公开(公告)号：US20120080401A1

公开(公告)日：2012-04-05

申请号：US13316909

申请日：2011-12-12

申请人： Jee Soo MOK ,  Jun Heyoung Park ,  Ki Hwan Kim ,  Sung Yong Kim

发明人： Jee Soo MOK ,  Jun Heyoung Park ,  Ki Hwan Kim ,  Sung Yong Kim

IPC分类号： H05K3/06

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4647 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/096

摘要： A method of fabricating a multilayer printed circuit board includes preparing a first substrate, and preparing a second substrate, in parallel to the formation of the first substrate, that is, at the same time of the formation of the first substrate, by forming a third inner circuit pattern on one surface of a third insulating layer and forming a window on the other surface of the third insulating layer.

摘要翻译： 一种制造多层印刷电路板的方法包括：制备第一衬底并制备第二衬底，与第一衬底的形成平行，即形成第一衬底的同时，通过形成第三衬底 在第三绝缘层的一个表面上形成内部电路图案，并在第三绝缘层的另一个表面上形成窗口。

公开(公告)号：US20120175162A1

公开(公告)日：2012-07-12

申请号：US13428523

申请日：2012-03-23

申请人： Jee Soo MOK ,  Jun Heyoung PARK

发明人： Jee Soo MOK ,  Jun Heyoung PARK

IPC分类号： H05K1/11

CPC分类号： H05K3/4069 ,  H05K3/107 ,  H05K3/386 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2203/0278 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49163 ,  Y10T156/109

摘要： A printed circuit board having an insulating layer; circuit patterns formed on both surfaces of the insulating layer in order to be embedded in the insulating layer; and a bump formed to pass through the insulating layer in order to electrically connect the circuit patterns formed on both surfaces of the insulating layer.

摘要翻译： 一种具有绝缘层的印刷电路板; 形成在绝缘层的两个表面上的电路图案，以便嵌入绝缘层中; 以及形成为穿过绝缘层的凸块，以便电连接形成在绝缘层的两个表面上的电路图案。

公开(公告)号：US20110308069A1

公开(公告)日：2011-12-22

申请号：US13137669

申请日：2011-09-01

申请人： Eung Suek LEE ,  Je Gwang YOO ,  Chang Sup RYU ,  Jun Oh HWANG ,  Jun Heyoung PARK ,  Jee Soo MOK

发明人： Eung Suek LEE ,  Je Gwang YOO ,  Chang Sup RYU ,  Jun Oh HWANG ,  Jun Heyoung PARK ,  Jee Soo MOK

IPC分类号： H05K13/00 ,  C04B35/64

CPC分类号： H01L23/373 ,  B82Y30/00 ,  C04B35/80 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/407 ,  C04B2235/408 ,  C04B2235/5288 ,  F28F3/02 ,  F28F21/02 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49002 ,  Y10T29/4935 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.

摘要翻译： 一种冷却翅片和封装基板的制造方法，其特征在于，包括：准备模具，所述模具具有支撑基体和树脂层，所述支撑基底和树脂层形成在所述支撑基部上，并且在其一侧包括凹槽，所述凹槽被构造成形成冷却翅片; 在所述模具的侧面上印刷含有碳成分的可燃性糊料，所述成型体具有形成冷却翅片的所述凹槽; 移除支撑底座以留下冷却物体; 并发射冷却对象。

公开(公告)号：US20120055706A1

公开(公告)日：2012-03-08

申请号：US13080134

申请日：2011-04-05

申请人： Jee Soo MOK

发明人： Jee Soo MOK

IPC分类号： H05K1/16 ,  H01G7/00

CPC分类号： H01G4/33 ,  H01G4/228 ,  H05K1/162 ,  H05K3/421 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/09709 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/1189 ,  Y10T29/43

摘要： Disclosed herein is a printed circuit board, including: a core layer having a first circuit layer formed on an outer surface thereof; and a capacitor layer stacked on the core layer to be electrically connected to the first circuit layer, having an inner insulating layer therebetween, and including a plurality of conductive projection parts formed on the opposite surfaces of an upper electrode layer and a lower electrode layer and a dielectric layer formed between the upper electrode layer and the lower electrode layer.

摘要翻译： 这里公开了一种印刷电路板，包括：芯层，其在其外表面上形成有第一电路层; 以及堆叠在所述芯层上的与所述第一电路层电连接的电容器层，其间具有内绝缘层，并且包括形成在上电极层和下电极层的相对表面上的多个导电突起部，以及 形成在上电极层和下电极层之间的电介质层。

公开(公告)号：US20110114380A1

公开(公告)日：2011-05-19

申请号：US12725345

申请日：2010-03-16

申请人： Jee Soo MOK ,  Dek Gin Yang

发明人： Jee Soo MOK ,  Dek Gin Yang

IPC分类号： H05K9/00

CPC分类号： H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09781

摘要： Disclosed herein is an electromagnetic bandgap structure, including: a dielectric layer; a plurality of conductive plates formed on one side of the dielectric layer; a stitching via serving to electrically connect two adjacent conductive plates of the plurality of conductive plates; and a first dummy via formed each of the plurality of conductive plates in a direction of thickness of the dielectric layer, and a printed circuit board comprising the electromagnetic bandgap structure. The printed circuit board comprising the electromagnetic bandgap structure can solve a mixed signal problem even when an analog circuit and a digital circuit are simultaneously mounted therein.

摘要翻译： 本文公开了一种电磁带隙结构，包括：电介质层; 形成在电介质层一侧的多个导电板; 缝合通孔，用于电连接多个导电板中的两个相邻的导电板; 以及在电介质层的厚度方向上形成多个导电板中的每一个的第一虚拟通孔，以及包括电磁带隙结构的印刷电路板。 包括电磁带隙结构的印刷电路板即使当模拟电路和数字电路同时安装在其中时也可以解决混合信号问题。

公开(公告)号：US20120266463A1

公开(公告)日：2012-10-25

申请号：US13252815

申请日：2011-10-04

申请人： Chang Bo LEE ,  Cheol Ho CHOI ,  Jin Ho KIM ,  Jee Soo MOK

发明人： Chang Bo LEE ,  Cheol Ho CHOI ,  Jin Ho KIM ,  Jee Soo MOK

IPC分类号： H05K3/10

CPC分类号： H05K3/242 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2203/0577 ,  H05K2203/107 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed herein is a method for manufacturing a printed circuit board, including: forming a complex solder resist layer including a solder resist having an open part for forming a metal post and a cover film contacting the solder resist on a base substrate having an outer-layer circuit including a plating lead line; forming a metal post on the open part for forming the metal post by performing electroplating; removing the plating lead line; and exposing the metal post by removing the cover film.

摘要翻译： 本文公开了一种制造印刷电路板的方法，包括：形成复合阻焊层，其包括具有用于形成金属柱的开口部分的阻焊剂和在具有外层的基底基板上与阻焊剂接触的覆盖膜 电路包括电镀引线; 通过进行电镀在开口部上形成金属柱，形成金属柱; 去除电镀引线; 并通过去除覆盖膜来暴露金属柱。

公开(公告)号：US20120222299A1

公开(公告)日：2012-09-06

申请号：US13474388

申请日：2012-05-17

申请人： Jee Soo MOK ,  Je Gwang Yoo ,  Chang Sup Ryu

发明人： Jee Soo MOK ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC分类号： H05K3/10

CPC分类号： H05K3/4069 ,  H05K3/06 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/09481 ,  H05K2203/0278 ,  H05K2203/1461 ,  Y10T29/49144 ,  Y10T29/49155

摘要： A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The printed circuit board is made slim, and reliability and the degree of design freedom are increased.

摘要翻译： 一种印刷电路板和印刷电路板的制造方法，其中印刷电路板包括绝缘层，嵌入绝缘层中的电路层，并且具有嵌入在绝缘层中的连接焊盘，使得 所述连接垫与所述绝缘层的表面齐平，以及被配置为保护所述电路层免受外部环境并且具有所述连接焊盘暴露的开口的绝缘材料。 印刷电路板变薄，可靠性和设计自由度提高。