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    Optical apparatus and optical module using the same
    2.
    发明申请
    Optical apparatus and optical module using the same 有权
    光学装置和使用其的光学模块

    公开(公告)号：US20070252227A1

    公开(公告)日：2007-11-01

    申请号：US11698100

    申请日：2007-01-26

    申请人： Toshiyuki Fukuda ,  Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio ,  Yutaka Harada

    发明人： Toshiyuki Fukuda ,  Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio ,  Yutaka Harada

    IPC分类号： H01L31/0232

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0232 ,  H01L33/483 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/05026 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/00014

    摘要： An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.

    摘要翻译： 光学设备包括具有感光体/发光区域，外围电路区域和电极区域的光学器件（LED器件或半导体成像器件），具有比光学器件更大的光通过区域的透明部件， 在其一个表面上具有用于连接到光学装置的突出电极，用于连接到安装基板的外部连接电极，用于连接突出电极的导电互连和外部连接电极，以及设置在光学装置和透明构件之间的透明粘合剂 。 在光学装置中，形成感光体/发光区域的光学装置的一个表面和透明构件的一个表面相互配置，并且光​​学装置的电极和 透明构件电连接并且还通过透明粘合剂粘合。

    Optical device module and method for fabricating the same
    3.
    发明授权
    Optical device module and method for fabricating the same 有权
    光器件模块及其制造方法

    公开(公告)号：US07817204B2

    公开(公告)日：2010-10-19

    申请号：US11979122

    申请日：2007-10-31

    申请人： Masanori Minamio ,  Yutaka Harada ,  Takahito Ishikawa ,  Toshiyuki Fukuda ,  Yoshiki Takayama

    发明人： Masanori Minamio ,  Yutaka Harada ,  Takahito Ishikawa ,  Toshiyuki Fukuda ,  Yoshiki Takayama

    IPC分类号： H04N9/07 ,  H04N5/225 ,  H04N9/09

    CPC分类号： H04N5/2254 ,  H04N5/2253

    摘要： A solid-state image sensor includes a first image sensing device, a first flexible substrate connected to the first image sensing device, a second solid-state image sensing device, and a second flexible substrate connected to the second solid-state image sensing device. The solid-state image sensing devices are disposed adjacently to each other such that light receiving surfaces are perpendicular to each other. The second solid-state image sensing device directly receives incident light. However, the first solid-state image sensing device receives the incident light reflected by a mirror. Electronic components are mounted on the two flexible substrates. The first flexible substrate is bent at two bending positions to face the second flexible substrate and electrically connected thereto.

    摘要翻译： 固态图像传感器包括第一图像感测装置，连接到第一图像感测装置的第一柔性基板，第二固态图像感测装置和连接到第二固态图像感测装置的第二柔性基板。 固态图像感测装置彼此相邻设置，使得光接收表面彼此垂直。 第二固体摄像装置直接接收入射光。 然而，第一固态图像感测装置接收由反射镜反射的入射光。 电子部件安装在两个柔性基板上。 第一柔性基板在两个弯曲位置处弯曲以面对第二柔性基板并与其电连接。

    Optical device module and method for fabricating the same
    4.
    发明申请
    Optical device module and method for fabricating the same 有权
    光器件模块及其制造方法

    公开(公告)号：US20080117324A1

    公开(公告)日：2008-05-22

    申请号：US11979122

    申请日：2007-10-31

    申请人： Masanori Minamio ,  Yutaka Harada ,  Takahito Ishikawa ,  Toshiyuki Fukuda ,  Yoshiki Takayama

    发明人： Masanori Minamio ,  Yutaka Harada ,  Takahito Ishikawa ,  Toshiyuki Fukuda ,  Yoshiki Takayama

    IPC分类号： H04N5/225

    CPC分类号： H04N5/2254 ,  H04N5/2253

    摘要： A solid-state image sensor includes a first image sensing device, a first flexible substrate connected to the first image sensing device, a second solid-state image sensing device, and a second flexible substrate connected to the second solid-state image sensing device. The solid-state image sensing devices are disposed adjacently to each other such that light receiving surfaces are perpendicular to each other. The second solid-state image sensing device directly receives incident light. However, the first solid-state image sensing device receives the incident light reflected by a mirror. Electronic components are mounted on the two flexible substrates. The first flexible substrate is bent at two bending positions to face the second flexible substrate and electrically connected thereto.

    摘要翻译： 固态图像传感器包括第一图像感测装置，连接到第一图像感测装置的第一柔性基板，第二固态图像感测装置和连接到第二固态图像感测装置的第二柔性基板。 固态图像感测装置彼此相邻设置，使得光接收表面彼此垂直。 第二固体摄像装置直接接收入射光。 然而，第一固态图像感测装置接收由反射镜反射的入射光。 电子部件安装在两个柔性基板上。 第一柔性基板在两个弯曲位置处弯曲以面对第二柔性基板并与其电连接。

    Optical apparatus and optical module using the same
    6.
    发明授权
    Optical apparatus and optical module using the same 有权
    光学装置和使用其的光学模块

    公开(公告)号：US07582944B2

    公开(公告)日：2009-09-01

    申请号：US11698100

    申请日：2007-01-26

    申请人： Toshiyuki Fukuda ,  Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio ,  Yutaka Harada

    发明人： Toshiyuki Fukuda ,  Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio ,  Yutaka Harada

    IPC分类号： H01L31/0232

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0232 ,  H01L33/483 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/05026 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/00014

    摘要： An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.

    摘要翻译： 光学设备包括具有感光体/发光区域，外围电路区域和电极区域的光学器件（LED器件或半导体成像器件），具有比光学器件更大的光通过区域的透明部件， 在其一个表面上具有用于连接到光学装置的突出电极，用于连接到安装基板的外部连接电极，用于连接突出电极的导电互连和外部连接电极，以及设置在光学装置和透明构件之间的透明粘合剂 。 在光学装置中，形成感光体/发光区域的光学装置的一个表面和透明构件的一个表面相互配置，并且光​​学装置的电极和 透明构件电连接并且还通过透明粘合剂粘合。

    Optical device, optical device apparatus, camera module, and optical device manufacturing method
    8.
    发明申请
    Optical device, optical device apparatus, camera module, and optical device manufacturing method 有权
    光学装置，光学装置装置，相机模块和光学装置的制造方法

    公开(公告)号：US20070019101A1

    公开(公告)日：2007-01-25

    申请号：US11490232

    申请日：2006-07-21

    申请人： Masanori Minamio ,  Yutaka Harada ,  Toshiyuki Fukuda

    发明人： Masanori Minamio ,  Yutaka Harada ,  Toshiyuki Fukuda

    IPC分类号： G02B13/16

    CPC分类号： H01L27/14632 ,  G02B3/0006 ,  G02B3/0056 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An optical device includes an optical element, a transparent member arranged on the optical element, and a transparent resin adhesive for causing the transparent member to adhere and be fixed onto a circuit formation face of the optical element. The optical device includes a light detecting region having a plurality of micro lenses, a peripheral circuit region formed in the outer peripheral part of the light detecting region, and an electrode region formed at the outer peripheral part of the peripheral circuit region. A roughed region in a saw-toothed shape in section is formed in part of a face of the transparent member which adheres to the optical element, the part being overlapped with the outer peripheral part of the light detecting region as viewed in plan.

    摘要翻译： 光学装置包括光学元件，布置在光学元件上的透明构件和用于使透明构件粘附并固定到光学元件的电路形成面上的透明树脂粘合剂。 光学装置包括具有多个微透镜的光检测区域，形成在光检测区域的外周部分中的外围电路区域和形成在外围电路区域的外周部分处的电极区域。 如图所示，锯齿状形状的粗糙区域形成在粘附于光学元件的透明构件的表面的一部分中，该部分与光检测区域的外周部分重叠。