公开(公告)号：US07604754B2

公开(公告)日：2009-10-20

申请号：US11985950

申请日：2007-11-19

Applicant: John D. Summers

Inventor： John D. Summers

IPC: H01B1/00 ,  H01B1/02 ,  H01B1/12 ,  C08G73/10 ,  B22F7/00

CPC classification number: H01B1/22 ,  C08G59/245 ,  C08L63/00 ,  C08L79/08 ,  H01C7/005 ,  H01C17/06586 ,  H05K1/095 ,  H05K1/167 ,  H05K2201/0154 ,  C08L2666/22

Abstract: Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.

Abstract translation: 公开了由包含聚酰亚胺组分，空间位阻疏水环氧组分和具有2.1至3.0之间的汉森极性溶解度参数并且具有210-260℃的标准沸点的溶剂组分的聚合物厚膜电阻器制剂制成的电阻器组合物。 聚酰亚胺成分（“A”）与环氧成分（“B”）的重量比为A：B，其中A在1〜15之间，B为1。

公开(公告)号：US20090141425A1

公开(公告)日：2009-06-04

申请号：US11949914

申请日：2007-12-04

Applicant: Thomas Eugene Dueber ,  Frank Leonard Schadt, III ,  John D. Summers

Inventor： Thomas Eugene Dueber ,  Frank Leonard Schadt, III ,  John D. Summers

IPC: H05K3/30 ,  C08G73/06 ,  H01G4/12 ,  B05D5/12

CPC classification number: H05K1/162 ,  C08G73/22 ,  C09D11/033 ,  C09D11/102 ,  C09D179/04 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/285 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09763 ,  Y10T29/49146 ,  H01L2924/00

Abstract: This disclosure relates to compositions and methods for using such compositions to provide protective coatings, particularly of electronic components. Fired-on-foil ceramic capacitors coated with a polybenzoxazole encapsulant which may be embedded in printed wiring boards are disclosed.

Abstract translation: 本公开涉及使用这种组合物来提供保护性涂层，特别是电子部件的组合物和方法。 公开了涂覆有可以嵌入印刷线路板中的聚苯并恶唑密封剂的箔状陶瓷电容器。

公开(公告)号：US06469126B1

公开(公告)日：2002-10-22

申请号：US09741943

申请日：2000-12-21

Applicant: Brian C. Auman ,  William R. Corcoran, Jr. ,  John D. Summers

Inventor： Brian C. Auman ,  William R. Corcoran, Jr. ,  John D. Summers

IPC: C08G7310

CPC classification number: C08G73/1014 ,  C08G73/101 ,  C08G73/1017 ,  C08G73/1042 ,  C08G73/1071

Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

公开(公告)号：US5534201A

公开(公告)日：1996-07-09

申请号：US860863

申请日：1992-03-31

Applicant: John D. Summers ,  Wilson Tam

Inventor： John D. Summers ,  Wilson Tam

IPC: C07D409/06 ,  C09B23/01 ,  C09B23/14 ,  G02F1/361 ,  F21V9/00

CPC classification number: C07D409/06 ,  C09B23/0075 ,  C09B23/145 ,  G02F1/3614 ,  G02F1/3615

Abstract: Nonlinear optical elements are disclosed which comprise a polyimide which is solution and/or melt processible, and a poled NLO dye. Also disclosed is a process for making such elements, and devices in which they can be used. Disclosed NLO dyes include ##STR1##

Abstract translation: 公开了包括溶液和/或可熔融加工的聚酰亚胺和极化的NLO染料的非线性光学元件。 还公开了制造这些元件的方法以及可以使用它们的装置。 披露的NLO染料包括

公开(公告)号：US08270145B2

公开(公告)日：2012-09-18

申请号：US11949914

申请日：2007-12-04

Applicant: Thomas Eugene Dueber ,  Frank Leonard Schadt, III ,  John D. Summers

Inventor： Thomas Eugene Dueber ,  Frank Leonard Schadt, III ,  John D. Summers

IPC: H01G4/06 ,  C08K5/07 ,  C08G18/42

CPC classification number: H05K1/162 ,  C08G73/22 ,  C09D11/033 ,  C09D11/102 ,  C09D179/04 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/285 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09763 ,  Y10T29/49146 ,  H01L2924/00

Abstract: This disclosure relates to compositions and methods for using such compositions to provide protective coatings, particularly of electronic components. Fired-on-foil ceramic capacitors coated with a polybenzoxazole encapsulant which may be embedded in printed wiring boards are disclosed.

Abstract translation: 本公开涉及使用这种组合物来提供保护性涂层，特别是电子部件的组合物和方法。 公开了涂覆有可以嵌入印刷线路板中的聚苯并恶唑密封剂的箔状陶瓷电容器。

公开(公告)号：US20100067168A1

公开(公告)日：2010-03-18

申请号：US12514822

申请日：2007-12-11

Applicant: John D. Summers ,  Tsutomu Mutoh

Inventor： John D. Summers ,  Tsutomu Mutoh

IPC: H01G4/224

CPC classification number: H05K1/162 ,  H01G4/224 ,  H01L23/50 ,  H01L2924/0002 ,  H05K3/1291 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/09763 ,  H05K2203/1126 ,  H01L2924/00

Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.

Abstract translation: 本发明涉及组合物，以及这些组合物用于保护涂层，特别是电子器件的用途。 本发明涉及一种涂覆有复合密封剂并嵌入印刷线路板的烧制箔陶瓷电容器。

公开(公告)号：US20080185561A1

公开(公告)日：2008-08-07

申请号：US11985950

申请日：2007-11-19

Applicant: John D. Summers

Inventor： John D. Summers

IPC: H01B1/12 ,  C08G59/24

CPC classification number: H01B1/22 ,  C08G59/245 ,  C08L63/00 ,  C08L79/08 ,  H01C7/005 ,  H01C17/06586 ,  H05K1/095 ,  H05K1/167 ,  H05K2201/0154 ,  C08L2666/22

Abstract: Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.

Abstract translation: 公开了由包含聚酰亚胺组分，空间位阻疏水环氧组分和具有2.1至3.0之间的汉森极性溶解度参数并且具有210-260℃的标准沸点的溶剂组分的聚合物厚膜电阻器制剂制成的电阻器组合物。 聚酰亚胺成分（“A”）与环氧成分（“B”）的重量比为A：B，其中A在1〜15之间，B为1。

公开(公告)号：US06476177B2

公开(公告)日：2002-11-05

申请号：US09742860

申请日：2000-12-21

Applicant: Brian C. Auman ,  William R Corcoran, Jr. ,  John R Dodd ,  Mark A Guidry ,  John D. Summers

Inventor： Brian C. Auman ,  William R Corcoran, Jr. ,  John R Dodd ,  Mark A Guidry ,  John D. Summers

IPC: C08G7310

CPC classification number: C08G73/1017 ,  C08G73/101 ,  C08G73/1014 ,  C08G73/1042 ,  C08G73/1071

Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

Abstract translation: 本文公开了随机，可熔融加工的共聚酰亚胺。 这些共聚酰亚胺是半结晶的，并且从它们的熔体中显示可回收的（半）结晶性。 还公开了涉及制备和制造这些共聚酰亚胺成为具有预定形状的有用制品中的溶液聚合或熔融聚合的相关方法。

公开(公告)号：US5622654A

公开(公告)日：1997-04-22

申请号：US602394

申请日：1996-02-16

Applicant: John D. Summers ,  Wilson Tam

Inventor： John D. Summers ,  Wilson Tam

IPC: C07D409/06 ,  C09B23/01 ,  C09B23/14 ,  G02F1/361 ,  F21V9/00 ,  C07D401/00

CPC classification number: C07D409/06 ,  C09B23/0075 ,  C09B23/145 ,  G02F1/3614 ,  G02F1/3615

Abstract: Nonlinear optical elements are disclosed which comprise a polyimide which is solution and/or melt processible, and a poled NLO dye. Also disclosed is a process for making such elements, and devices in which they can be used. Disclosed NLO dyes include ##STR1##

Abstract translation: 公开了包括溶液和/或可熔融加工的聚酰亚胺和极化的NLO染料的非线性光学元件。 还公开了制造这些元件的方法以及可以使用它们的装置。 披露的NLO染料包括

公开(公告)号：US07745516B2

公开(公告)日：2010-06-29

申请号：US11248803

申请日：2005-10-12

Applicant: Thomas Eugene Dueber ,  John D. Summers ,  Brian C. Auman ,  Munirpallam Appadorai Subramanian ,  Nyrissa S. Rogado

Inventor： Thomas Eugene Dueber ,  John D. Summers ,  Brian C. Auman ,  Munirpallam Appadorai Subramanian ,  Nyrissa S. Rogado

IPC: C08K5/05 ,  C08K5/10 ,  C08K5/103 ,  C08L79/08 ,  B32B15/08

CPC classification number: H01L21/02118 ,  C08L63/00 ,  C08L79/08 ,  C08L2205/02 ,  G03F7/023 ,  G03F7/0387 ,  H01L21/02282 ,  H01L21/312 ,  H05K1/095 ,  H05K2201/0154 ,  Y10T428/31522 ,  C08L2666/20 ,  C08L2666/22

Abstract: Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.

Abstract translation: 吸水性聚酰亚胺/环氧基组合物（如糊剂（或溶液））特别适用于制作电子可屏幕印刷的材料和电子元件。 发现一组疏水性环氧化物（和可溶性聚酰亚胺）特别耐吸湿性。 用这些环氧化物（和这些聚酰亚胺）制成的聚酰亚胺/环氧树脂浆料可以任选含有热交联剂，粘合促进剂，封闭异氰酸酯和其它无机填料。 本发明的聚酰亚胺/环氧树脂糊料的玻璃化转变温度可以高于250℃，吸水率小于2％，并且具有正的溶解度测量。