利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

47 条记录 (耗时 0.034 秒)

    Method of fabricating paste bump for printed circuit board
    2.
    发明授权
    Method of fabricating paste bump for printed circuit board 失效
    制造印刷电路板用焊膏凸块的方法

    公开(公告)号：US07841074B2

    公开(公告)日：2010-11-30

    申请号：US12005353

    申请日：2007-12-27

    申请人： Jee Soo Mok ,  Jun Heyoung Park ,  Ki Hwan Kim ,  Sung Yong Kim ,  Sang Hyun Park

    发明人： Jee Soo Mok ,  Jun Heyoung Park ,  Ki Hwan Kim ,  Sung Yong Kim ,  Sang Hyun Park

    IPC分类号： H01R43/00

    CPC分类号： H05K3/4069 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2203/0139 ,  H05K2203/0278 ,  H05K2203/1476 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49222 ,  Y10T29/53243

    摘要： A method of fabricating a paste bump for a printed circuit board, provides preparing a base plate; printing a conductive paste on the base plate and drying the conductive paste on the base plate, thus forming a first paste bump; flattening an upper surface of the first paste bump through coining; and printing a conductive paste on the first paste bump and drying the conductive paste on the first bump, thus forming a second paste bump, wherein the printing a conductive paste on the base plate and drying the conductive paste on the base plate includes placing a first mask having a hole having a first size on the base plate; applying a conductive paste on the first mask, and pressing the conductive paste using a squeegee; filling the hole having a first size in the first mask with the conductive paste, and sticking a bottom of the conductive paste to the base plate; and removing the first mask and drying the conductive paste, thus forming the first paste bump.

    摘要翻译： 一种制造印刷电路板用焊膏凸块的方法，提供制备基板; 在基板上印刷导电膏并干燥基板上的导电膏，从而形成第一浆料凸块; 通过压印使第一糊状凸块的上表面变平; 以及在所述第一贴片凸块上印刷导电膏并干燥所述第一凸点上的导电膏，从而形成第二膏凸，其中在所述基板上印刷导电膏并干燥所述基板上的导电膏包括： 掩模，在基板上具有第一尺寸的孔; 在第一掩模上施加导电膏，并使用刮板压接导电膏; 在第一掩模中用导电膏填充具有第一尺寸的孔，并将导电糊的底部粘贴到基板上; 并且去除第一掩模并干燥导电膏，从而形成第一浆料凸块。

    Dual mode terminal supporting location-based services and control method for the same
    7.
    发明授权
    Dual mode terminal supporting location-based services and control method for the same 有权
    双模终端支持基于位置的服务和控制方法相同

    公开(公告)号：US08208944B2

    公开(公告)日：2012-06-26

    申请号：US12829336

    申请日：2010-07-01

    申请人： Ki Hwan Kim ,  Seong Jin Park ,  Woo Yol Kim

    发明人： Ki Hwan Kim ,  Seong Jin Park ,  Woo Yol Kim

    IPC分类号： H04W24/00

    CPC分类号： H04W88/06 ,  G01S19/258 ,  H04W4/02

    摘要： A dual mode terminal for providing location-based services is provided. The dual mode terminal includes a first area including a first wireless communication unit for communication with a first communication network and a first processor for processing signals transmitted and received to and from the first communication network, and a second area including a second wireless communication unit for communication with a second communication network and a second processor for processing signals transmitted and received to and from the second communication network. The first wireless communication unit includes a GPS receiver for receiving satellite GPS signals. The first processor includes a GPS engine for processing network location information received from the first communication network and the second communication network, and the second processor transfers network location information received from the second communication network to the first processor.

    摘要翻译： 提供了一种用于提供基于位置的服务的双模终端。 双模终端包括：第一区域，包括用于与第一通信网络通信的第一无线通信单元和用于处理从第一通信网络发送和接收信号的第一处理器;以及第二区域，包括第二无线通信单元，用于 与第二通信网络和第二处理器的通信，用于处理从第二通信网络发送和接收的信号。 第一无线通信单元包括用于接收卫星GPS信号的GPS接收器。 第一处理器包括用于处理从第一通信网络和第二通信网络接收的网络位置信息的GPS引擎，并且第二处理器将从第二通信网络接收的网络位置信息传送到第一处理器。

    Method of manufacturing substrate using a carrier
    8.
    发明申请
    Method of manufacturing substrate using a carrier 失效
    使用载体制造衬底的方法

    公开(公告)号：US20110318480A1

    公开(公告)日：2011-12-29

    申请号：US13137631

    申请日：2011-08-30

    申请人： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    发明人： Ki Hwan Kim ,  Jin Yong An ,  Myung Sam Kang

    IPC分类号： H05K3/00

    CPC分类号： H05K3/0097 ,  H05K3/0052 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2203/0156 ,  H05K2203/1536

    摘要： A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

    摘要翻译： 使用载体制造衬底的方法，其包括制备具有释放层的载体，以及顺序地设置在释放层两侧的绝缘层和金属层; 图案化金属层以形成基极电路层; 在基极电路层上形成积层; 执行布线过程以将绝缘层与释放层分离; 以及在堆积层上形成阻焊层，并在阻焊层和绝缘层中形成开口以露出焊盘。

    METHOD AND APPARATUS FOR TRANSMITTING SIGNALS SEGMENTATION
    9.
    发明申请
    METHOD AND APPARATUS FOR TRANSMITTING SIGNALS SEGMENTATION 失效
    用于发送信号分类的方法和装置

    公开(公告)号：US20110261775A1

    公开(公告)日：2011-10-27

    申请号：US13139717

    申请日：2009-11-10

    申请人： Ki Hwan Kim ,  Jae Hoon Chung ,  Yeong Hyeon Kwon

    发明人： Ki Hwan Kim ,  Jae Hoon Chung ,  Yeong Hyeon Kwon

    IPC分类号： H04W72/04

    CPC分类号： H04L1/0042 ,  H04B7/0426 ,  H04B7/0617 ,  H04L1/0057 ,  H04L1/0067 ,  H04L1/1812 ,  H04L27/2601

    摘要： A method for transmitting a transport block includes segmenting the transport block into code blocks corresponding in number to a multiple of the number of layers to be used for the transmission of the transport block, attaching a Cyclic Redundancy Check (CRC) to the segmented code blocks, sequentially mapping the code blocks to which the CRC has been attached to at least one layer according to a predetermined mapping rule, and transmitting the code blocks.

    摘要翻译： 一种用于发送传输块的方法包括：将传输块分割为与要用于传输块的传输的层数的倍数相对应的码块，将循环冗余校验（CRC）附加到分段的码块 根据预定的映射规则顺序地将已经附加了CRC的代码块映射到至少一个层，并且发送代码块。

    Adaptable fence
    10.
    发明授权
    Adaptable fence 失效
    适应围栏

    公开(公告)号：US07100904B2

    公开(公告)日：2006-09-05

    申请号：US10225277

    申请日：2002-08-22

    申请人： Ki Hwan Kim

    发明人： Ki Hwan Kim

    IPC分类号： E04H17/14

    CPC分类号： E04H17/1434 ,  E04H2017/1491 ,  Y10S256/05

    摘要： The present disclosure relates to a fence. More particularly, the disclosure relates to a fence capable of adapting to any angle of inclination comprising a plurality of columns, horizontal connecting members which have more than one degree of freedom through a connection between a pair of columns and vertical connecting members which are connected to the horizontal connecting members. The fence can be constructed easily on the ground irrespective of its angle of inclination and its linkage sections are completely protected from the outside exposure while having a sufficient structural strength.

    摘要翻译： 本公开涉及围栏。 更具体地，本公开涉及一种能够适应包括多个柱的任何倾斜角的围栏，水平连接构件通过一对柱和垂直连接构件之间的连接具有多于一个自由度，所述垂直连接构件连接到 水平连接件。 篱笆可以轻松地在地面上构造，而不管其倾斜角度，并且其连接部分具有完全的防止外部暴露的同时具有足够的结构强度。