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11 条记录 (耗时 0.029 秒)

    Connector for testing a semiconductor package
    4.
    发明授权
    Connector for testing a semiconductor package 有权
    用于测试半导体封装的连接器

    公开(公告)号：US07438563B2

    公开(公告)日：2008-10-21

    申请号：US11295208

    申请日：2005-12-05

    申请人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

    发明人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

    IPC分类号： H01R4/58

    CPC分类号： G01R1/0483 ,  G01R1/045 ,  G01R1/0466 ,  G01R31/2863

    摘要： In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.

    摘要翻译： 在一个实施例中，使用绝缘硅氧烷粉末和导电粉末的混合物制造连接器。 连接器包括由绝缘硅氧烷粉末形成的连接器主体，并且通过将导电粉末迁移到对应于半导体封装的焊料球的连接部位而形成的或更优选地规则排列的导电硅树脂构件。 导电硅树脂构件包括形成为接近连接器主体的上表面并从其突出的高密度导电硅树脂部件和在高密度导电硅树脂部件下方基本上垂直取向形成的低密度导电硅树脂部件， 低密度导电硅部件，其具有从连接器本体的下表面露出的下表面。

    System and method for opening and shutting a trunk lid of a vehicle
    5.
    发明授权
    System and method for opening and shutting a trunk lid of a vehicle 失效
    用于打开和关闭车辆行李箱盖的系统和方法

    公开(公告)号：US5788312A

    公开(公告)日：1998-08-04

    申请号：US671270

    申请日：1996-06-26

    申请人： Jae-Il Lee

    发明人： Jae-Il Lee

    IPC分类号： E05F15/04 ,  B62D25/10

    CPC分类号： E05F15/47 ,  E05Y2900/50 ,  E05Y2900/548

    摘要： An opening and shutting system for a trunk lid of a vehicle, includes a switch for generating a first switch signal for opening the trunk lid and a second switch signal for shutting the trunk lid, a piston member connected to the trunk lid for moving the trunk lid, and a control mechanism for controlling a movement of the piston member according to the first and second switch signals so as to automatically open and shut the trunk lid of the vehicle.

    摘要翻译： 一种用于车辆行李箱盖的打开和关闭系统，包括用于产生用于打开行李箱盖的第一开关信号的开关和用于关闭行李箱盖的第二开关信号;连接到行李箱盖以用于使行李箱移动的活塞构件 盖子和控制机构，用于根据第一和第二开关信号控制活塞件的运动，以便自动地打开和关闭车辆的行李箱盖。

    Semiconductor testing apparatus and method of calibrating the same
    6.
    发明申请
    Semiconductor testing apparatus and method of calibrating the same 审中-公开
    半导体测试装置及其校准方法

    公开(公告)号：US20070101219A1

    公开(公告)日：2007-05-03

    申请号：US11580048

    申请日：2006-10-13

    申请人： Seung-Ho Jang ,  Chul-Woong Jang ,  Min-Seok Jang ,  Se-Kyung Oh ,  Hyun-Seop Shim ,  Jae-Il Lee

    发明人： Seung-Ho Jang ,  Chul-Woong Jang ,  Min-Seok Jang ,  Se-Kyung Oh ,  Hyun-Seop Shim ,  Jae-Il Lee

    IPC分类号： G01R31/28

    CPC分类号： G01R31/3191 ,  G01R31/31922

    摘要： A calibration method and a semiconductor testing apparatus, including N drivers, N being a natural number no less than two, at least one transmission path coupled to at least one of the N drivers, at least one calibration board coupled to the at least one transmission path, N comparators, and N delay paths, such that each delay path of the N delay paths has a skew value and is coupled between the calibration board and one of the N comparators.

    摘要翻译： 一种校准方法和半导体测试装置，包括N个驱动器，N是不少于两个的自然数，耦合到N个驱动器中的至少一个的至少一个传输路径，耦合到至少一个传输的至少一个校准板 路径，N个比较器和N个延迟路径，使得N个延迟路径的每个延迟路径具有偏斜值并耦合在校准板和N个比较器中的一个之间。

    Wafer treatment method for protecting fuse box of semiconductor chip
    7.
    发明授权
    Wafer treatment method for protecting fuse box of semiconductor chip 失效
    用于保护半导体芯片保险丝盒的晶片处理方法

    公开(公告)号：US06841425B2

    公开(公告)日：2005-01-11

    申请号：US10282741

    申请日：2002-10-28

    申请人： Jae-Il Lee ,  Jeong-Ho Bang ,  Young-Moon Lee ,  Hyo-Geun Chae

    发明人： Jae-Il Lee ,  Jeong-Ho Bang ,  Young-Moon Lee ,  Hyo-Geun Chae

    IPC分类号： H01L21/82 ,  H01L23/31 ,  H01L23/525

    CPC分类号： H01L23/3171 ,  H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Methods for treating a wafer to protect a fuse box of a semiconductor chip are provided. These methods include applying an insulating coating solution onto the surface of at least one of a plurality of fuse boxes in a semiconductor chip so as to prevent moisture or impurities from seeping into the fuse box. With these methods, the degradation of the semiconductor chip can be substantially reduced by protecting the fuse box from a high-temperature and very humid atmosphere, and impurities such as particles. Thus, characteristics and reliability of the semiconductor chip can be also improved.

    摘要翻译： 提供了用于处理晶片以保护半导体芯片的保险丝盒的方法。 这些方法包括在半导体芯片中的多个保险丝盒中的至少一个的表面上施加绝缘涂层溶液，以防止水分或杂质渗入保险丝盒中。 利用这些方法，通过保护熔丝盒免受高温和非常潮湿的气氛以及诸如颗粒的杂质，可以显着降低半导体芯片的劣化。 因此，也可以提高半导体芯片的特性和可靠性。

    Connecting unit to test semiconductor chips and apparatus to test semiconductor chips having the same
    8.
    发明授权
    Connecting unit to test semiconductor chips and apparatus to test semiconductor chips having the same 有权
    连接单元以测试半导体芯片和设备以测试具有相同的半导体芯片

    公开(公告)号：US08482308B2

    公开(公告)日：2013-07-09

    申请号：US12614504

    申请日：2009-11-09

    申请人： Ki-Jae Song ,  Hun-Kyo Seo ,  Jae-Il Lee ,  Jong-Won Han ,  Jong-Pil Park

    发明人： Ki-Jae Song ,  Hun-Kyo Seo ,  Jae-Il Lee ,  Jong-Won Han ,  Jong-Pil Park

    IPC分类号： G01R31/00 ,  G01R31/28

    CPC分类号： G01R31/2886 ,  G01R1/0408

    摘要： A connecting unit to test a semiconductor chip and an apparatus to test the semiconductor chip having the same include a plurality of connectors, on which a semiconductor chip having a certain pattern of electrical connection terminals, having a plurality of holes, cables configured to electrically connect the electrical connection terminals to the exterior, and coupling units configured to selectively electrically connect the cables to the electrical connection terminals through the holes. Therefore, it is possible to perform electrical tests of semiconductor chips having various patterns of electrical connection terminals and receive the semiconductor chips in a tray at a time.

    摘要翻译： 用于测试半导体芯片的连接单元和用于测试具有该连接器的半导体芯片的装置包括多个连接器，其上具有一定形式的电连接端子的半导体芯片具有多个孔，电缆被配置为电连接 电连接端子到外部，以及耦合单元，其被配置成选择性地将电缆电连接到电连接端子上。 因此，可以对具有各种电连接端子的图案的半导体芯片进行电气测试，并且一次接收托盘中的半导体芯片。

    Connector for testing a semiconductor package
    10.
    发明申请
    Connector for testing a semiconductor package 有权
    用于测试半导体封装的连接器

    公开(公告)号：US20060121757A1

    公开(公告)日：2006-06-08

    申请号：US11295208

    申请日：2005-12-05

    申请人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

    发明人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

    IPC分类号： H01R4/58

    CPC分类号： G01R1/0483 ,  G01R1/045 ,  G01R1/0466 ,  G01R31/2863

    摘要： In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.

    摘要翻译： 在一个实施例中，使用绝缘硅氧烷粉末和导电粉末的混合物制造连接器。 连接器包括由绝缘硅氧烷粉末形成的连接器主体，并且通过将导电粉末迁移到对应于半导体封装的焊料球的连接部位而形成的或更优选地规则排列的导电硅树脂构件。 导电硅树脂构件包括形成为接近连接器主体的上表面并从其突出的高密度导电硅树脂部件，以及在高密度导电硅树脂部件下方大致垂直取向地形成的低密度导电硅树脂部件， 低密度导电硅部件，其具有从连接器本体的下表面露出的下表面。