公开(公告)号：US08837164B2

公开(公告)日：2014-09-16

申请号：US12865107

申请日：2010-01-22

申请人： Kazuhiro Kawabata ,  Kiyoshige Miyawaki ,  Yoshiaki Ueda ,  Shinji Nakamoto ,  Tsutomu Sugimoto

发明人： Kazuhiro Kawabata ,  Kiyoshige Miyawaki ,  Yoshiaki Ueda ,  Shinji Nakamoto ,  Tsutomu Sugimoto

IPC分类号： H05K7/02 ,  H01L23/367 ,  H01L23/36 ,  H01L23/057

CPC分类号： H01L23/3675 ,  H01L23/057 ,  H01L23/36 ,  H01L23/3677 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  Y10T29/49121 ,  H01L2924/00014

摘要： There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion.The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.

摘要翻译： 提供了一种用于安装装置的基板和用于容纳使用其的装置的封装，其中功率半导体装置可以容易地设定为适合于操作的温度，并且因此可以以适当的方式起作用。 用于安装装置的基板包括：支撑体，其在支撑体的一个主表面上具有用于安装功率半导体器件的器件安装部分，所述支撑体具有多个沿厚度方向间隔开的柱状部分， 相对于装置安装部分并且彼此分开布置; 以及集热区域，其设置在所述柱状部件之间，并且导热率低于所述支撑体。

公开(公告)号：US20110273846A1

公开(公告)日：2011-11-10

申请号：US12865107

申请日：2010-01-22

申请人： Kazuhiro Kawabata ,  Kiyoshige Miyawaki ,  Yoshiaki Ueda ,  Shinji Nakamoto ,  Tsutomu Sugimo

发明人： Kazuhiro Kawabata ,  Kiyoshige Miyawaki ,  Yoshiaki Ueda ,  Shinji Nakamoto ,  Tsutomu Sugimo

IPC分类号： H05K7/20

CPC分类号： H01L23/3675 ,  H01L23/057 ,  H01L23/36 ,  H01L23/3677 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  Y10T29/49121 ,  H01L2924/00014

摘要： There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion.The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.

摘要翻译： 提供了一种用于安装装置的基板和用于容纳使用其的装置的封装，其中功率半导体装置可以容易地设定为适合于操作的温度，并且因此可以以适当的方式起作用。 用于安装装置的基板包括：支撑体，其在支撑体的一个主表面上具有用于安装功率半导体器件的器件安装部分，所述支撑体具有多个沿厚度方向间隔开的柱状部分， 相对于装置安装部分并且彼此分开布置; 以及集热区域，其设置在所述柱状部件之间，并且导热率低于所述支撑体。

公开(公告)号：US08847381B2

公开(公告)日：2014-09-30

申请号：US13980440

申请日：2011-12-19

申请人： Yoshiaki Ueda ,  Shinji Nakamoto ,  Hiroshi Mizushima ,  Nobuyuki Tanaka

发明人： Yoshiaki Ueda ,  Shinji Nakamoto ,  Hiroshi Mizushima ,  Nobuyuki Tanaka

IPC分类号： H01L23/04 ,  H01L23/00 ,  H01L23/495 ,  H01L23/057

CPC分类号： H01L23/562 ,  H01L23/057 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/06181 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor element housing package includes a substrate, a frame body disposed on the substrate; an insulating substrate disposed in a frame-body-surrounded region of the substrate; a first mounting member disposed on the insulating substrate, for mounting a power semiconductor element thereon; a second mounting member disposed on the insulating substrate so as to be spaced away from the first mounting member; a first lead member having a first bend; and a second lead member having a second bend. The first lead member is disposed so as to pass through the frame body from an exterior thereof and extend over the first mounting member and makes connection therewith through the first bend. The second lead member is disposed so as to pass through the frame body from the exterior thereof and extend over the second mounting member and makes connection therewith through the second bend.

摘要翻译： 半导体元件外壳封装包括基板，设置在基板上的框体; 设置在所述基板的框体周围的区域中的绝缘基板; 第一安装构件，设置在所述绝缘基板上，用于在其上安装功率半导体元件; 第二安装构件，设置在所述绝缘基板上，以与所述第一安装构件隔开; 具有第一弯曲部的第一引线部件; 以及具有第二弯曲部的第二引导部件。 第一引导构件被设置成从框架体的外部穿过框架体并且在第一安装构件上延伸并且通过第一弯曲件与其连接。 第二引导构件被设置成从框架体的外部穿过框架体并且延伸穿过第二安装构件并通过第二弯曲件与其连接。

公开(公告)号：US20130307135A1

公开(公告)日：2013-11-21

申请号：US13980440

申请日：2011-12-19

申请人： Yoshiaki Ueda ,  Shinji Nakamoto ,  Hiroshi Mizushima ,  Nobuyuki Tanaka

发明人： Yoshiaki Ueda ,  Shinji Nakamoto ,  Hiroshi Mizushima ,  Nobuyuki Tanaka

IPC分类号： H01L23/00

CPC分类号： H01L23/562 ,  H01L23/057 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/06181 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor element housing package includes a substrate, a frame body disposed on the substrate; an insulating substrate disposed in a frame-body-surrounded region of the substrate; a first mounting member disposed on the insulating substrate, for mounting a power semiconductor element thereon; a second mounting member disposed on the insulating substrate so as to be spaced away from the first mounting member; a first lead member having a first bend; and a second lead member having a second bend. The first lead member is disposed so as to pass through the frame body from an exterior thereof and extend over the first mounting member and makes connection therewith through the first bend. The second lead member is disposed so as to pass through the frame body from the exterior thereof and extend over the second mounting member and makes connection therewith through the second bend.

摘要翻译： 半导体元件外壳封装包括基板，设置在基板上的框体; 设置在所述基板的框体周围的区域中的绝缘基板; 第一安装构件，设置在所述绝缘基板上，用于在其上安装功率半导体元件; 第二安装构件，设置在所述绝缘基板上，以与所述第一安装构件隔开; 具有第一弯曲部的第一引线部件; 以及具有第二弯曲部的第二引导部件。 第一引导构件被设置成从框架体的外部穿过框架体并且在第一安装构件上延伸并且通过第一弯曲件与其连接。 第二引导构件被设置成从框架体的外部穿过框架体并且延伸穿过第二安装构件并通过第二弯曲件与其连接。

公开(公告)号：US20100206118A1

公开(公告)日：2010-08-19

申请号：US12700425

申请日：2010-02-04

申请人： Fumitaka Nagashima ,  Yoshiaki Ueda ,  Ryusuke Oshiro ,  Tomoyuki Suwabe

发明人： Fumitaka Nagashima ,  Yoshiaki Ueda ,  Ryusuke Oshiro ,  Tomoyuki Suwabe

IPC分类号： F16H59/02 ,  G05G5/00

CPC分类号： F16H61/18 ,  F16H63/3466 ,  F16H63/483 ,  F16H2059/746 ,  F16H2061/326 ,  Y10T74/19251 ,  Y10T74/20018 ,  Y10T74/20067

摘要： In vehicular control method and apparatus for a shift-by-wire device, a selected shift position is modified to at least one of a vehicular parking position, a neutral position, and a traveling position, the selected shift position is modified to the vehicular parking position when a power switch is switched to an OFF position, and the modification of the shift position to the vehicular parking position is inhibited when an operation pattern of an operation input section while the power switch is in the ON position is made coincident with the operation pattern prescribed as a cipher code which inhibits the shift position modification to the vehicular parking position, the operation patterns being constituted by a combination of operation patterns which would not be carried out in the operation section during an ordinary traveling.

摘要翻译： 在用于线控换档装置的车辆控制方法和装置中，所选择的换档位置被修改为车辆停放位置，中立位置和行驶位置中的至少一个，所选择的换档位置被修改为车辆停车 当电源开关切换到OFF位置时的位置，并且当电源开关处于ON位置时操作输入部分的操作模式与操作一致时，禁止对车辆停车位置的换档位置的修改 作为禁止对车辆停车位置的换档位置修改的密码的图案，操作模式由在普通行驶期间不在操作部中执行的操作模式的组合构成。

公开(公告)号：US20100059271A1

公开(公告)日：2010-03-11

申请号：US12375514

申请日：2007-07-27

申请人： Atsurou Yoneda ,  Tetsurou Abumita ,  Yoshiaki Ueda ,  Eiki Tsushima

发明人： Atsurou Yoneda ,  Tetsurou Abumita ,  Yoshiaki Ueda ,  Eiki Tsushima

IPC分类号： H05K7/20

CPC分类号： H01L23/66 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member (1) is used which comprising at least five layers including first metal layers (11) having good thermal conductivity and second metal layers (12) having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (11), the first metal layers (11) and second metal layers (12) being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer (11a) being thicker than that of the lowermost and uppermost layers. Accordingly, heat generated from the electronic component (5) can be dissipated well to the outside, and a coefficient of thermal expansion of a mounting portion (1a) can be brought close to that of the electronic component (5) or the like.

摘要翻译： 提供了一种在操作期间产生大量热量的电子部件存储包装和存储这种电子部件的电子设备。 在电子元器件储存封装和电子设备中，使用散热元件（1），其包括至少五层，包括具有良好导热性的第一金属层（11）和具有较小热导率的第二金属层（12） 与第一金属层（11）相比，第一金属层（11）和第二金属层（12）交替堆叠，第一金属层的最上层和最下层的厚度至少为一个 内部布置的第一金属层（11a）比最下层和最上层的厚度厚。 因此，可以将从电子部件（5）产生的热量良好地散发到外部，并且能够使安装部（1a）的热膨胀系数接近于电子部件（5）的热膨胀系数等。

公开(公告)号：US06967119B2

公开(公告)日：2005-11-22

申请号：US10699553

申请日：2003-10-31

申请人： Taiji Morimoto ,  Keisuke Miyazaki ,  Masaki Tatsumi ,  Kazuhiko Wada ,  Yoshiaki Ueda

发明人： Taiji Morimoto ,  Keisuke Miyazaki ,  Masaki Tatsumi ,  Kazuhiko Wada ,  Yoshiaki Ueda

IPC分类号： H01S5/22 ,  H01S5/30 ,  H01S5/343 ,  H01S5/40 ,  H01L21/00

CPC分类号： B82Y20/00 ,  H01S5/22 ,  H01S5/3054 ,  H01S5/3432 ,  H01S5/34326 ,  H01S5/4031 ,  H01S5/4087

摘要： There is provided a semiconductor laser device having on a single substrate a plurality of laser portions each oscillating laser light of a different wavelength, the plurality of laser portions containing different types, respectively, of dopant. There is also provided a method of fabricating a semiconductor laser device, forming on a single substrate a plurality of laser portions each oscillating laser light of a different wavelength, initially forming a laser portion in a crystal growth method and subsequently forming another laser portion in a different crystal growth method.

摘要翻译： 提供了一种在单个基板上具有分别振荡不同波长的激光的多个激光部分的多个激光部分分别包含不同类型的掺杂剂的半导体激光器件。 还提供一种制造半导体激光器件的方法，在单个基板上形成多个激光器部分，每个激光器各自振荡不同波长的激光，最初在晶体生长方法中形成激光部分，随后在其中形成另一激光器部分 不同的晶体生长方法。

公开(公告)号：USD468070S1

公开(公告)日：2002-12-31

申请号：US29152670

申请日：2001-12-20

申请人： Kazuhiro Fujita ,  Yoshiaki Ueda

设计人： Kazuhiro Fujita ,  Yoshiaki Ueda

公开(公告)号：US06208498B1

公开(公告)日：2001-03-27

申请号：US09203756

申请日：1998-12-02

申请人： Yoshiaki Ueda

发明人： Yoshiaki Ueda

IPC分类号： H01H4704

CPC分类号： F16H61/0251 ,  H01H47/325

摘要： A solenoid supply current value is predicted from a detected battery voltage, an operational fluid temperature, and the like, and a chopper ON time during chopping drive is reduced, and relatively, a chopper OFF time is increased by using, for example, a voltage correction coefficient which becomes smaller as the battery voltage becomes larger, or a temperature correction coefficient which is set smaller as the operational fluid temperature is smaller. Alternatively, an overexciting current of the solenoid is detected at least at two time points during overexcitation, and a termination time point of the overexcitation at which the overexciting current reaches a target overexciting current is predicted from the overexciting current value, and the overexcitation is terminated when the termination time point is reached.

摘要翻译： 从检测到的电池电压，工作液温度等预测电磁线圈供给电流值，减少斩波驱动时的斩波导通时间，相对地，通过使用例如电压 校正系数随着电池电压变大而变小，或随着工作流体温度变小而设定得较小的温度校正系数。 或者，至少在过激励期间的两个时间点检测螺线管的过励磁电流，并且根据过励磁电流值预测过励磁电流达到目标过励磁电流的过励磁终止时间点，并且过励磁终止 当达到终止时间点。

公开(公告)号：US5848366A

公开(公告)日：1998-12-08

申请号：US653888

申请日：1996-05-28

申请人： Yoshiaki Ueda

发明人： Yoshiaki Ueda

IPC分类号： F02D45/00 ,  B60K11/04 ,  F01P7/04 ,  F02D29/04 ,  F02D41/00 ,  F02D41/22 ,  F01P11/00 ,  G06F7/00

CPC分类号： B60K11/04

摘要： A load driving control system for an automotive vehicle having a load such as an electric motor for a radiator fan. The load driving control system comprises a microcomputer storing a load driving necessariness decision program by which a decision is made as to whether driving of the load is necessary or not in accordance with the detected vehicle operating condition so as to output one of load driving necessariness and unnecessariness commands. A load driving circuit is provided to provide a driving current in response to the load driving necessariness command, thereby driving the load. Additionally, a load compulsorily driving requirement circuit is provided to compulsorily drive the load when the microcomputer stops outputting each command even though an ignition key switch is turned ON.

摘要翻译： 一种用于具有诸如用于散热器风扇的电动机的负载的机动车辆的负载驱动控制系统。 负载驱动控制系统包括存储负载驱动必要性判定程序的微型计算机，根据检测到的车辆运转状况，判定是否需要负载驱动，以输出负载驱动必要性之一， 不必要的命令。 提供负载驱动电路以响应于负载驱动必要性命令提供驱动电流，从而驱动负载。 此外，即使点火钥匙开关接通，也提供负载强制驱动要求电路，以强制驱动负载。