Substrate processing apparatus and substrate processing method
    3.
    发明申请
    Substrate processing apparatus and substrate processing method 有权
    基板加工装置及基板处理方法

    公开(公告)号:US20060104635A1

    公开(公告)日:2006-05-18

    申请号:US11273439

    申请日:2005-11-10

    IPC分类号: G03D5/00

    CPC分类号: G03F7/70991 Y10S414/135

    摘要: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. A resist film is formed on a substrate in the resist film processing block. A resist cover film is formed on the resist film in the resist cover film processing block before the substrate is subjected to exposure processing by the exposure device.

    摘要翻译: 基板处理装置包括分度器块,抗反射膜处理块,抗蚀剂膜处理块,显影处理块,抗蚀剂覆盖膜处理块,抗蚀剂覆盖膜去除块和界面块。 曝光装置设置在接口块附近。 在抗蚀剂膜处理块中的基板上形成抗蚀剂膜。 在通过曝光装置对基板进行曝光处理之前,在抗蚀剂覆盖膜处理块的抗蚀剂膜上形成抗蚀剂覆盖膜。

    Substrate processing apparatus and substrate processing method
    7.
    发明授权
    Substrate processing apparatus and substrate processing method 有权
    基板加工装置及基板处理方法

    公开(公告)号:US07726891B2

    公开(公告)日:2010-06-01

    申请号:US11273439

    申请日:2005-11-10

    IPC分类号: G03D5/00 G03B27/32 B05C11/00

    CPC分类号: G03F7/70991 Y10S414/135

    摘要: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. A resist film is formed on a substrate in the resist film processing block. A resist cover film is formed on the resist film in the resist cover film processing block before the substrate is subjected to exposure processing by the exposure device.

    摘要翻译: 基板处理装置包括分度器块,抗反射膜处理块,抗蚀剂膜处理块,显影处理块,抗蚀剂覆盖膜处理块,抗蚀剂覆盖膜去除块和界面块。 曝光装置设置在接口块附近。 在抗蚀剂膜处理块中的基板上形成抗蚀剂膜。 在通过曝光装置对基板进行曝光处理之前,在抗蚀剂覆盖膜处理块的抗蚀剂膜上形成抗蚀剂覆盖膜。