公开(公告)号：US08837164B2

公开(公告)日：2014-09-16

申请号：US12865107

申请日：2010-01-22

申请人： Kazuhiro Kawabata ,  Kiyoshige Miyawaki ,  Yoshiaki Ueda ,  Shinji Nakamoto ,  Tsutomu Sugimoto

发明人： Kazuhiro Kawabata ,  Kiyoshige Miyawaki ,  Yoshiaki Ueda ,  Shinji Nakamoto ,  Tsutomu Sugimoto

IPC分类号： H05K7/02 ,  H01L23/367 ,  H01L23/36 ,  H01L23/057

CPC分类号： H01L23/3675 ,  H01L23/057 ,  H01L23/36 ,  H01L23/3677 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  Y10T29/49121 ,  H01L2924/00014

摘要： There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion.The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.

摘要翻译： 提供了一种用于安装装置的基板和用于容纳使用其的装置的封装，其中功率半导体装置可以容易地设定为适合于操作的温度，并且因此可以以适当的方式起作用。 用于安装装置的基板包括：支撑体，其在支撑体的一个主表面上具有用于安装功率半导体器件的器件安装部分，所述支撑体具有多个沿厚度方向间隔开的柱状部分， 相对于装置安装部分并且彼此分开布置; 以及集热区域，其设置在所述柱状部件之间，并且导热率低于所述支撑体。

公开(公告)号：US5620796A

公开(公告)日：1997-04-15

申请号：US419532

申请日：1995-04-10

申请人： Kazuhiro Kawabata ,  Norio Numata

发明人： Kazuhiro Kawabata ,  Norio Numata

IPC分类号： C09J7/02 ,  C08F2/24 ,  C08F20/10 ,  C08F220/10 ,  C08F220/18 ,  C09J4/02 ,  C09J133/04 ,  C09J133/06

CPC分类号： C08F220/18 ,  C09J133/064 ,  Y10T428/2891

摘要： A method of producing an acrylic emulsion adhesive characterized in that a composition comprising 100 parts by weight of a monomeric mixture of alkyl (meth)acrylate, acrylic acid, methacrylic acid and N-vinylpyrrolidone, 0.5-2 parts by weight of a surfactant mixture of an anionic surfactant and a nonionic surfactant, and 0.03 to 0.5 part by weight of a polymerization initiator is subjected to emulsion polymerization reaction. The acrylic emulsion adhesive of this invention is rich in solids, features good adhesion and cohesion as well as high water resistance. Therefore, by coating one side of a transparent support, this adhesive can be used as an adhesive sheet for surface protection.

摘要翻译： 一种制备丙烯酸乳液粘合剂的方法，其特征在于包含100重量份的（甲基）丙烯酸烷基酯，丙烯酸，甲基丙烯酸和N-乙烯基吡咯烷酮的单体混合物的组合物，0.5-2重量份的 阴离子表面活性剂和非离子表面活性剂以及0.03〜0.5重量份的聚合引发剂进行乳液聚合反应。 本发明的丙烯酸乳液粘合剂富含固体，具有良好的附着力和内聚力以及高耐水性。 因此，通过涂覆透明支撑体的一侧，该粘合剂可用作表面保护用粘合片。

公开(公告)号：US5079491A

公开(公告)日：1992-01-07

申请号：US355454

申请日：1989-05-22

申请人： Hidetaka Nose ,  Kazuhiro Kawabata ,  Yoshihiko Suzuki ,  Toshiaki Nagasawa

发明人： Hidetaka Nose ,  Kazuhiro Kawabata ,  Yoshihiko Suzuki ,  Toshiaki Nagasawa

IPC分类号： B25J9/18 ,  G05B19/414 ,  G05B19/425 ,  G05B19/427

CPC分类号： G05B19/425 ,  G05B19/4148 ,  G05B19/427 ,  G05B2219/33338 ,  G05B2219/34076 ,  G05B2219/45104

摘要： A robot control system including a robot, a robot controller for controlling operation of the robot, and a teaching box for teaching the robot through the robot controller. The teaching box includes an input unit separate from the robot controller for entering a command signal to teach the robot its operation to be effected and a control unit for controlling the input unit and processing and for applying the command signal to the robot controller.

摘要翻译： 一种机器人控制系统，包括机器人，用于控制机器人的操作的机器人控制器，以及用于通过机器人控制器教导机器人的教学箱。 教学箱包括与机器人控制器分离的输入单元，用于输入命令信号以教导机器人执行其操作;以及控制单元，用于控制输入单元并处理并将命令信号施加到机器人控制器。

公开(公告)号：US5053976A

公开(公告)日：1991-10-01

申请号：US355455

申请日：1989-05-22

申请人： Hidetaka Nose ,  Kazuhiro Kawabata ,  Yoshihiko Suzuki

发明人： Hidetaka Nose ,  Kazuhiro Kawabata ,  Yoshihiko Suzuki

IPC分类号： B25J9/16 ,  G05B19/427

CPC分类号： B25J9/1607 ,  G05B19/427

摘要： An articulated robot such as an arc welding robot includes a plurality of articulations and an end effector having a tool center point. To teach the robot, a coordinate transformation matrix for transforming coordinates between the articulations is determined from condition data of the articulations. A present position of the tool center point is calculated based on the coordinate transformation matrix and a moving vector is determined from the present position of the tool center point to a next position thereof. Thereafter, a new coordinate transformation matrix for transforming coordinates between the articulations is determined so that the posture of the end effector at the next position of the tool center point, which is calculated based on the first-mentioned coordinate transformation matrix and the moving vector, will coincide with the posture of the end effector at the present position of the tool center point. Then, new condition data of the articulations are calculated from the new coordinate transformation matrix.

摘要翻译： 诸如电弧焊机器人的铰接机器人包括多个铰接件和具有工具中心点的端部执行器。 为了教导机器人，从关节的条件数据确定用于变换关节之间的坐标的坐标变换矩阵。 基于坐标变换矩阵计算工具中心点的当前位置，并且从工具中心点的当前位置到其下一位置确定移动向量。 此后，确定用于变换关节之间的坐标的新的坐标变换矩阵，使得基于前述坐标变换矩阵和移动矢量计算出的工具中心点的下一个位置处的末端执行器的姿势， 将与工具中心点的当前位置处的末端执行器的姿势一致。 然后，从新的坐标变换矩阵计算关节的新条件数据。

公开(公告)号：US07588698B2

公开(公告)日：2009-09-15

申请号：US11578334

申请日：2005-12-02

申请人： Hideaki Toshioka ,  Masamichi Yamamoto ,  Kazuhiro Kawabata

发明人： Hideaki Toshioka ,  Masamichi Yamamoto ,  Kazuhiro Kawabata

IPC分类号： H01B1/00 ,  H01B1/04 ,  H01B1/06 ,  H01B1/02 ,  H01B1/22

CPC分类号： C09J163/00 ,  C09J9/02 ,  H01B1/22 ,  H01B1/24 ,  H01R4/04

摘要： A circuit coupling adhesive which is superior in heat resistance and moisture resistance is provided. The circuit coupling adhesive of the present invention can be used for purposes where high performing reliability is required, since it exhibits satisfactory electroconductive/insulative performance at connection of electrodes, etc. and the characteristics will not be varied so much even after a long period of use in a high temperature and high humidity environment. The circuit coupling adhesive comprises, as the essential ingredients, an epoxy resin, a latent curing agent, inorganic fillers having an average particle diameter of 500 nm or less, and electro-conductive particles. By mix a sufficient amount of inorganic fillers having an average particle diameter of 500 nm or less, the coefficient of thermal expansion can be decreased and the heat resistance and moisture resistance can be improved.

摘要翻译： 提供了耐热性和耐湿性优异的电路耦合粘合剂。 本发明的电路耦合粘合剂可以用于需要高性能可靠性的目的，因为它在电极连接时表现出令人满意的导电/绝缘性能，并且特性即使在长时间 在高温高湿环境下使用。 电路耦合粘合剂包括环氧树脂，潜伏性固化剂，平均粒径为500nm以下的无机填料和导电性颗粒作为必要成分。 通过混合足量的平均粒径为500nm以下的无机填料，能够降低热膨胀系数，提高耐热性和耐湿性。

公开(公告)号：US06317560B1

公开(公告)日：2001-11-13

申请号：US09203517

申请日：1998-12-01

申请人： Kazuhiro Kawabata

发明人： Kazuhiro Kawabata

IPC分类号： G03B1500

CPC分类号： H04N1/00286 ,  G03B15/00 ,  H04N1/00289 ,  H04N1/34

摘要： A photographing system comprises a photographing box (16) capable of accommodates a user (17) and of allowing the user (17) to change a pose, a lighting means (2) installed in the photographing box (16), and a photographing means (3) installed in the photographing box (16). A printing means (8) prints out pictures on the basis of photographic data provided by the photographing means (3). The lighting means (2), the photographing means (3) and the printing means (8) are controlled by a synchronizing control means (9).

摘要翻译： 拍摄系统包括能够容纳用户（17）并且允许用户（17）改变姿势的拍摄盒（16），安装在拍摄盒（16）中的照明装置（2）和拍摄装置 （3）安装在摄影盒（16）中。 打印装置（8）基于由拍摄装置（3）提供的摄影数据打印出图像。 照明装置（2），摄影装置（3）和打印装置（8）由同步控制装置（9）控制。

公开(公告)号：US5286781A

公开(公告)日：1994-02-15

申请号：US868166

申请日：1992-04-14

申请人： Masahiko Gotoh ,  Shigehisa Kobayashi ,  Kazuhiro Kawabata

发明人： Masahiko Gotoh ,  Shigehisa Kobayashi ,  Kazuhiro Kawabata

IPC分类号： C09J123/08 ,  C09J153/02

CPC分类号： C09J123/0815 ,  C09J153/02 ,  Y10T428/2878 ,  Y10T428/2883

摘要： Disclosed herein is a pressure sensitive adhesive composition comprising 100 parts by weight of at least one block copolymer selected from the group consisting of block copolymers represented by the general formula A-B-A and block copolymers represented by the general formula A-B, wherein A means a styrene polymer block and B denotes a butadiene polymer block, an isoprene polymer block or a polymer block obtained by hydrogenating these polymers, 100-200 parts by weight of a tackifying resin and 25-200 parts by weight of a polyolefin. Pressure sensitive adhesive tapes or sheets comprising, as a pressure sensitive adhesive layer, the pressure sensitive adhesive composition are also disclosed.

摘要翻译： 本文公开了一种压敏粘合剂组合物，其包含100重量份的至少一种选自由通式ABA表示的嵌段共聚物和由通式AB表示的嵌段共聚物的嵌段共聚物，其中A表示苯乙烯聚合物嵌段 B表示丁二烯聚合物嵌段，异戊二烯聚合物嵌段或通过氢化这些聚合物获得的聚合物嵌段，100-200重量份增粘树脂和25-200重量份聚烯烃。 还公开了包含作为压敏粘合剂层的压敏粘合剂组合物的压敏粘合带或片材。

公开(公告)号：US5212361A

公开(公告)日：1993-05-18

申请号：US797343

申请日：1991-11-25

申请人： Naoki Miyazaki ,  Kazuhiro Kawabata

发明人： Naoki Miyazaki ,  Kazuhiro Kawabata

IPC分类号： H01L21/60 ,  B23K20/00

CPC分类号： H01L24/78 ,  B23K20/007 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01057 ,  H01L2924/14

摘要： A method of forming a ball on the end of a wire by electrical discharge between the wire and an electrode includes detecting the discharge voltage and discharge current of an electrical discharge between an end of a wire having a diameter and an electrode; multiplying the discharge voltage by the discharge current for respective time intervals during the discharge to compute the heat energy supplied in the discharge during each time interval; integrating the heat energy for the time intervals during a discharge to determine the total heat energy supplied during the discharge; comparing the total heat energy with a predetermined heat energy that produces a ball on the end of the wire, the ball having a diameter of about two to three and one-half times the diameter of the wire; and controlling at least one of the discharge voltage, current, and duration in accordance with the comparison and terminating the discharge when the total heat energy supplied to the discharge exceeds the predetermined heat energy.

摘要翻译： 通过在线和电极之间的放电在线的端部形成球的方法包括检测在具有直径的电极的端部和电极之间的放电的放电电压和放电电流; 在放电期间将放电电压乘以放电电流各时间间隔，以计算在每个时间间隔期间在放电中供应的热能; 在放电期间将热能积分在时间间隔内以确定在放电期间供应的总热能; 将总热能与在线的端部产生球的预定热能进行比较，所述球的直径为线的直径的大约二至三倍半; 并且根据比较来控制放电电压，电流和持续时间中的至少一个，并且当提供给放电的总热能超过预定热能时终止放电。

公开(公告)号：US09091398B2

公开(公告)日：2015-07-28

申请号：US14118595

申请日：2012-01-31

申请人： Yasuhisa Ueda ,  Kazuhiro Kawabata ,  Masahiro Miki ,  Takaari Uemoto

发明人： Yasuhisa Ueda ,  Kazuhiro Kawabata ,  Masahiro Miki ,  Takaari Uemoto

IPC分类号： F21K99/00 ,  F21V23/00 ,  F21V23/02 ,  F21V3/00 ,  F21Y101/02 ,  F21Y103/00 ,  H05K3/34

CPC分类号： F21K9/1355 ,  F21K9/23 ,  F21K9/238 ,  F21K9/27 ,  F21K9/60 ,  F21K9/65 ,  F21V3/00 ,  F21V23/001 ,  F21V23/002 ,  F21V23/02 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10492 ,  H05K2201/10962

摘要： A lamp includes an LED module, a drive unit supplying power to the LED module, and a base via which power is fed from an external power supply to the drive unit. The drive unit is located between the LED module and the base. The drive unit includes a circuit board having a main surface on which lead-type electronic components are mounted, lead wires (first lead wires) extending from the main surface of the circuit board and connected to the LED module, and lead wires (second lead wires) extending from the main surface of the circuit board and connected to the base. The circuit board has a through-hole extending from the main surface to an opposite surface thereof. The lead wires pass through the through-hole.

摘要翻译： 灯包括LED模块，向LED模块供电的驱动单元以及从外部电源向驱动单元供电的底座。 驱动单元位于LED模块和底座之间。 驱动单元包括具有主表面的电路板，引线型电子部件安装在该主表面上，从电路板的主表面延伸并连接到LED模块的引线（第一引线）和引线（第二引线 电线），其从电路板的主表面延伸并连接到基座。 电路板具有从主表面延伸到其相对表面的通孔。 引线穿过通孔。

公开(公告)号：US20110273846A1

公开(公告)日：2011-11-10

申请号：US12865107

申请日：2010-01-22

申请人： Kazuhiro Kawabata ,  Kiyoshige Miyawaki ,  Yoshiaki Ueda ,  Shinji Nakamoto ,  Tsutomu Sugimo

发明人： Kazuhiro Kawabata ,  Kiyoshige Miyawaki ,  Yoshiaki Ueda ,  Shinji Nakamoto ,  Tsutomu Sugimo

IPC分类号： H05K7/20

CPC分类号： H01L23/3675 ,  H01L23/057 ,  H01L23/36 ,  H01L23/3677 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/09701 ,  Y10T29/49121 ,  H01L2924/00014

摘要： There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion.The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.

摘要翻译： 提供了一种用于安装装置的基板和用于容纳使用其的装置的封装，其中功率半导体装置可以容易地设定为适合于操作的温度，并且因此可以以适当的方式起作用。 用于安装装置的基板包括：支撑体，其在支撑体的一个主表面上具有用于安装功率半导体器件的器件安装部分，所述支撑体具有多个沿厚度方向间隔开的柱状部分， 相对于装置安装部分并且彼此分开布置; 以及集热区域，其设置在所述柱状部件之间，并且导热率低于所述支撑体。