公开(公告)号：US20240028531A1

公开(公告)日：2024-01-25

申请号：US18375472

申请日：2023-09-30

Applicant: Intel Corporation

Inventor： John R. DREW ,  James A. McCALL ,  Tongyan ZHAI ,  Jun LIAO ,  Min Suet LIM ,  Shigeki TOMISHIMA

IPC: G06F13/16 ,  G06F13/40

CPC classification number: G06F13/1694 ,  G06F13/1689 ,  G06F13/4022

Abstract: A memory subsystem triggers dynamic switching for memory devices to provide access to active memory devices and prevent access to inactive memory devices. Dynamic switching enables a single bus to switch between multiple memory devices whose capacity otherwise exceeds the capacity of the single bus. A switch can be mounted in a memory module or directly on a motherboard alongside the memory devices. A memory controller can toggle a chip select signal as a single control signal to drive the switch. Each switch includes pairs of field effect transistors (FETs), including any of CMOS, NMOS and PMOS FETs. The switch electrically isolates inactive memory devices to prevent access without the need to electrically short the devices.

公开(公告)号：US20220361328A1

公开(公告)日：2022-11-10

申请号：US17871686

申请日：2022-07-22

Applicant: Intel Corporation

Inventor： Xiang LI ,  Konika GANGULY ,  Tongyan ZHAI ,  George VERGIS ,  Anthony M. CONSTANTINE ,  Jun LIAO

IPC: H05K1/11 ,  H05K1/18 ,  G06F1/18

Abstract: Power conversion modules using compression mount technology (CMT) connectors and associated apparatus and methods. Assemblies include a CMT connector that includes an array of spring-loaded CMT pins or contacts that are configured to contact respective pads on a pair of printed circuit board (PCBs), such as for VR module card or power conversion module and a motherboard. The power conversion modules in combination with the CMT connectors provide several advantages, including, a common VR module/power conversion module/motherboard footprint across OEM platforms and test hardware, just in time VR module attachment for improved inventory management, removable power delivery solution makes the platform more conducive to debug, in field servicing, and platform upgradable for higher power CPU/GPU/XPU.

公开(公告)号：US20220368047A1

公开(公告)日：2022-11-17

申请号：US17874111

申请日：2022-07-26

Applicant: Intel Corporation

Inventor： George VERGIS ,  Xiang LI ,  Jun LIAO ,  Anthony M. CONSTANTINE ,  Min Suet LIM ,  Tongyan ZHAI ,  Konika GANGULY

IPC: H01R12/72 ,  G06F1/18 ,  H01R13/24 ,  H01R12/70

Abstract: An adapter card with compression-attached memory modules that can be inserted into a conventional vertical connector enables use of CAMMs in systems with vertical memory module connectors. In one example, an adapter card or riser card includes a printed circuit board (PCB) having an edge to be received by a dual-inline memory module (DIMM) connector. First conductive contacts proximate to the edge of the PCB are to be received by the DIMM connector, enabling the first conductive contacts to couple with contacts of the DIMM connector. Second conductive contacts on a face of the PCB are to couple with a first compression attached memory module (CAMM) via a first compression mount technology (CMT) connector. The adapter card includes conductive traces on or in the PCB between the first conductive contacts and the second conductive contacts to couple the CAMM with the DIMM connector.

公开(公告)号：US20220358072A1

公开(公告)日：2022-11-10

申请号：US17874117

申请日：2022-07-26

Applicant: Intel Corporation

Inventor： George VERGIS ,  Xiang LI ,  Jun LIAO ,  Anthony M. CONSTANTINE ,  Min Suet LIM ,  Tongyan ZHAI ,  Konika GANGULY

IPC: G06F13/40 ,  G06F12/06

Abstract: A memory module adapter card can adapt multiple compression-attached memory modules (CAMMs) to a dual inline memory module (DIMM) connector. Multiplexer circuitry on the adapter card enables multiplexing data amongst the memory modules attached to the adapter card during a same burst access sequence.

公开(公告)号：US20240186206A1

公开(公告)日：2024-06-06

申请号：US18438450

申请日：2024-02-10

Applicant: Intel Corporation

Inventor： Satish PRATHABAN ,  Ramaswamy PARTHASARATHY ,  Biswajit PATRA ,  Tongyan ZHAI ,  Jeff KU ,  Min Suet LIM ,  Yi HUANG ,  Kai XIAO ,  Gene F. YOUNG ,  Weimin SHI

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/427 ,  H01L25/065 ,  H01L25/18 ,  H05K1/02

CPC classification number: H01L23/367 ,  H01L23/427 ,  H01L25/0655 ,  H01L25/18 ,  H05K1/0203 ,  H05K1/0262 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/1427 ,  H01L2924/15311

Abstract: Systems, apparatuses and methods may provide for technology that includes a voltage regulator, a board assembly including a die and a circuit board electrically coupled to a first side of the die, and a thermal dissipation assembly thermally and electrically coupled to a second side of the die, wherein the thermal dissipation assembly is further electrically coupled to the voltage regulator. In one example, the thermal dissipation assembly includes a vapor chamber and the technology further includes a plurality of copper plates electrically coupled to the voltage regulator and a package substrate containing the die, wherein the plurality of copper plates are further thermally coupled to the vapor chamber.

公开(公告)号：US20230007775A1

公开(公告)日：2023-01-05

申请号：US17871542

申请日：2022-07-22

Applicant: Intel Corporation

Inventor： Xiang LI ,  Konika GANGULY ,  Tongyan ZHAI ,  George VERGIS ,  Anthony M. CONSTANTINE ,  Jun LIAO

IPC: H05K1/18 ,  H05K1/11

Abstract: Methods and apparatus for GDDR (Graphics Double Date Rate) memory expander using compression mount technology (CMT) connectors. A CMT connector with a dedicated pinout for GDDR-based memory is provided that enables end users and manufacturers to change the amount of GDDR memory provided with a GPU card, accelerator card, or apparatus having other form factors. Memory could also be replaced in the event of a failure. In addition, embodiments are disclosed that support a split channel concept where there could be multiple devices (e.g., GDDR modules) with dedicated signals routed to each module.

公开(公告)号：US20220360002A1

公开(公告)日：2022-11-10

申请号：US17871611

申请日：2022-07-22

Applicant: Intel Corporation

Inventor： Xiang LI ,  Konika GANGULY ,  Tongyan ZHAI ,  George VERGIS ,  Anthony M. CONSTANTINE ,  Jun LIAO

IPC: H01R12/72 ,  G06F1/18 ,  H01R13/24

Abstract: Methods and apparatus for differential I/O (input/output) cards using compression mount technology (CMT) connectors. Assemblies include a CMT connector having an array of spring-loaded pins or contacts that are configured to contact respective CMT contact pads on a pair of printed circuit board (PCBs), such as an add-in card (AIC) and a motherboard. Stacked assemblies are also disclosed including multiple CMT AIC or PCIe modules communicatively coupled using on module CMT connectors. The connector solutions may be used for AICs without changing the overall PCB form factor outline of existing AICs employing edge connectors. Under a stacked assembly of multiple CMT PCIe modules interconnected by on module CMT connectors, wiring in the PCBs is configured to provide signaling supporting multi-lane PCIe or CXL links for each CMT PCIe module. The CMT connector approach also is scalable and can support more pins/contacts to facilitate additional I/O bandwidth.