Abstract:
A resin compound has a structure represented by a chemical formula (I):
In the chemical formula (I), each R1 independently represents a C1-C20 alkylene group or a C7-C40 alkylarylene group, and R1 are the same or different from each other; n independently represents an integer of 1-4; each R2 independently represents a C1-C20 alkyl group or a C2-C20 terminal alkenyl group, and R2 are the same or different from each other. When at least one of R1 represents a C1-C20 alkylene group, at least one of R2 is a C2-C20 terminal alkenyl group.
Abstract:
An epoxy compound, composition and cured product thereof are provided. The epoxy compound has a structure represented by Formula (I)
wherein R1 and R2 are each independently cyano group, isocyanate group, oxiranyl, methyloxiranyl group, glycidyl group, methylglycidyl group, epoxypropyl group, oxetanyl group, oxetanemethyl group, or C1-C10 alkoxy group; Z is —O—,
R3 and R4 are each independently hydrogen, fluorine, methyl, fluoromethyl, or ethyl; n and m are each independently 3, 4, 5, 6, 7, 8, 9, or 10; and i and j are each independently 1, 2, or 3.
Abstract:
A curable composition and an electronic device employing the same are provided. The curable composition includes 100 parts by mole of a first siloxane compound represented by Formula (I) wherein n is 8 to 232, wherein R1 is independently C1-3 alkyl group; 1 to 15 parts by mole of a second siloxane compound represented by Formula (II) wherein x≥2, y≥2, and x/y is between 0.1 and 3, and R2, R3 and R4 are independently C1-3 alkyl group; 1 to 15 parts by mole of a third siloxane compound represented by Formula (III) and 90 to 250 parts by mole of a curing agent represented by Formula (IV) wherein m is 7 to 230, wherein R5 is independently C1-3 alkyl group.
Abstract:
A resin composition and a resin film are provided. The resin composition includes a hardener and an epoxy resin monomer. The epoxy resin monomer has a structure represented by Formula (I)
wherein A is substituted or unsubstituted C6-24 arylene group, C3-16 cycloalkylene group, C3-16 heteroarylene group, C3-16 alicyclic alkylene group, or divalent C6-25 alkylaryl group; X1 and X2 are independently
Y1 and Y2 are independently substituted or unsubstituted C6-24 arylene group, and Y1 is different from Y2; and R1 is hydrogen, C1-8 alkyl group, or C1-8 alkoxy group, wherein the weight ratio of the curing agent to the epoxy resin monomer having a structure represented by Formula (I) is from 1:100 to 1:1.
Abstract:
A packaging material is provided. The packaging material includes (a) epoxy silsesquioxane, (b) epoxy resin, and (c) siloxane-imide-containing benzoxazine compound. (a) Epoxy silsesquioxane and (b) epoxy resin have a weight ratio of 0.3:1 to 10:1. The total weight of (a) epoxy silsesquioxane and (b) epoxy resin and the weight of (c) siloxane-imide-containing benzoxazine compound have a ratio of 100:20 to 100:150.
Abstract:
A multi-branched cationic phosphonium salt is provided. The multi-branched cationic phosphonium salt has a structure represented by formula (I): {Z[P+(R1)(R2)(R3)]n}(X−)n (I) wherein each of R1, R2, and R3 is independently a linear or branched C1˜C10 alkyl group, X− is an organic or inorganic anion, and Z has a structure represented by Formula (IIb) or Formula (IIc): wherein a is an integer of 1˜15. In Formulas (IIb) and (IIc), Z is connected to [P+(R1)(R2)(R3)] at the position marked by an asterisk (*), and n is an integer of 3˜4.
Abstract:
An optical solid state prepolymer is provided, which includes a product formed by reacting 100 parts by weight of (a) epoxy resin and 0.1 to 30 parts by weight of (b) oligomeric silsesquioxane. The (a) epoxy resin includes (a1) linear siloxane epoxy resin and (a2) cyclic siloxane epoxy resin with a weight ratio of 1:1 to 5:1.
Abstract:
An organic-inorganic hybrid resin, a molding composition, and a photoelectric device employing the same are disclosed. The organic-inorganic hybrid resin is a reaction product of a composition, wherein the composition includes: 0.1-10 parts by weight of reactant (a), and 100 parts by weight of reactant (b). In particular, the reactant (a) is a silsesquioxane prepolymer with metal oxide clusters, and the metal oxide cluster includes Ti, Zr, Zn, or a combination thereof. The reactant (b) includes an epoxy resin.
Abstract:
An epoxy-containing siloxane-modified resin, a package material, and a package structure are provided. The epoxy-containing siloxane-modified resin is formed by reacting a hydroxy terminated siloxane compound with a siloxane resin, and then reacting with an epoxy silane. The hydroxy terminated siloxane compound and the siloxane resin have a molar ratio of 5:1 to 10:1, and the epoxy silane and the siloxane resin have a molar ratio of 2:1 to 4:1.
Abstract:
A block copolymer is provided. The block copolymer includes a first block including repeat units represented by formula (I), and a second block connected to the first block and including repeat units represented by formula (II) or (III). The disclosure also provides a method for preparing the block copolymer and a thin film structure including the same.