公开(公告)号：US20120161301A1

公开(公告)日：2012-06-28

申请号：US13112226

申请日：2011-05-20

申请人： Jung-Pang Huang ,  Hui-Min Huang ,  Kuan-Wei Chuang ,  Chun-Tang Lin ,  Yih-Jenn Jiang

发明人： Jung-Pang Huang ,  Hui-Min Huang ,  Kuan-Wei Chuang ,  Chun-Tang Lin ,  Yih-Jenn Jiang

IPC分类号： H01L23/495 ,  H01L21/60 ,  H01L23/48

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/014 ,  H01L2924/3511

摘要： A semiconductor package includes: a chip having an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; an encapsulant encapsulating the chip and having opposite first and second surfaces, the first surface being flush with the active surface of the chip; and first and second metal layers formed on the second surface of the encapsulant, thereby providing a rigid support to the overall structure to prevent warpage and facilitating heat dissipation of the overall structure.

摘要翻译： 半导体封装包括：具有多个电极焊盘的有源表面和与该有源表面相对的无效表面的芯片; 密封剂，其封装所述芯片并且具有相对的第一和第二表面，所述第一表面与所述芯片的有源表面齐平; 以及形成在密封剂的第二表面上的第一和第二金属层，由此为整个结构提供刚性支撑以防止翘曲并促进整体结构的散热。

公开(公告)号：US07993967B2

公开(公告)日：2011-08-09

申请号：US12616834

申请日：2009-11-12

申请人： Yih-Jenn Jiang ,  Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Yih-Jenn Jiang ,  Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3121 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package and a fabrication method are disclosed. The fabrication method includes applying a sacrificial layer on one surface of a metal carrier, applying an insulation layer on the sacrificial layer, and forming through holes in the sacrificial layer and the insulation layer to expose the metal carrier; forming a conductive metallic layer in each through hole; forming a patterned circuit layer on the insulation layer to be electrically connected to the conductive metallic layer; mounting at least a chip on the insulation layer and electrically connecting the chip to the patterned circuit layer; forming an encapsulant to encapsulate the chip and the patterned circuit layer; and removing the metal carrier and the sacrificial layer to expose the insulation layer and conductive metallic layer to allow the conductive metallic layer to protrude from the insulation layer. In the present invention, the distance between the semiconductor package and the external device is increased, and thermal stress caused by difference between the thermal expansion coefficients is reduced, so as to enhance the reliability of the product.

摘要翻译： 公开了半导体封装和制造方法。 制造方法包括在金属载体的一个表面上施加牺牲层，在牺牲层上施加绝缘层，以及在牺牲层和绝缘层中形成通孔以露出金属载体; 在每个通孔中形成导电金属层; 在所述绝缘层上形成图案化电路层，以电连接到所述导电金属层; 将至少一个芯片安装在所述绝缘层上并将所述芯片电连接到所述图案化电路层; 形成密封剂以封装所述芯片和所述图案化电路层; 并且去除金属载体和牺牲层以暴露绝缘层和导电金属层，以允许导电金属层从绝缘层突出。 在本发明中，半导体封装和外部器件之间的距离增加，由于热膨胀系数之差导致的热应力降低，从而提高了产品的可靠性。

公开(公告)号：US20130113095A1

公开(公告)日：2013-05-09

申请号：US13482313

申请日：2012-05-29

申请人： Chien-Lung Chuang ,  Po-Yi Wu ,  Meng-Tsung Lee ,  Yih-Jenn Jiang

发明人： Chien-Lung Chuang ,  Po-Yi Wu ,  Meng-Tsung Lee ,  Yih-Jenn Jiang

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L24/11 ,  H01L23/3157 ,  H01L24/13 ,  H01L2224/02126 ,  H01L2224/0231 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/03 ,  H01L2224/034 ,  H01L2224/0361 ,  H01L2224/03614 ,  H01L2224/03622 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05558 ,  H01L2224/05562 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/10126 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13 ,  H01L2224/13006 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2924/2064 ,  H01L2924/37001 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552

摘要： A packaging substrate includes a base body having at least a conductive pad on a surface thereof, a dielectric layer formed on the surface of the base body and having at least a first opening for exposing the conductive pad and at least a second opening formed at a periphery of the first opening, and a metal layer formed on the conductive pad and the dielectric layer and extending to a sidewall of the second opening, thereby effectively eliminating side-etching of the metal layer under a solder bump.

摘要翻译： 封装基板包括基体，该基体在其表面上至少具有导电焊盘，形成在基体表面上的至少一个第一开口用于暴露导电焊盘的至少一个第二开口， 第一开口的周边，以及形成在导电焊盘和电介质层上并延伸到第二开口的侧壁的金属层，从而有效地消除了焊料凸块下方的金属层的侧蚀刻。

公开(公告)号：US07638879B2

公开(公告)日：2009-12-29

申请号：US11985662

申请日：2007-11-16

申请人： Yih-Jenn Jiang ,  Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Yih-Jenn Jiang ,  Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3121 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package and a fabrication method are disclosed. The fabrication method includes applying a sacrificial layer on one surface of a metal carrier, applying an insulation layer on the sacrificial layer, and forming through holes in the sacrificial layer and the insulation layer to expose the metal carrier; forming a conductive metallic layer in each through hole; forming a patterned circuit layer on the insulation layer to be electrically connected to the conductive metallic layer; mounting at least a chip on the insulation layer and electrically connecting the chip to the patterned circuit layer; forming an encapsulant to encapsulate the chip and the patterned circuit layer; and removing the metal carrier and the sacrificial layer to expose the insulation layer and conductive metallic layer to allow the conductive metallic layer to protrude from the insulation layer. In the present invention, the distance between the semiconductor package and the external device is increased, and thermal stress caused by difference between the thermal expansion coefficients is reduced, so as to enhance the reliability of the product.

摘要翻译： 公开了半导体封装和制造方法。 制造方法包括在金属载体的一个表面上施加牺牲层，在牺牲层上施加绝缘层，以及在牺牲层和绝缘层中形成通孔以露出金属载体; 在每个通孔中形成导电金属层; 在所述绝缘层上形成图案化电路层，以电连接到所述导电金属层; 将至少一个芯片安装在所述绝缘层上并将所述芯片电连接到所述图案化电路层; 形成密封剂以封装所述芯片和所述图案化电路层; 并且去除金属载体和牺牲层以暴露绝缘层和导电金属层，以允许导电金属层从绝缘层突出。 在本发明中，半导体封装和外部器件之间的距离增加，由于热膨胀系数之差导致的热应力降低，从而提高了产品的可靠性。

公开(公告)号：US20070178627A1

公开(公告)日：2007-08-02

申请号：US11648048

申请日：2006-12-28

申请人： Yih Jenn Jiang ,  Han Ping Pu ,  Cheng Hsu Hsiao

发明人： Yih Jenn Jiang ,  Han Ping Pu ,  Cheng Hsu Hsiao

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83951 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00

摘要： A flip-chip semiconductor device and a method for fabricating the same are provided. A first underfill material with a low Young's modulus is applied to corners of a chip mounting area defined on a substrate. A chip is mounted on and electrically connected to the chip mounting area by a plurality of conductive bumps, allowing the first underfill material to encapsulate corners of the chip. A second underfill material with a high Young's modulus is used to fill a gap between the chip and the substrate to protect the conductive bumps and support the chip.

摘要翻译： 提供了倒装芯片半导体器件及其制造方法。 将具有低杨氏模量的第一底部填充材料施加到限定在基板上的芯片安装区域的角部。 芯片通过多个导电凸块安装在芯片安装区域上并与芯片安装区域电连接，允许第一底部填充材料封装芯片的角部。 使用具有高杨氏模量的第二底部填充材料来填充芯片和基板之间的间隙，以保护导电凸块并支撑芯片。

公开(公告)号：US08519526B2

公开(公告)日：2013-08-27

申请号：US13112226

申请日：2011-05-20

申请人： Jung-Pang Huang ,  Hui-Min Huang ,  Kuan-Wei Chuang ,  Chun-Tang Lin ,  Yih-Jenn Jiang

发明人： Jung-Pang Huang ,  Hui-Min Huang ,  Kuan-Wei Chuang ,  Chun-Tang Lin ,  Yih-Jenn Jiang

IPC分类号： H01L23/48

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/014 ,  H01L2924/3511

摘要： A semiconductor package includes: a chip having an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; an encapsulant encapsulating the chip and having opposite first and second surfaces, the first surface being flush with the active surface of the chip; and first and second metal layers formed on the second surface of the encapsulant, thereby providing a rigid support to the overall structure to prevent warpage and facilitating heat dissipation of the overall structure.

摘要翻译： 半导体封装包括：具有多个电极焊盘的有源表面和与该有源表面相对的无效表面的芯片; 密封剂，其封装所述芯片并且具有相对的第一和第二表面，所述第一表面与所述芯片的有源表面齐平; 以及形成在密封剂的第二表面上的第一和第二金属层，由此为整个结构提供刚性支撑以防止翘曲并促进整体结构的散热。

公开(公告)号：US20120129315A1

公开(公告)日：2012-05-24

申请号：US12930659

申请日：2011-01-12

申请人： Yeh-Chang Hu ,  Chung-Tang Lin ,  Hui-Min Huang ,  Yih-Jenn Jiang ,  Shih-Kuang Chiu

发明人： Yeh-Chang Hu ,  Chung-Tang Lin ,  Hui-Min Huang ,  Yih-Jenn Jiang ,  Shih-Kuang Chiu

IPC分类号： H01L21/50

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/96 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

摘要： A method for fabricating a semiconductor package includes the steps of: providing an alignment board having a plurality of openings and a plurality of alignment marks corresponding to the openings, respectively; disposing a plurality of chips on the alignment board at positions corresponding to the openings according to the alignment marks; pressing the alignment board with a carrier board having a soft layer disposed on one surface thereof so as to embed the chips in the soft layer of the carrier board; and removing the alignment board. As such, the positions of the chips are accurately positioned according to the alignment marks on the alignment board.

摘要翻译： 一种制造半导体封装的方法，包括以下步骤：提供具有分别对应于开口的多个开口和多个对准标记的对准板; 在对准基板上根据对准标记在与开口相对应的位置处设置多个芯片; 用具有设置在其一个表面上的软层的载板压住对准板，以将芯片嵌入载板的软层中; 并拆下对准板。 因此，芯片的位置根据对准板上的对准标记精确地定位。

公开(公告)号：US20100052146A1

公开(公告)日：2010-03-04

申请号：US12616834

申请日：2009-11-12

申请人： Yih-Jenn Jiang ,  Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Yih-Jenn Jiang ,  Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/522 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package and a fabrication method are disclosed. The fabrication method includes applying a sacrificial layer on one surface of a metal carrier, applying an insulation layer on the sacrificial layer, and forming through holes in the sacrificial layer and the insulation layer to expose the metal carrier; forming a conductive metallic layer in each through hole; forming a patterned circuit layer on the insulation layer to be electrically connected to the conductive metallic layer; mounting at least a chip on the insulation layer and electrically connecting the chip to the patterned circuit layer; forming an encapsulant to encapsulate the chip and the patterned circuit layer; and removing the metal carrier and the sacrificial layer to expose the insulation layer and conductive metallic layer to allow the conductive metallic layer to protrude from the insulation layer. In the present invention, the distance between the semiconductor package and the external device is increased, and thermal stress caused by difference between the thermal expansion coefficients is reduced, so as to enhance the reliability of the product.

摘要翻译： 公开了半导体封装和制造方法。 制造方法包括在金属载体的一个表面上施加牺牲层，在牺牲层上施加绝缘层，以及在牺牲层和绝缘层中形成通孔以露出金属载体; 在每个通孔中形成导电金属层; 在所述绝缘层上形成图案化电路层，以电连接到所述导电金属层; 将至少一个芯片安装在所述绝缘层上并将所述芯片电连接到所述图案化电路层; 形成密封剂以封装所述芯片和所述图案化电路层; 并且去除金属载体和牺牲层以暴露绝缘层和导电金属层，以允许导电金属层从绝缘层突出。 在本发明中，半导体封装和外部器件之间的距离增加，由于热膨胀系数之差导致的热应力降低，从而提高了产品的可靠性。

公开(公告)号：US20080116580A1

公开(公告)日：2008-05-22

申请号：US11985662

申请日：2007-11-16

申请人： Yih-Jenn Jiang ,  Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Yih-Jenn Jiang ,  Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package and a fabrication method are disclosed. The fabrication method includes applying a sacrificial layer on one surface of a metal carrier, applying an insulation layer on the sacrificial layer, and forming through holes in the sacrificial layer and the insulation layer to expose the metal carrier; forming a conductive metallic layer in each through hole; forming a patterned circuit layer on the insulation layer to be electrically connected to the conductive metallic layer; mounting at least a chip on the insulation layer and electrically connecting the chip to the patterned circuit layer; forming an encapsulant to encapsulate the chip and the patterned circuit layer; and removing the metal carrier and the sacrificial layer to expose the insulation layer and conductive metallic layer to allow the conductive metallic layer to protrude from the insulation layer. In the present invention, the distance between the semiconductor package and the external device is increased, and thermal stress caused by difference between the thermal expansion coefficients is reduced, so as to enhance the reliability of the product.

摘要翻译： 公开了半导体封装和制造方法。 制造方法包括在金属载体的一个表面上施加牺牲层，在牺牲层上施加绝缘层，以及在牺牲层和绝缘层中形成通孔以露出金属载体; 在每个通孔中形成导电金属层; 在所述绝缘层上形成图案化电路层，以电连接到所述导电金属层; 将至少一个芯片安装在所述绝缘层上并将所述芯片电连接到所述图案化电路层; 形成密封剂以封装所述芯片和所述图案化电路层; 并且去除金属载体和牺牲层以暴露绝缘层和导电金属层，以允许导电金属层从绝缘层突出。 在本发明中，半导体封装和外部器件之间的距离增加，由于热膨胀系数之差导致的热应力降低，从而提高了产品的可靠性。