公开(公告)号：US20150124462A1

公开(公告)日：2015-05-07

申请号：US14339611

申请日：2014-07-24

Applicant: Lextar Electronics Corporation

Inventor： Li-Cheng YANG

IPC: F21V19/00 ,  F21K99/00 ,  F21V21/00

CPC classification number: F21K9/232 ,  F21Y2107/40 ,  F21Y2115/10

Abstract: A light emitting diode (LED) substrate includes a substrate body, a positive circuit and a negative circuit. The substrate body includes a light source disposing face having a main disposing surface and at least one sub-disposing surface, in which the at least one sub-disposing surface is disposed around the main disposing surface and has an inclined angle with the main disposing surface. The positive circuit and the negative circuit are buried inside the substrate body and connected to the main disposing surface and the sub-disposing surface.

Abstract translation: 发光二极管（LED）基板包括基板主体，正电路和负电路。 基板主体包括：具有主设置面的光源配置面和至少一个副配置面，所述至少一个副配置面设置在主配置表面周围并与主设置表面成倾角 。 正电路和负电路埋设在基板主体内并连接到主设置表面和副处理表面。

公开(公告)号：US20150108516A1

公开(公告)日：2015-04-23

申请号：US14278564

申请日：2014-05-15

Applicant: Lextar Electronics Corporation

Inventor： Li-Cheng YANG

IPC: H01L33/50 ,  H01L33/54 ,  H01L27/15

CPC classification number: H01L33/50 ,  H01L33/44

Abstract: A light emitting diode package structure includes a substrate, a light emitting diode chip, a light mixing encapsulating layer, and an ultraviolet protecting layer. The light emitting diode chip is disposed on a surface of the substrate and the light mixing encapsulating layer covers the light emitting diode chip. The ultraviolet protecting layer is adhered to a surface of the light mixing encapsulating layer such that when the ultraviolet protecting layer receives ultraviolet, the color change occurs to reflect or absorb the ultraviolet.

Abstract translation: 发光二极管封装结构包括衬底，发光二极管芯片，光混合封装层和紫外线保护层。 发光二极管芯片设置在基板的表面上，光混合封装层覆盖发光二极管芯片。 紫外线保护层粘附到光混合封装层的表面，使得当紫外线保护层接收紫外线时，发生颜色变化以反射或吸收紫外线。

公开(公告)号：US20190131342A1

公开(公告)日：2019-05-02

申请号：US16171334

申请日：2018-10-25

Applicant: Lextar Electronics Corporation

Inventor： Yi-Jyun CHEN ,  Li-Cheng YANG ,  Yu-Chun LEE ,  Shiou-Yi KUO ,  Chih-Hao LIN

IPC: H01L27/15 ,  H01L33/50 ,  H01L33/38 ,  H01L33/08 ,  H01L33/52 ,  H01L25/075

Abstract: A pixel structure includes a light emitting diode chip and a light blocking structure. The light emitting diode chip includes a P-type semiconductor layer, an active layer, an N-type semiconductor layer, a first electrode, and K second electrodes. The active layer is located on the P-type semiconductor layer. The N-type semiconductor layer is located on the active layer. The N-type semiconductor layer has a first top surface that is distant from the active layer. The first electrode is electrically connected to the P-type semiconductor layer. The light blocking structure is located in the light emitting diode chip and defines K sub-pixel regions. The active layer and the N-type semiconductor layer are divided into K sub-portions respectively corresponding to the K sub-pixel regions by the light blocking structure. The K sub-pixel regions share the P-type semiconductor layer.

公开(公告)号：US20140361323A1

公开(公告)日：2014-12-11

申请号：US14149051

申请日：2014-01-07

Applicant: Lextar Electronics Corporation

Inventor： Li-Cheng YANG ,  Yu-Chun LEE

IPC: H01L33/50 ,  H01L33/58

CPC classification number: H01L33/58 ,  G02F1/15 ,  G02F1/157 ,  G02F2001/1515 ,  G02F2202/04 ,  H01L33/44 ,  H01L33/50 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A LED package structure includes a base portion, a light-emitting chip, a cup portion and an encapsulating glue. The base portion has an upper surface and a lower surface. The upper surface has a die-bonding area. The light-emitting chip emits a light with a first wavelength and is located on the die-bonding area. The cup portion is located on the base portion to surround the die-bonding area to form a recess having an opening. The encapsulating glue is filled into the recess. The encapsulating glue has a wavelength conversion material configured to convert part of the light with the first wavelength into a light with a second wavelength. The cup portion includes an electro chromic layer electrically connected to a first external power and a transmittance of the electro chromic layer is changed in accordance with an input voltage of the first external power to adjust the light-emitting profile of the light-emitting chip.

Abstract translation: LED封装结构包括基部，发光芯片，杯部和封装胶。 基部具有上表面和下表面。 上表面具有芯片接合区域。 发光芯片发射具有第一波长的光并且位于芯片接合区域上。 杯部位于基部上以围绕芯片接合区域以形成具有开口的凹部。 封装胶被填充到凹槽中。 封装胶具有被配置为将具有第一波长的光的一部分转换成具有第二波长的光的波长转换材料。 杯部包括电连接到第一外部电源的电致铬层，并且根据第一外部电源的输入电压改变电致发光层的透射率，以调节发光芯片的发光轮廓。

公开(公告)号：US20150147832A1

公开(公告)日：2015-05-28

申请号：US14266767

申请日：2014-04-30

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Li-Cheng YANG ,  Chun-Ying HUANG

IPC: H01L33/00

CPC classification number: H01L33/0095 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27618 ,  H01L2224/27831 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83002 ,  H01L2224/83031 ,  H01L2224/83192 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2933/0066

Abstract: A method for producing a light-emitting diode is provided, including the following steps. First, a carrier is provided, wherein the carrier comprises a die bonding surface. Then, a die bonding adhesive layer is formed on the die bonding surface, wherein the die bonding adhesive layer has a photoresist property. Next, at least one lighting chip is disposed on the die bonding adhesive layer, and an uncovered portion of the die bonding adhesive layer is not covered by the lighting chip. Finally, the uncovered portion of the die bonding adhesive layer is removed.

Abstract translation: 提供了一种制造发光二极管的方法，包括以下步骤。 首先，提供载体，其中载体包括芯片接合表面。 然后，在芯片接合面上形成芯片接合粘合剂层，其中芯片粘合粘合剂层具有光致抗蚀剂性质。 接下来，在芯片粘合层上设置至少一个照明芯片，芯片粘合层的未覆盖部分未被照明芯片覆盖。 最后，除去芯片粘合层的未覆盖部分。

公开(公告)号：US20150077996A1

公开(公告)日：2015-03-19

申请号：US14290971

申请日：2014-05-29

Applicant: Lextar Electronics Corporation

Inventor： Li-Cheng YANG ,  Yu-Chun LEE ,  Cheng-Ta KUO

IPC: F28F3/00 ,  F21K99/00 ,  F21V29/00

CPC classification number: F21V29/85 ,  F21V29/83 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L23/467 ,  H01L33/648 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The disclosure provides a heat sink for electrical elements and a light-emitting device containing thereof. The heat sink includes a radiating substrate and at least one hollow radiating channel. In which, the hollow radiating channel is horizontally embedded in the radiating substrate, and has two openings disposed on the same site or the opposite sites of the radiating substrate, so that gas may flow in the hollow radiating channel and remove heat of the radiating substrate. And a light-emitting device containing the heat sink is also provided.

Abstract translation: 本公开提供了用于电气元件的散热器和包含其的发光装置。 散热器包括辐射基板和至少一个中空辐射通道。 其中，中空辐射通道水平嵌入辐射基板，并且具有设置在辐射基板的相同位置或相对位置上的两个开口，使得气体可以在中空辐射通道中流动并且去除辐射基板的热量 。 还提供了包含散热器的发光装置。