Moulding materials with a polyarylene ether sulfone and aliphatic polyamide base
    1.
    发明授权
    Moulding materials with a polyarylene ether sulfone and aliphatic polyamide base 失效
    具有聚芳醚砜和脂肪族聚酰胺基的成型材料

    公开(公告)号:US06509403B1

    公开(公告)日:2003-01-21

    申请号:US09763698

    申请日:2001-02-26

    IPC分类号: C08K310

    摘要: Molding compositions comprise A) at least one polyarylene ether sulfone, B) at least one aliphatic polyamide, C) at least one filler, and also if desired D) an impact-modifying rubber or a mixture of various impact-modifying rubbers, and E) an additive or a mixture of various additives wherein the viscosity number of the polyamides B (measured in 0.5% strength by weight solution in 96% strength by weight sulfuric acid to DIN 53 727) is at least 180 ml/g, and the molding compositions comprise F) from 100 ppm to 0.5% by weight, based on the total weight of A to E, of copper bromide or copper iodide or a mixture of these.

    摘要翻译: 成型组合物包含A)至少一种聚亚芳基醚砜,B)至少一种脂肪族聚酰胺,C)至少一种填料,以及如果需要D)冲击改性橡胶或各种冲击改性橡胶的混合物,和E)添加剂 或各种添加剂的混合物,其中聚酰胺B的粘度数(以按重量百分比计的硫酸按重量计按DIN 53727标准的重量百分比为0.5%的溶液)为至少180ml / g,模塑组合物包含F) 基于A至E的总重量,从100ppm至0.5重量%的溴化铜或碘化铜或其混合物。

    Blends of polyarylether sulphone and polyamide, with improved viscosity and flowability

    公开(公告)号:US07105591B2

    公开(公告)日:2006-09-12

    申请号:US10257875

    申请日:2001-04-26

    IPC分类号: C08L81/06 C08K3/10

    摘要: The thermoplastic molding composition comprises components A, C, D, E and, where appropriate, B, F and G, the total weight of which is 100% by weight, and also component H: a) as component A, from 5 to 94.8% by weight of at least one polyaryl ether sulfone, b) as component B, from 0 to 20% by weight of at least one functionalized polyaryl ether sulfone, c) as component C, from 5 to 94.8% by weight of at least one polyamide, d) as component D, from 0.1 to 10% by weight of at least one epoxy resin, e) as component E, from 0.1 to 60% by weight of fibrous or particulate fillers or a mixture of these, f) as component F, from 0 to 40% by weight of impact-modifying rubbers which have functional groups, g) as component G, from 0 to 40% by weight of other conventional additives and processing aids, h) as component H, from 100 ppm to 0.5% by weight, based on the amounts of components A to G, of copper bromide and/or copper iodide.

    Thermoplastic molding compositions with an improved melt stability based on polyarlene ether sulfones
    4.
    发明授权
    Thermoplastic molding compositions with an improved melt stability based on polyarlene ether sulfones 失效
    具有改进的基于聚芳醚砜的熔体稳定性的热塑性模塑组合物

    公开(公告)号:US07163987B2

    公开(公告)日:2007-01-16

    申请号:US10491481

    申请日:2002-09-27

    IPC分类号: C08L81/06

    CPC分类号: C08L81/06 C08L81/00

    摘要: The present invention relates to molding compositions comprising A) from 39 to 99% by weight of at least one polyarylene ether sulfone built up from bifunctional monomer units, B) from 1 to 20% by weight of at least one polyarylene ether sulfone containing, based on the total weight of component B, from 0.1 to 10% by weight of units which derive from 1,1,1-tris(4-hydroxyphenyl)ethane, C) from 0 to 60% by weight of at least one filler, D) from 0 to 40% by weight of at least one impact-modifying rubber, and E) from 0 to 40% by weight of one or more various additives, where the percentages by weight of components A to E give 100% in total, and also to a process for preparing these molding compositions, to their use, and to moldings, films, fibers, or foams obtainable from these molding compositions.

    摘要翻译: 本发明涉及模塑组合物,其包含A)39至99重量%的由双官能单体单元构成的至少一种聚亚芳基醚砜,B)1至20重量%的至少一种含有基团的聚亚芳基醚砜 组分B的总重量为0.1至10重量%的衍生自1,1,1-三(4-羟基苯基)乙烷的单元,C)0至60重量%的至少一种填料,D )0至40重量%的至少一种冲击改性橡胶,和E)0至40重量%的一种或多种各种添加剂,其中组分A至E的重量百分比总计为100% 以及制备这些模塑组合物及其用途的方法,以及可从这些模塑组合物获得的模制品,薄膜,纤维或泡沫的制备方法。