公开(公告)号：US20240094260A1

公开(公告)日：2024-03-21

申请号：US17384680

申请日：2021-07-23

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu

IPC: B21D22/02

CPC classification number: B21D22/02 ,  C25D1/003

Abstract: Improved probe arrays (e.g. buckling beam arrays) are formed using probe preforms that have desired array spacings but not intended individual probe configurations. Groups of preforms are engaged with one or more deformation plates that cause permanent (i.e. plastic) deformation of the probe preforms to provide probe from deformed probe preforms with desired probe configurations where at least part of the deformation of multiple probe preforms occur simultaneously and where multiple deformations of individual probe preforms may occur in parallel or in series and where deformation is provided by substantially lateral displacement of the one or more deformation plates relative to a permanent or temporary array substrate or one or more different deformation plates. In some variations, the substantial lateral displacement may be accompanied by longitudinal shifting as necessary to accommodate for change in relative longitudinal positioning as lateral displacement occurs.

公开(公告)号：US20240110943A1

公开(公告)日：2024-04-04

申请号：US18540446

申请日：2023-12-14

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu

IPC: G01R1/067 ,  G01R1/073 ,  H01R13/03

CPC classification number: G01R1/06716 ,  G01R1/06755 ,  G01R1/06761 ,  G01R1/07342 ,  H01R13/03 ,  H01R13/2407 ,  H01R2201/20

Abstract: Probe structures, probe arrays) and methods for making such structures include incorporation of nano-fibers and metal composites to provide structures with improved material properties. Nano-fiber incorporation may occur by co-deposition of fibers and metal, selective placement of fibers followed by deposition of metal, or general placement of fibers followed by selective deposition of a metal. Structures may be formed from single layers of fibers and deposited metal or from multiple layers formed adjacent to one another or attached to one another after formation. All portions, or only selected portions, of a structure may include composites of metal and nano-fibers.

公开(公告)号：US20240094636A1

公开(公告)日：2024-03-21

申请号：US17390835

申请日：2021-07-30

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu

IPC: G03F7/09 ,  G01R1/073

CPC classification number: G03F7/09 ,  G01R1/07307 ,  G03F7/094

Abstract: Probe array formation embodiments of the invention (e.g., that are used to form full arrays or multi-probe subarrays that are to be assembled into full arrays) provide simultaneous formation of many probes of an array or subarray while the probes are in an array configuration. These embodiments provide for the creation and deformation of array formation templates that include holes or openings for depositing probe material wherein the openings are either fully formed (i.e. fully actualized) prior to deformation or are latently formed by chemical or structural changes to the template material

公开(公告)号：US20230207426A1

公开(公告)日：2023-06-29

申请号：US17699049

申请日：2022-03-18

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu ,  Richard T. Chen ,  Will J. Tan ,  Jia Li ,  Uri Frodis ,  Nina C. Levy ,  Dennis R. Smalley

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

CPC classification number: H01L23/4735 ,  F28F3/12 ,  F28F13/06 ,  H01L21/4871 ,  H01L23/473 ,  H01L21/4882 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281 ,  F28F2260/02

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices or other devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, multi-stage microjets, microchannels, fins, wells, wells with flow passages, well with stress relief or stress propagation inhibitors, and integrated microjets and fins.

公开(公告)号：US20230408546A1

公开(公告)日：2023-12-21

申请号：US18452277

申请日：2023-08-18

Applicant: MICROFABRICA INC.

Inventor： Onnik Yaglioglu

IPC: G01R1/073 ,  C25D1/10 ,  G03F7/00

CPC classification number: G01R1/073 ,  G03F7/70025 ,  C25D1/10

Abstract: Probe structures, probe arrays, have varying intrinsic material properties along their lengths. Methods of forming probes and probe arrays comprise varying the plating parameters to provide varying intrinsic material properties. Some embodiments provide deposition templates created using multiphoton lithography to provide probes with varying lateral configurations along at least portion of their lengths.

公开(公告)号：US11774467B1

公开(公告)日：2023-10-03

申请号：US17464644

申请日：2021-09-01

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu

IPC: G01R1/073 ,  C25D1/10 ,  G03F7/20 ,  G03F7/00

CPC classification number: G01R1/073 ,  C25D1/10 ,  G03F7/70025

Abstract: Probe structures, probe arrays, have varying intrinsic material properties along their lengths. Methods of forming probes and probe arrays comprise varying the plating parameters to provide varying intrinsic material properties. Some embodiments provide deposition templates created using multiphoton lithography to provide probes with varying lateral configurations along at least portion of their lengths.

公开(公告)号：US12255123B2

公开(公告)日：2025-03-18

申请号：US17699049

申请日：2022-03-18

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu ,  Richard T. Chen ,  Will J. Tan ,  Jia Li ,  Uri Frodis ,  Nina C. Levy ,  Dennis R. Smalley

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices or other devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, multi-stage microjets, microchannels, fins, wells, wells with flow passages, well with stress relief or stress propagation inhibitors, and integrated microjets and fins.

公开(公告)号：US20240094247A1

公开(公告)日：2024-03-21

申请号：US17464612

申请日：2021-09-01

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu

IPC: G01R1/067 ,  G01R1/073 ,  H01R13/03

CPC classification number: G01R1/06716 ,  G01R1/06755 ,  G01R1/06761 ,  G01R1/07342 ,  H01R13/03 ,  H01R13/2407 ,  H01R2201/20

Abstract: Probe structures, probe arrays) and methods for making such structures include incorporation of nano-fibers and metal composites to provide structures with improved material properties. Nano-fiber incorporation may occur by co-deposition of fibers and metal, selective placement of fibers followed by deposition of metal, or general placement of fibers followed by selective deposition of a metal. Structures may be formed from single layers of fibers and deposited metal or from multiple layers formed adjacent to one another or attached to one another after formation. All portions, or only selected portions, of a structure may include composites of metal and nano-fibers.