055 ,  H01L23/10 ,  H01L23/367 ,  H01L23/467 ,  H01L25/065 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/055 ,  H01L23/10 ,  H01L23/3672 ,  H01L23/3675 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor package with a heat dissipating structure includes a substrate, a chip and a heat dissipating structure. The chip is mounted on and electrically connected to the substrate. The heat dissipating structure includes a first heat sink having at least one positioning portion, and at least one second heat sink having at least one second positioning portion and at least one hollow portion. The second heat sink is mounted on the substrate, and the first positioning portion of the first heat sink is attached to the second positioning portion of the second heat sink, allowing the chip to be accommodated in a space defined by the first heat sink, the hollow portion of the second heat sink and the substrate. This semiconductor package has good heat dissipating efficiency and is cost-effective to fabricate.

公开(公告)号：US20050036291A1

公开(公告)日：2005-02-17

申请号：US10759863

申请日：2004-01-16

申请人： Chien-Ping Huang ,  Han-Ping Pu ,  Chin-Te Chen ,  Chang-Fu Lin

发明人： Chien-Ping Huang ,  Han-Ping Pu ,  Chin-Te Chen ,  Chang-Fu Lin

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/055 ,  H01L23/10 ,  H01L23/367 ,  H01L23/467 ,  H01L25/065 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/055 ,  H01L23/10 ,  H01L23/3672 ,  H01L23/3675 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor package with a heat dissipating structure includes a substrate, a chip and a heat dissipating structure. The chip is mounted on and electrically connected to the substrate. The heat dissipating structure includes a first heat sink having at least one positioning portion, and at least one second heat sink having at least one second positioning portion and at least one hollow portion. The second heat sink is mounted on the substrate, and the first positioning portion of the first heat sink is attached to the second positioning portion of the second heat sink, allowing the chip to be accommodated in a space defined by the first heat sink, the hollow portion of the second heat sink and the substrate. This semiconductor package has good heat dissipating efficiency and is cost-effective to fabricate.

摘要翻译： 具有散热结构的半导体封装包括基板，芯片和散热结构。 芯片安装在基板上并电连接到基板。 散热结构包括具有至少一个定位部分的第一散热器和具有至少一个第二定位部分和至少一个中空部分的至少一个第二散热器。 第二散热器安装在基板上，并且第一散热器的第一定位部分附接到第二散热器的第二定位部分，允许芯片容纳在由第一散热器限定的空间中， 第二散热器的中空部分和基板。 该半导体封装具有良好的散热效率，并且制造成本低。

公开(公告)号：US07102239B2

公开(公告)日：2006-09-05

申请号：US10909029

申请日：2004-07-30

申请人： Han-Ping Pu ,  Chang-Fu Lin ,  Chien-Ping Huang

发明人： Han-Ping Pu ,  Chang-Fu Lin ,  Chien-Ping Huang

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15311

摘要： A chip carrier for a semiconductor chip is provided. A plurality of solder pads for bump soldering are formed on a chip mounting surface of the chip carrier, to allow a flip chip to be mounted and electrically connected to the chip carrier. A solder mask layer is formed on the chip carrier, wherein a plurality of openings are provided in the solder mask layer to expose the solder pads, and an outwardly opening extended portion is formed respectively from the openings corresponding to the solder pads having a relatively narrower pitch therebetween, so as to prevent formation of voids during an underfill process for filing a gap between the flip chip and the chip carrier.

摘要翻译： 提供了一种用于半导体芯片的芯片载体。 在芯片载体的芯片安装表面上形成用于凸块焊接的多个焊盘，以允许倒装芯片安装并电连接到芯片载体。 在芯片载体上形成焊料掩模层，其中在焊料掩模层中设置多个开口以露出焊盘，并且从对应于具有相对较窄的焊盘的开口分别形成向外开口的延伸部分 间隔，以防止在底部填充过程中形成空隙，以便在倒装芯片和芯片载体之间填充间隙。

公开(公告)号：US08058100B2

公开(公告)日：2011-11-15

申请号：US12788772

申请日：2010-05-27

申请人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/60

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00

摘要： A chip scale package structure and a method for fabricating the same are disclosed. The method includes forming metal pads on a predetermined part of a carrier; mounting chips on the carrier, each of the chips having a plurality of conductive bumps soldered to the metal pads; forming an encapsulant on the carrier to encapsulate the chips and the conductive bumps; removing the carrier to expose the metal pads and even the metal pads with a surface of the encapsulant; forming on the encapsulant a plurality of first conductive traces electrically connected to the metal pads; applying a solder mask on the first conductive traces, and forming a plurality of openings on the solder mask to expose a predetermined part of the first conductive traces; forming a plurality of conductive elements on the predetermined part; and cutting the encapsulant to form a plurality of chip scale package structures.

摘要翻译： 公开了一种芯片级封装结构及其制造方法。 该方法包括在载体的预定部分上形成金属垫; 在载体上安装芯片，每个芯片具有焊接到金属焊盘的多个导电凸块; 在载体上形成密封剂以封装芯片和导电凸块; 移除载体以暴露金属垫和甚至具有密封剂表面的金属垫; 在所述密封剂上形成电连接到所述金属焊盘的多个第一导电迹线; 在所述第一导电迹线上施加焊接掩模，以及在所述焊接掩模上形成多个开口以暴露所述第一导电迹线的预定部分; 在所述预定部分上形成多个导电元件; 以及切割所述密封剂以形成多个芯片级封装结构。

公开(公告)号：US07993967B2

公开(公告)日：2011-08-09

申请号：US12616834

申请日：2009-11-12

申请人： Yih-Jenn Jiang ,  Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Yih-Jenn Jiang ,  Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3121 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package and a fabrication method are disclosed. The fabrication method includes applying a sacrificial layer on one surface of a metal carrier, applying an insulation layer on the sacrificial layer, and forming through holes in the sacrificial layer and the insulation layer to expose the metal carrier; forming a conductive metallic layer in each through hole; forming a patterned circuit layer on the insulation layer to be electrically connected to the conductive metallic layer; mounting at least a chip on the insulation layer and electrically connecting the chip to the patterned circuit layer; forming an encapsulant to encapsulate the chip and the patterned circuit layer; and removing the metal carrier and the sacrificial layer to expose the insulation layer and conductive metallic layer to allow the conductive metallic layer to protrude from the insulation layer. In the present invention, the distance between the semiconductor package and the external device is increased, and thermal stress caused by difference between the thermal expansion coefficients is reduced, so as to enhance the reliability of the product.

摘要翻译： 公开了半导体封装和制造方法。 制造方法包括在金属载体的一个表面上施加牺牲层，在牺牲层上施加绝缘层，以及在牺牲层和绝缘层中形成通孔以露出金属载体; 在每个通孔中形成导电金属层; 在所述绝缘层上形成图案化电路层，以电连接到所述导电金属层; 将至少一个芯片安装在所述绝缘层上并将所述芯片电连接到所述图案化电路层; 形成密封剂以封装所述芯片和所述图案化电路层; 并且去除金属载体和牺牲层以暴露绝缘层和导电金属层，以允许导电金属层从绝缘层突出。 在本发明中，半导体封装和外部器件之间的距离增加，由于热膨胀系数之差导致的热应力降低，从而提高了产品的可靠性。

公开(公告)号：US20100151631A1

公开(公告)日：2010-06-17

申请号：US12710450

申请日：2010-02-23

申请人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/60

CPC分类号： H01L23/473 ,  H01L21/563 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253

摘要： A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted on the chip, and includes an accommodating room, and a first opening and a second opening that communicate with the accommodating room. An encapsulant is formed between the heat dissipating device and the substrate to encapsulate the chip. A cutting process is performed to remove a non-electrical part of structure and expose the first and second openings from the encapsulant. A cooling fluid is received in the accommodating room to absorb and dissipate heat produced by the chip. The heat dissipating device covers the encapsulant and the chip to provide a maximum heat transfer area for the semiconductor package.

摘要翻译： 提供了具有散热装置的半导体封装和半导体封装的制造方法。 芯片安装在基板上。 散热装置安装在芯片上，并且包括容纳室，以及与容纳室连通的第一开口和第二开口。 在散热装置和衬底之间形成密封剂以封装芯片。 执行切割处理以去除结构的非电气部分并且从密封剂暴露第一和第二开口。 冷却流体容纳在容纳室中以吸收和散发由芯片产生的热量。 散热装置覆盖密封剂和芯片，以为半导体封装提供最大的传热面积。

公开(公告)号：US07671466B2

公开(公告)日：2010-03-02

申请号：US11647832

申请日：2006-12-29

申请人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/34 ,  H05K7/20 ,  H01L21/00

CPC分类号： H01L23/473 ,  H01L21/563 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253

摘要： A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted on the chip, and includes an accommodating room, and a first opening and a second opening that communicate with the accommodating room. An encapsulant is formed between the heat dissipating device and the substrate to encapsulate the chip. A cutting process is performed to remove a non-electrical part of structure and expose the first and second openings from the encapsulant. A cooling fluid is received in the accommodating room to absorb and dissipate heat produced by the chip. The heat dissipating device covers the encapsulant and the chip to provide a maximum heat transfer area for the semiconductor package.

摘要翻译： 提供了具有散热装置的半导体封装和半导体封装的制造方法。 芯片安装在基板上。 散热装置安装在芯片上，并且包括容纳室，以及与容纳室连通的第一开口和第二开口。 在散热装置和衬底之间形成密封剂以封装芯片。 执行切割处理以去除结构的非电气部分，并使第一和第二开口与密封剂暴露。 冷却流体容纳在容纳室中以吸收和散发由芯片产生的热量。 散热装置覆盖密封剂和芯片，以为半导体封装提供最大的传热面积。

公开(公告)号：US20070296079A1

公开(公告)日：2007-12-27

申请号：US11818225

申请日：2007-06-12

申请人： Chien-Ping Huang ,  Han-Ping Pu ,  Ho-Yi Tsai

发明人： Chien-Ping Huang ,  Han-Ping Pu ,  Ho-Yi Tsai

IPC分类号： H01L23/34 ,  H01L21/58

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat sink package structure and a method for fabricating the same are disclosed. The method includes mounting and electrically connecting a semiconductor chip to a chip carrier, forming an interface layer or a second heat dissipating element having the interface layer on the semiconductor chip and installing a first heat dissipating element having a heat dissipating portion and a supporting portion onto the chip carrier. The method further includes forming openings corresponding to the semiconductor chip in the heat dissipating portion, and forming an encapsulant for covering the semiconductor chip, the interface layer or the second heat dissipating element, and the first heat dissipating element. A height is reserved on top of the interface layer for the formation of the encapsulant for covering the interface layer. The method further includes cutting the encapsulant along edges of the interface layer, and removing the redundant encapsulant on the interface layer. Therefore, the drawbacks of the prior art of the burrs caused by a cutting tool for cutting the heat dissipating element and wearing of the cutting tool are overcome.

摘要翻译： 公开了一种散热器封装结构及其制造方法。 该方法包括将半导体芯片安装并电连接到芯片载体，在半导体芯片上形成具有界面层的界面层或第二散热元件，并将具有散热部分和支撑部分的第一散热元件安装到 芯片载体。 该方法还包括形成对应于散热部分中的半导体芯片的开口，以及形成用于覆盖半导体芯片，界面层或第二散热元件的密封剂和第一散热元件。 在接口层顶部保留一个高度，用于形成覆盖界面层的密封剂。 该方法还包括沿着界面层的边缘切割密封剂，以及去除界面层上的冗余密封剂。 因此，克服了用于切割散热元件的切削工具和切削工具的磨损引起的毛刺现有技术的缺陷。