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    Method of fabricating paste bump for printed circuit board
    3.
    发明授权
    Method of fabricating paste bump for printed circuit board 失效
    制造印刷电路板用焊膏凸块的方法

    公开(公告)号：US07841074B2

    公开(公告)日：2010-11-30

    申请号：US12005353

    申请日：2007-12-27

    申请人： Jee Soo Mok ,  Jun Heyoung Park ,  Ki Hwan Kim ,  Sung Yong Kim ,  Sang Hyun Park

    发明人： Jee Soo Mok ,  Jun Heyoung Park ,  Ki Hwan Kim ,  Sung Yong Kim ,  Sang Hyun Park

    IPC分类号： H01R43/00

    CPC分类号： H05K3/4069 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2203/0139 ,  H05K2203/0278 ,  H05K2203/1476 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49222 ,  Y10T29/53243

    摘要： A method of fabricating a paste bump for a printed circuit board, provides preparing a base plate; printing a conductive paste on the base plate and drying the conductive paste on the base plate, thus forming a first paste bump; flattening an upper surface of the first paste bump through coining; and printing a conductive paste on the first paste bump and drying the conductive paste on the first bump, thus forming a second paste bump, wherein the printing a conductive paste on the base plate and drying the conductive paste on the base plate includes placing a first mask having a hole having a first size on the base plate; applying a conductive paste on the first mask, and pressing the conductive paste using a squeegee; filling the hole having a first size in the first mask with the conductive paste, and sticking a bottom of the conductive paste to the base plate; and removing the first mask and drying the conductive paste, thus forming the first paste bump.

    摘要翻译： 一种制造印刷电路板用焊膏凸块的方法，提供制备基板; 在基板上印刷导电膏并干燥基板上的导电膏，从而形成第一浆料凸块; 通过压印使第一糊状凸块的上表面变平; 以及在所述第一贴片凸块上印刷导电膏并干燥所述第一凸点上的导电膏，从而形成第二膏凸，其中在所述基板上印刷导电膏并干燥所述基板上的导电膏包括： 掩模，在基板上具有第一尺寸的孔; 在第一掩模上施加导电膏，并使用刮板压接导电膏; 在第一掩模中用导电膏填充具有第一尺寸的孔，并将导电糊的底部粘贴到基板上; 并且去除第一掩模并干燥导电膏，从而形成第一浆料凸块。

    Method of fabricating a printed circuit board
    6.
    发明授权
    Method of fabricating a printed circuit board 有权
    制造印刷电路板的方法

    公开(公告)号：US08161634B2

    公开(公告)日：2012-04-24

    申请号：US12073712

    申请日：2008-03-07

    申请人： Jee Soo Mok ,  Jun Heyoung Park

    发明人： Jee Soo Mok ,  Jun Heyoung Park

    IPC分类号： H01K3/22

    CPC分类号： H05K3/4069 ,  H05K3/107 ,  H05K3/386 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2203/0278 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49163 ,  Y10T156/109

    摘要： A method of fabricating a printed circuit, which involves forming a bump on a first metal layer; laminating an insulating layer on the bump so that the bumps passes through the insulating layer; placing a second metal layer on the insulating layer and then conducting heating and pressing, thus laminating the second metal layer on the insulating layer; etching the first metal layer and the second metal layer, thus forming circuit patterns on both surfaces of the insulating layer; and heating and pressing both surfaces of the insulating layer, thus embedding the circuit patterns in the insulating layer, such that the circuit pattern is embedded in an insulating layer to decrease the thickness of a printed circuit board, and the time and cost required for the process of fabricating a printed circuit board are decreased.

    摘要翻译： 一种制造印刷电路的方法，其包括在第一金属层上形成凸块; 在凸块上层叠绝缘层，使得凸块穿过绝缘层; 在绝缘层上放置第二金属层，然后进行加热和加压，从而将第二金属层层压在绝缘层上; 蚀刻第一金属层和第二金属层，从而在绝缘层的两个表面上形成电路图案; 并且对绝缘层的两个表面进行加热和加压，从而将电路图案嵌入绝缘层中，使得电路图案嵌入绝缘层中以减小印刷电路板的厚度，并且所需的时间和成本 制造印刷电路板的工艺减少。

    Method of manufacturing multilayered printed circuit board
    9.
    发明申请
    Method of manufacturing multilayered printed circuit board 审中-公开
    制造多层印刷电路板的方法

    公开(公告)号：US20120005894A1

    公开(公告)日：2012-01-12

    申请号：US13137934

    申请日：2011-09-21

    申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

    发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

    IPC分类号： H05K3/06 ,  H05K3/46

    CPC分类号： H05K3/1258 ,  H01L2224/11 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2203/0568 ,  H05K2203/1152 ,  Y10T29/49156

    摘要： A method of manufacturing a multilayered circuit board, including: providing a double-sided copper clad laminate including via holes formed therethrough and openings for forming circuit patterns, formed by patterning copper foil formed on one side thereof; filling the via holes and the openings with conductive paste; removing the copper foil from the double-sided copper clad laminate to form a first circuit layer including circuit patterns on one side thereof and to form a second circuit layer including connecting pads for attaching solder balls thereto on the other side thereof; forming a build-up layer on the first circuit layer, the build-up layer including a plurality of insulating layers and a plurality of circuit layers; and forming a solder resist layer on an outermost layer of the build-up layer.

    摘要翻译： 一种制造多层电路板的方法，包括：提供一种双面铜箔层压板，其包括形成的通孔和用于形成电路图案的开口，其形成在其一侧形成的铜箔; 用导电浆填充通孔和开孔; 从双面覆铜层压板上除去铜箔，以形成包括其一侧上的电路图案的第一电路层，并形成第二电路层，该第二电路层包括在其另一侧上附着焊球的连接焊盘; 在第一电路层上形成堆积层，所述堆积层包括多个绝缘层和多个电路层; 以及在积层层的最外层上形成阻焊层。

    Multilayered printed circuit board and method of manufacturing the same
    10.
    发明申请
    Multilayered printed circuit board and method of manufacturing the same 审中-公开
    多层印刷电路板及其制造方法

    公开(公告)号：US20090250259A1

    公开(公告)日：2009-10-08

    申请号：US12216435

    申请日：2008-07-03

    申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

    发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

    IPC分类号： H01R12/02 ,  B05D5/12 ,  B32B38/10

    CPC分类号： H05K3/4007 ,  H01R12/523 ,  H05K3/0017 ,  H05K3/207 ,  H05K3/4644 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/016 ,  H05K2203/1536

    摘要： Disclosed herein is a multilayered printed circuit board, including: a build-up layer including a plurality of insulating layers and a plurality of circuit layers; an insulating resin layer, including bumps, formed on the outermost circuit layer of one side of the build-up layer; and a solder resist layer formed on the outermost layer of the other side of the build-up layer. The multilayered printed circuit board is manufactured by sequentially placing a build-up layer and a solder resist layer on one side of an insulating resin layer, the other side of which is provided with bumps. The present invention is advantageous in that the thickness of the multilayered printed circuit board is decreased, the production processes thereof is simplified, and the production efficiency is increased.

    摘要翻译： 本文公开了一种多层印刷电路板，包括：包括多个绝缘层和多个电路层的堆积层; 包含凸起的绝缘树脂层，形成在构成层一侧的最外层电路层上; 以及形成在积层的另一侧的最外层上的阻焊层。 多层印刷电路板通过在绝缘树脂层的一侧依次放置积层和阻焊层，另一侧设置有凸块来制造。 本发明的优点在于，多层印刷电路板的厚度减小，其制造工艺简化，生产效率提高。