公开(公告)号：US12148640B2

公开(公告)日：2024-11-19

申请号：US18160124

申请日：2023-01-26

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  G01B11/27 ,  H01L21/66 ,  H01L21/68 ,  H01L21/78

Abstract: In an embodiment a method includes placing a wafer on a receptacle comprising a chuck base, wherein a light port for emitting light from a source of light is an opening located in a surface of the chuck base, and wherein the light port is located underneath the wafer, shining the light from the light port at an edge of the wafer so that light passes by the edge of the wafer and processing the wafer on the receptacle based on the light that passed by the edge of the wafer and that is received by a light sensitive element.

公开(公告)号：US20210217640A1

公开(公告)日：2021-07-15

申请号：US17219351

申请日：2021-03-31

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  G01B11/27 ,  H01L21/78 ,  H01L21/66 ,  H01L21/68

Abstract: In an embodiment an apparatus includes a receptacle configured to receive a wafer, a light port configured to emit light from a source of light so as to shine the light on an edge of the wafer, wherein the light port is an opening located on a surface of the receptacle and a light sensitive element configured to receive light that passed the edge of the wafer and to form a detection signal based on the received light, wherein the light port is located underneath the wafer.

公开(公告)号：US20230170233A1

公开(公告)日：2023-06-01

申请号：US18160124

申请日：2023-01-26

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  G01B11/27 ,  H01L21/68 ,  H01L21/78 ,  H01L21/66

CPC classification number: H01L21/67259 ,  G01B11/272 ,  H01L21/681 ,  H01L21/78 ,  H01L22/20 ,  H01L21/67092

Abstract: In an embodiment a method includes placing a wafer on a receptacle comprising a chuck base, wherein a light port for emitting light from a source of light is an opening located in a surface of the chuck base, and wherein the light port is located underneath the wafer, shining the light from the light port at an edge of the wafer so that light passes by the edge of the wafer and processing the wafer on the receptacle based on the light that passed by the edge of the wafer and that is received by a light sensitive element.

公开(公告)号：US20220181211A1

公开(公告)日：2022-06-09

申请号：US17678619

申请日：2022-02-23

Applicant: Infineon Technologies AG

Inventor： Paul Ganitzer ,  Carsten von Koblinski ,  Thomas Feil ,  Gerald Lackner ,  Jochen Mueller ,  Martin Poelzl ,  Tobias Polster

IPC: H01L21/8234 ,  H01L21/56 ,  H01L21/78 ,  H01L23/495 ,  H01L21/762 ,  H01L21/768 ,  H01L23/48 ,  H01L25/065

Abstract: An electronic component includes a semiconductor device including a semiconductor die including a first surface, the first surface including a first metallization structure and edge regions surrounding the first metallization structure, a second surface opposing the first surface and including a second metallization structure, and side faces extending between the first surface and the second surface, wherein the edge regions of the first surface and portions of the side faces are covered by a first polymer layer, wherein the electronic component further includes a plurality of leads and a plastic housing composition, wherein the first metallization structure is coupled to a first lead and the second metallization structure is coupled to a second lead of the plurality of leads.

公开(公告)号：US20190122909A1

公开(公告)日：2019-04-25

申请号：US16220888

申请日：2018-12-14

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  H01L21/78 ,  H01L21/66 ,  G01B11/27 ,  H01L21/68

Abstract: A method and apparatus for use in a wafer processing are disclosed. In an embodiment a includes providing the wafer on a receptacle, wherein the receptacle comprises a light port, and wherein the light port includes a source of light, shining a light from the source of light at an edge of the wafer thereby passing light by the edge of the wafer and processing the wafer on the receptacle based on the light passing by the edge of the wafer and received by a light sensitive element.

公开(公告)号：US20190088550A1

公开(公告)日：2019-03-21

申请号：US16081236

申请日：2017-02-27

Applicant: Infineon Technologies AG

Inventor： Paul Ganitzer ,  Carsten von Koblinski ,  Thomas Feil ,  Gerald Lackner ,  Jochen Mueller ,  Martin Poelzl ,  Tobias Polster

IPC: H01L21/8234 ,  H01L21/768 ,  H01L21/762 ,  H01L21/56 ,  H01L23/48 ,  H01L25/065

Abstract: In an embodiment, a method includes forming at least one trench in non-device regions of a first surface of a semiconductor wafer, the non-device regions being arranged between component positions, the component positions including device regions and a first metallization structure, applying a first polymer layer to the first surface of a semiconductor wafer such that the trenches and edge regions of the component positions are covered with the first polymer layer and such that at least a portion of the first metallization structure is uncovered by the first polymer layer, removing portions of a second surface of the semiconductor wafer, the second surface opposing the first surface, revealing portions of the first polymer layer in the non-device regions and producing a worked second surface and inserting a separation line through the first polymer layer in the non-device regions to form a plurality of separate semiconductor dies.

公开(公告)号：US10186438B2

公开(公告)日：2019-01-22

申请号：US14933931

申请日：2015-11-05

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  G01B11/27 ,  H01L21/68 ,  H01L21/78 ,  H01L21/66

Abstract: A method and an apparatus for use in processing a wafer are disclosed. In an embodiment the method includes providing a wafer on a receptacle, shining a light at an edge of the wafer and based on light that passed the edge of the wafer, processing the wafer on the receptacle.

公开(公告)号：US20130164939A1

公开(公告)日：2013-06-27

申请号：US13774827

申请日：2013-02-22

Applicant: Infineon Technologies AG

Inventor： Gerald Lackner ,  Christian Maier ,  Francisco Javier Santos Rodriguez

IPC: H01L21/683 ,  H01L21/268 ,  H01L21/687 ,  H01L21/306 ,  H01L21/304 ,  H01L21/02 ,  H01L21/3065

CPC classification number: H01L21/683 ,  H01L21/02104 ,  H01L21/268 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/3065 ,  H01L21/6835 ,  H01L21/6838 ,  H01L21/68735 ,  H01L21/6875 ,  H01L2221/6834

Abstract: Some embodiments discussed relates to an apparatus for holding a substrate, comprising a body with a surface for a semiconductor wafer to rest on, with the surface having a first surface area on which a first area of the semiconductor wafer can rest, and a second surface area on which a second area of the semiconductor wafer can rest, wherein the second surface area protrudes with respect to the first surface area.

公开(公告)号：US11637028B2

公开(公告)日：2023-04-25

申请号：US17219351

申请日：2021-03-31

Applicant: Infineon Technologies AG

Inventor： Thomas Fischer ,  Gerald Lackner ,  Walter Horst Leitgeb ,  Michael Lecher

IPC: H01L21/67 ,  G01B11/27 ,  H01L21/68 ,  H01L21/78 ,  H01L21/66

Abstract: In an embodiment an apparatus includes a receptacle configured to receive a wafer, a light port configured to emit light from a source of light so as to shine the light on an edge of the wafer, wherein the light port is an opening located on a surface of the receptacle and a light sensitive element configured to receive light that passed the edge of the wafer and to form a detection signal based on the received light, wherein the light port is located underneath the wafer.

公开(公告)号：US20230100613A1

公开(公告)日：2023-03-30

申请号：US17942487

申请日：2022-09-12

Applicant: Infineon Technologies AG

Inventor： Franz-Josef Pichler ,  Johannes Mueller ,  Christoph Ahamer ,  Gerald Lackner ,  Walter Horst Leitgeb

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/268 ,  H01L21/78

Abstract: A chuck for a laser beam wafer dicing equipment includes a wafer support plate having an upper surface for holding a wafer disposed on a dicing tape. The upper surface includes an annular groove that overlaps an edge of the wafer when the wafer disposed on the dicing tape is placed on the upper surface. The wafer support plate includes a ventilation channel configured to ventilate the annular groove.