Abstract:
A semiconductor laser comprises: a substrate; an n-cladding layer disposed on the substrate; an active layer disposed on the n-cladding layer; a p-cladding layer disposed on the active layer and forming a waveguide ridge; and a diffraction grating layer disposed between the active layer and the n-cladding layer or the p-cladding layer and including a phase shift structure in a part of the diffraction grating layer in an optical waveguide direction. The width of the p-cladding layer is increased in a portion corresponding to the phase shift structure of the diffraction grating layer.
Abstract:
A semiconductor optical element has an active layer including quantum dots. The density of quantum dots in the resonator direction in a portion of the active layer in which the density of photons is relatively high is increased relative to the density of quantum dots in a portion of the active layer in which the density of photons is relatively low.
Abstract:
In a gain-coupled distributed feedback semiconductor laser, a coating of a low reflectivity is provided on a front facet from which laser light is emitted and a coating of a high reflectivity is provided on a rear facet, thus forming asymmetric coatings. The semiconductor laser has a structure in which an absorption diffraction grating is located along an optical waveguide, and the diffraction grating includes a phase shift region.
Abstract:
A kink-free semiconductor optical device stabilizing laser oscillation and producing a high optical performance. The semiconductor optical device includes a beam waveguide extending in a longitudinal direction between a pair of end surfaces. The beam waveguide includes an active layer having a quantum well structure with at least one well layer and two barrier layers, and a pair of cladding layers sandwiching the active layer. The active layer has first and second regions in the longitudinal direction, the photon density in the first region being larger than in the second region. The first region has a differential gain greater than the second region so that variation of refractive index across the beam waveguide is reduced.
Abstract:
A modulator and an integrated semiconductor modulator-laser device, in which the capacitance of the modulator is reduced to increase the cut-off frequency, and a manufacturing process for the device. A wire layer connecting a modulator electrode to a pad electrode is interposed between a first embedded layer of InP doped with Fe, extending from the modulator portion, between the insulating layer and the substrate. The wire layer has a capacitance smaller than when the first embedded layer is not beneath the insulating layer. The cut-off frequency of the modulator is increased, improving frequency characteristics. An integrated semiconductor modulator-laser device can include such a modulator.
Abstract:
A semiconductor laser device in which a semiconductor laser emitting laser light and a light modulator modulating the laser light are integrated on a compound semiconductor substrate, includes a hole trapping layer for suppressing a reactive current that is generated when the semiconductor laser is operated and that does not contribute to laser oscillation. The hole trapping layer has a first region in the semiconductor laser and a second region in the light modulator. The hole trapping layer has a high carrier concentration and a low resistance and is discontinuous between the semiconductor laser and the light modulator, so that isolation between the laser and the modulator is increased, whereby a high-frequency signal applied to the light modulator is prevented from flowing through the hole trapping layer into the laser. Therefore, even when long-distance transmission is carried out using the semiconductor laser device, deterioration of transmitted wave is suppressed, resulting in satisfactory transmission characteristics.
Abstract:
A semiconductor laser includes an n type semiconductor substrate, an n type cladding layer, an active layer having an effective band gap energy, a p type cladding layer, and a tunnel diode structure including a high dopant concentration p type semiconductor layer and a high dopant concentration n type semiconductor layer having an effective band gap energy larger than the effective band gap energy of the active layer, a p side electrode disposed on the tunnel diode structure, and an n side electrode disposed on the rear surface of the n type semiconductor substrate. Since this semiconductor laser includes the tunnel diode structure disposed in the reverse bias direction with respect to the current flow direction, the contact resistivity of the ohmic contact of the p side electrode is lowered as compared to the case where the p side electrode is disposed on a p type semiconductor layer. The effective contact resistivity of the p side electrode is reduced. As a result, a semiconductor laser including a p side electrode having a low contact resistivity ohmic contact is realized.
Abstract:
A semiconductor laser device includes a semiconductor laser chip containing a diode having a polarity; a heat sink on which the semiconductor laser chip is mounted at an interface of the semiconductor laser chip and the heat sink, the heat sink including a pn junction generally parallel to the interface; and a block on which the heat sink is mounted, wherein the diode of the semiconductor laser chip and the pn junction are electrically connected in parallel and in opposite polarity so that the pn junction of the heat sink functions as a reverse current blocking diode for the semiconductor laser chip.
Abstract:
A method is provided for the reduction of the level of dimethyl polysilioxane remaining in a silicone rubber product containing said dimethyl polysiloxane to an ultra-micro level, comprising the steps of immersing the silicone rubber product in an organic solvent for the dimethyl polysiloxane and subjecting the immersed product to ultrasonic vibrations in the organic solvent.
Abstract:
A simple silicone-rubber bonded object is provided in which non-flowable substrates, i.e., a three-dimensional silicone rubber elastic substrate molded beforehand and an adherend substrate, were able to be tenaciously bonded to each other without using a flowable curable adhesive or pressure-sensitive adhesive and which is inexpensive and has high productivity. The silicone-rubber bonded object comprises a three-dimensional silicone rubber elastic substrate having hydroxyl groups on the surface and an adherend substrate having hydroxyl groups on the surface, the substrates having been laminated to each other through covalent bonding between the hydroxyl groups of both. The elastic substrate and/or the adherend substrate has undergone corona discharge treatment and/or plasma treatment, whereby the hydroxyl groups have been formed on the surface thereof.