SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20120043630A1

    公开(公告)日:2012-02-23

    申请号:US13181742

    申请日:2011-07-13

    IPC分类号: H01L29/82 H01L21/8246

    摘要: In MRAM, a write wiring clad in a ferromagnetic film has been used to reduce a write current or avoid disturbances. Besides, a CuAl wiring obtained by adding a trace of Al to a Cu wiring has been used widely to secure reliability of a high reliability product. There is a high possibility of MRAM being mounted in high reliability products so that reliability is important. Clad wiring however increases the resistance of the CuAl wiring, which is originally high, so that using both may fail to satisfy the specification of the wiring resistance. In the semiconductor device of the invention having plural copper-embedded wiring layers, copper wiring films of plural copper-embedded clad wirings configuring a memory cell matrix region of MRAM are made of relatively pure copper, while a CuAl wiring film is used as copper wiring films of copper-embedded non-clad wirings below these wiring layers.

    摘要翻译: 在MRAM中,已经使用包裹在铁磁膜中的写入布线来减小写入电流或避免干扰。 此外,通过在Cu布线中添加痕量的Al而获得的CuAl布线被广泛地用于确保高可靠性产品的可靠性。 在高可靠性产品中安装MRAM的可能性很大,因此可靠性很重要。 然而,包层线路增加了原来高的CuAl布线的电阻,因此使用两者可能不能满足布线电阻的规格。 在具有多个铜嵌入布线层的本发明的半导体器件中,构成MRAM的存储单元矩阵区域的多个嵌入铜包布线的铜布线膜由相对纯的铜制成,而CuAl布线膜用作铜布线 在这些布线层下面的铜嵌入的非覆盖布线的膜。

    Semiconductor device and manufacturing method thereof
    2.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US08492808B2

    公开(公告)日:2013-07-23

    申请号:US13181742

    申请日:2011-07-13

    摘要: In MRAM, a write wiring clad in a ferromagnetic film has been used to reduce a write current or avoid disturbances. Besides, a CuAl wiring obtained by adding a trace of Al to a Cu wiring has been used widely to secure reliability of a high reliability product. There is a high possibility of MRAM being mounted in high reliability products so that reliability is important. Clad wiring however increases the resistance of the CuAl wiring, which is originally high, so that using both may fail to satisfy the specification of the wiring resistance. In the semiconductor device of the invention having plural copper-embedded wiring layers, copper wiring films of plural copper-embedded clad wirings configuring a memory cell matrix region of MRAM are made of relatively pure copper, while a CuAl wiring film is used as copper wiring films of copper-embedded non-clad wirings below these wiring layers.

    摘要翻译: 在MRAM中,已经使用包裹在铁磁膜中的写入布线来减小写入电流或避免干扰。 此外,通过在Cu布线中添加痕量的Al而获得的CuAl布线被广泛地用于确保高可靠性产品的可靠性。 在高可靠性产品中安装MRAM的可能性很大,因此可靠性很重要。 然而,包层线路增加了原来高的CuAl布线的电阻,因此使用两者可能不能满足布线电阻的规格。 在具有多个铜嵌入布线层的本发明的半导体器件中,构成MRAM的存储单元矩阵区域的多个嵌入铜包布线的铜布线膜由相对纯的铜制成,而CuAl布线膜用作铜布线 在这些布线层下面的铜嵌入的非覆盖布线的膜。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20110057275A1

    公开(公告)日:2011-03-10

    申请号:US12874894

    申请日:2010-09-02

    IPC分类号: H01L29/66 H01L21/04

    摘要: To provide a semiconductor device capable of write operation to a selected magnetoresistive element without causing a malfunction of a non-selected magnetoresistive element and a manufacturing method of this semiconductor device. The semiconductor device includes a magnetic storage element having a magnetization free layer whose magnetization direction is made variable and formed over a lead interconnect and a digit line located below the magnetic storage element, extending in a first direction, and capable of changing the magnetization state of the magnetization free layer by the magnetic field generated. The digit line includes an interconnect body portion and a cladding layer covering therewith the bottom surface and the side surface of the interconnect body portion and opened upward. The cladding layer includes a sidewall portion covering therewith the side surface of the interconnect body portion and a bottom wall portion covering therewith the bottom surface of the interconnect body portion. The thickness of the sidewall portion is made greater than that of the bottom wall portion.

    摘要翻译: 提供能够对选定的磁阻元件进行写入操作而不引起未选择的磁阻元件的故障的半导体器件和该半导体器件的制造方法。 半导体器件包括具有磁化自由层的磁存储元件,该磁化自由层的磁化方向是可变的,并且形成在引线互连和位于磁存储元件下方的位于第一方向上的数字线,并且能够改变磁化状态 磁化自由层由磁场产生。 数字线包括互连主体部分和覆盖互连体部分的底表面和侧表面并向上敞开的覆层。 包覆层包括覆盖互连主体部分的侧表面的侧壁部分和覆盖互连主体部分的底表面的底壁部分。 侧壁部分的厚度大于底壁部分的厚度。

    Semiconductor device and manufacturing method thereof
    4.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US08227880B2

    公开(公告)日:2012-07-24

    申请号:US12874894

    申请日:2010-09-02

    IPC分类号: H01L29/82

    摘要: To provide a semiconductor device capable of write operation to a selected magnetoresistive element without causing a malfunction of a non-selected magnetoresistive element and a manufacturing method of this semiconductor device. The semiconductor device includes a magnetic storage element having a magnetization free layer whose magnetization direction is made variable and formed over a lead interconnect and a digit line located below the magnetic storage element, extending in a first direction, and capable of changing the magnetization state of the magnetization free layer by the magnetic field generated. The digit line includes an interconnect body portion and a cladding layer covering therewith the bottom surface and the side surface of the interconnect body portion and opened upward. The cladding layer includes a sidewall portion covering therewith the side surface of the interconnect body portion and a bottom wall portion covering therewith the bottom surface of the interconnect body portion. The thickness of the sidewall portion is made greater than that of the bottom wall portion.

    摘要翻译: 提供能够对选定的磁阻元件进行写入操作而不引起未选择的磁阻元件的故障的半导体器件和该半导体器件的制造方法。 半导体器件包括具有磁化自由层的磁存储元件,该磁化自由层的磁化方向是可变的,并且形成在引线互连和位于磁存储元件下方的位于第一方向上的数字线,并且能够改变磁化状态 磁化自由层由磁场产生。 数字线包括互连主体部分和覆盖互连体部分的底表面和侧表面并向上敞开的覆层。 包覆层包括覆盖互连主体部分的侧表面的侧壁部分和覆盖互连主体部分的底表面的底壁部分。 侧壁部分的厚度大于底壁部分的厚度。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
    6.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法和半导体器件

    公开(公告)号:US20100044864A1

    公开(公告)日:2010-02-25

    申请号:US12481234

    申请日:2009-06-09

    IPC分类号: H01L23/48 H01L21/3205

    摘要: The present invention aims at providing a method of manufacturing a semiconductor device capable of suppressing metal diffusion from the upper face of wiring.In the present invention, a copper seed film containing copper and a first metal element is formed in a groove formed in a first interlayer film over a semiconductor substrate. After that, a copper plating treatment is performed. After that, a first heat treatment is performed in a first atmosphere in which the copper layer is not oxidized. Then, an excess metal layer of copper alloy is removed and copper alloy wiring is formed in the groove. After that, a second heat treatment is performed in a second atmosphere containing oxygen to form an oxide layer being the oxide of the first metal element over the surface of the copper alloy wiring.

    摘要翻译: 本发明的目的在于提供一种能够抑制从布线的上表面的金属扩散的半导体器件的制造方法。 在本发明中,在半导体衬底上形成在第一层间膜中的沟槽中形成含有铜和第一金属元素的铜籽晶膜。 之后,进行镀铜处理。 之后,在铜层未被氧化的第一气氛中进行第一热处理。 然后,除去铜合金的过量金属层,并在槽内形成铜合金布线。 之后,在包含氧的第二气氛中进行第二热处理,以在铜合金布线的表面上形成作为第一金属元件的氧化物的氧化物层。

    Tax return preparation automatic document capture and parsing system

    公开(公告)号:US09959577B1

    公开(公告)日:2018-05-01

    申请号:US11529039

    申请日:2006-09-28

    申请人: Kenichi Mori

    发明人: Kenichi Mori

    IPC分类号: G06Q40/00

    CPC分类号: G06Q40/123

    摘要: A document capture system may automatically capture documents and/or financial information for a user. The document capture system may capture and save documents a user views in a web browser. A user may visit various web sites to view financial data and a document capture plug-in module installed in the web browser may capture or save the viewed document. The document capture system may capture financial data while the user is visiting web sites normally—that is, not just when the user if visiting them particularly to collect financial data. The document capture system may be configured to automatically detect when the user views certain documents and may be configured to continually monitor the user's web activity in order to capture financial documents whenever the user visits certain sites. The document capture system may include a list of URLs representing web sites or documents that should be automatically captured.

    MACHINING APPARATUS
    8.
    发明申请
    MACHINING APPARATUS 审中-公开
    加工设备

    公开(公告)号:US20140260840A1

    公开(公告)日:2014-09-18

    申请号:US14175176

    申请日:2014-02-07

    申请人: Kenichi Mori

    发明人: Kenichi Mori

    IPC分类号: B23B5/16

    CPC分类号: B23B5/163 B23B3/26 Y10T82/22

    摘要: In a machining apparatus, complete control of the movement, stopping, speed and displacement of a tool mounted on a rotating face plate is achieved by using a first motor to cause rotation of the face plate, causing the first motor to rotate a ring gear along with the face plate, controlling the relative speeds of the face plate and the ring gear by means of a second motor and a differential mechanism, and moving the tool on the face plate in response to a difference in the rotational speeds of the face plate and the ring gear.

    摘要翻译: 在加工装置中,通过使用第一马达来引起面板的旋转来实现对安装在旋转面板上的工具的运动,停止,速度和位移的完全控制,使得第一马达沿着环形齿轮旋转 与面板一起,通过第二电动机和差速机构控制面板和环形齿轮的相对速度,并且响应于面板和第二电动机的转速差而在面板上移动工具 齿圈。