摘要:
A computer system includes a housing that is divided into three compartments; two fan compartments, each containing a fan, and a third compartment containing heat generating electronic components. The air discharged from the fans flows through outlets in the fan compartments and into the third compartment to cool the electronic components. A single baffle is rotatably coupled between the two fan compartments using a vertically oriented hinge. When one of the fans fails, the air pressure from the working fan rotates the baffle until it covers the outlet of the fan compartment containing the failed fan. This enhances the flow of air from the working fan into the third compartment, and restricts the reverse flow of air through the dead fan compartment. When both fans are functioning, air pressure from both fans moves the baffle to a "midway" or "neutral" position, such that the air from both fans flows into the third compartment.
摘要:
A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/−90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.
摘要:
An integrated cooling and retention bracket is detachably coupled to a computer processor cartridge having a heatsink mounted thereto. The bracket is U-shaped with a cross-bar and a short, perpendicular arm on each end of the cross-bar. The lower end of each arm acts as a hinge for an upward-turned extension on the outer side of each arm. Each extension has a rounded knob at its tip and an outward protruding tooth therebelow. An integrally formed, cooling fan mounting structure is located on top of the cross-bar. The mounting structure has two side panels with a central opening therebetween for holding a conventional cooling fan, which is snap mounted inside the central opening. The cartridge and bracket assembly is installed in a retention mechanism on a printed circuit board. The teeth on the bracket snap into holes in the posts in the retention mechanism to electrically interconnect the processor cartridge to the circuit board. With the assembly installed in the retention mechanism, the fan is located directly adjacent to the cartridge for cooling the processor. The concave surfaces of the end wall and the baffle direct airflow from the fan along the entire width heatsink to maximize the cooling capability of the fan.
摘要:
Methods, systems, and media for thermal analysis are disclosed. Embodiments of the invention receive temperatures associated with elements of a system. The temperatures received are dependant upon airflow and heating patterns of the elements. Differences between the temperatures received and expected temperatures are detected. Potential airflow and heating patterns associated with a thermal problem are then determined, the potential airflow and heating patterns being substantially consistent with the temperatures received, to identify a root cause of the thermal problem as a probable source of the differences. More specifically, embodiments collect temperature readings from temperature sensors within an enclosure of the system; identify and upward temperature gradient or temperature that exceeds a threshold temperature; and select a failure scenario associated with a root cause of a thermal problem that is similar to the thermal problem described by the temperature readings collected.
摘要:
The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.
摘要:
A server blade system includes a plurality of slots for receiving server blades. The system includes an air moving device to move air through each of the server blades installed in the system. When one of the server blades is removed, a bypass damper rotates into the empty slot to obstruct the flow of air through the slot. The bypass damper is pivotally mounted within each slot and includes a torsion spring to move the damper into the obstruction position. Two hinge pin mounts, which are “U” shaped in cross section, provide a snap fit for two hinge pins positioned at one end of the bypass damper. A spring mounting pin is positioned between the two hinge pins and a torsion spring is mounted over the spring mounting pin.
摘要:
An air moving system such as a fan or blower system includes a back flow damper that functions in two orientations; non-inverted and inverted. First and second “end” baffles are pivotally attached at opposite ends of the damper, and three “middle” baffles are pivotally attached between the two end baffles. When the air moving system fails in the non-inverted orientation, the first end baffle and the three middle baffles are gravity operated to close off the air outlet to prevent the back flow of air, and the second end baffle pivots away from the outlet. When the air moving device fails in the inverted orientation, the second end baffle and the three middle baffles operate to close off the air outlet, and the first end baffle pivots away from the outlet. The three middle baffles are pivotally coupled to a connecting rod, which prevents the inadvertent jamming of baffles.
摘要:
A method for selectively cooling one or more heat-generating electronic components in an enclosure. Air is passed through an enclosure that houses one or more heat-generating components. Heated air is separated into at least first and second parallel airstreams within the enclosure. The first airstream is passed through a first heat exchanger in thermal contact with a first side of a thermoelectric cooling module. The second airstream is passed through a second heat exchanger in thermal contact with a second side of the thermoelectric cooling module. A voltage is applied to the thermoelectric cooling module to cool the first side and heat the second side of the thermoelectric cooling module. A temperature at a location in the enclosure in sensed and the voltage applied to the thermoelectric cooling module is varied in response to the sensed temperature.
摘要:
Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.
摘要:
A system enclosure uses two heat exchangers and a thermoelectric cooling module to manage heat within the system. An airflow enters the system and is heated by server blades. Portions of the airflow split and travel to various portions of the system enclosure. Some heat is removed from the airflow by passing through the first heat exchanger before circulating around downstream subsystems. The first heat exchanger contacts the cold side of a TEC module, to reduce the temperature of that airflow. The air then enters the network switch module or other subsystem where it is further heated. Thereafter, the second heat exchanger ‘bypasses’ those components by reinserting the upstream heat back into the downstream airflow. The second heat exchanger contacts the hot side of the TEC module. The mixture of all heated air is then expelled from the system enclosure.