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公开(公告)号：US07817204B2
公开(公告)日：2010-10-19
申请号：US11979122
申请日：2007-10-31
CPC分类号： H04N5/2254 , H04N5/2253
摘要： A solid-state image sensor includes a first image sensing device, a first flexible substrate connected to the first image sensing device, a second solid-state image sensing device, and a second flexible substrate connected to the second solid-state image sensing device. The solid-state image sensing devices are disposed adjacently to each other such that light receiving surfaces are perpendicular to each other. The second solid-state image sensing device directly receives incident light. However, the first solid-state image sensing device receives the incident light reflected by a mirror. Electronic components are mounted on the two flexible substrates. The first flexible substrate is bent at two bending positions to face the second flexible substrate and electrically connected thereto.
摘要翻译： 固态图像传感器包括第一图像感测装置，连接到第一图像感测装置的第一柔性基板，第二固态图像感测装置和连接到第二固态图像感测装置的第二柔性基板。 固态图像感测装置彼此相邻设置，使得光接收表面彼此垂直。 第二固体摄像装置直接接收入射光。 然而，第一固态图像感测装置接收由反射镜反射的入射光。 电子部件安装在两个柔性基板上。 第一柔性基板在两个弯曲位置处弯曲以面对第二柔性基板并与其电连接。
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公开(公告)号：US20080117324A1
公开(公告)日：2008-05-22
申请号：US11979122
申请日：2007-10-31
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , H04N5/2253
摘要： A solid-state image sensor includes a first image sensing device, a first flexible substrate connected to the first image sensing device, a second solid-state image sensing device, and a second flexible substrate connected to the second solid-state image sensing device. The solid-state image sensing devices are disposed adjacently to each other such that light receiving surfaces are perpendicular to each other. The second solid-state image sensing device directly receives incident light. However, the first solid-state image sensing device receives the incident light reflected by a mirror. Electronic components are mounted on the two flexible substrates. The first flexible substrate is bent at two bending positions to face the second flexible substrate and electrically connected thereto.
摘要翻译： 固态图像传感器包括第一图像感测装置，连接到第一图像感测装置的第一柔性基板，第二固态图像感测装置和连接到第二固态图像感测装置的第二柔性基板。 固态图像感测装置彼此相邻设置，使得光接收表面彼此垂直。 第二固体摄像装置直接接收入射光。 然而，第一固态图像感测装置接收由反射镜反射的入射光。 电子部件安装在两个柔性基板上。 第一柔性基板在两个弯曲位置处弯曲以面对第二柔性基板并与其电连接。
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公开(公告)号：US07582944B2
公开(公告)日：2009-09-01
申请号：US11698100
申请日：2007-01-26
IPC分类号： H01L31/0232
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L31/0232 , H01L33/483 , H01L33/58 , H01L33/62 , H01L2224/05026 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16 , H01L2224/73204 , H01L2924/00014
摘要： An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.
摘要翻译： 光学设备包括具有感光体/发光区域，外围电路区域和电极区域的光学器件（LED器件或半导体成像器件），具有比光学器件更大的光通过区域的透明部件， 在其一个表面上具有用于连接到光学装置的突出电极，用于连接到安装基板的外部连接电极，用于连接突出电极的导电互连和外部连接电极，以及设置在光学装置和透明构件之间的透明粘合剂 。 在光学装置中，形成感光体/发光区域的光学装置的一个表面和透明构件的一个表面相互配置，并且光学装置的电极和 透明构件电连接并且还通过透明粘合剂粘合。
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4.发明申请Optical device module, fabrication method thereof, optical device unit and fabrication method thereof 有权光器件模块及其制造方法，光学元件单元及其制造方法公开(公告)号：US20080100732A1
公开(公告)日：2008-05-01
申请号：US11798370
申请日：2007-05-14
CPC分类号： H04N5/2251 , H01L2924/0002 , H04N5/2257 , H05K1/189 , H05K2201/046 , H05K2201/10121 , H05K2201/10689 , H01L2924/00
摘要： One end of a flexible substrate is connected to a solid-state image sensing device and the other end constitutes an external connection part in which external lead-out electrodes are provided. A plurality of electronic components are mounted on a mounting part of the flexible substrate. The flexible substrate is bent at a first bent part thereof to make an acute angle with the solid-state image sensing device and also bent at a second bent part thereof to make an acute angle with the external connection part. The two acute angles are alternate angles and the solid-state image sensing device has a cross section of the letter Z.
摘要翻译： 柔性基板的一端连接到固态图像感测装置，另一端构成外部引出电极的外部连接部。 多个电子部件安装在柔性基板的安装部上。 柔性基板在其第一弯曲部分处弯曲以与固态图像感测装置成锐角并且在其第二弯曲部分处弯曲以与外部连接部分成锐角。 两个锐角是交替的角度，固态图像感测装置具有字母Z的横截面。
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公开(公告)号：US20070252227A1
公开(公告)日：2007-11-01
申请号：US11698100
申请日：2007-01-26
IPC分类号： H01L31/0232
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L31/0232 , H01L33/483 , H01L33/58 , H01L33/62 , H01L2224/05026 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16 , H01L2224/73204 , H01L2924/00014
摘要： An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.
摘要翻译： 光学设备包括具有感光体/发光区域，外围电路区域和电极区域的光学器件（LED器件或半导体成像器件），具有比光学器件更大的光通过区域的透明部件， 在其一个表面上具有用于连接到光学装置的突出电极，用于连接到安装基板的外部连接电极，用于连接突出电极的导电互连和外部连接电极，以及设置在光学装置和透明构件之间的透明粘合剂 。 在光学装置中，形成感光体/发光区域的光学装置的一个表面和透明构件的一个表面相互配置，并且光学装置的电极和 透明构件电连接并且还通过透明粘合剂粘合。
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6.发明授权Optical device module, fabrication method thereof, optical device unit and fabrication method thereof 有权光器件模块及其制造方法，光学元件单元及其制造方法公开(公告)号：US08018526B2
公开(公告)日：2011-09-13
申请号：US11798370
申请日：2007-05-14
IPC分类号： H04N5/225
CPC分类号： H04N5/2251 , H01L2924/0002 , H04N5/2257 , H05K1/189 , H05K2201/046 , H05K2201/10121 , H05K2201/10689 , H01L2924/00
摘要： One end of a flexible substrate is connected to a solid-state image sensing device and the other end constitutes an external connection part in which external lead-out electrodes are provided. A plurality of electronic components are mounted on a mounting part of the flexible substrate. The flexible substrate is bent at a first bent part thereof to make an acute angle with the solid-state image sensing device and also bent at a second bent part thereof to make an acute angle with the external connection part. The two acute angles are alternate angles and the solid-state image sensing device has a cross section of the letter Z.
摘要翻译： 柔性基板的一端连接到固态图像感测装置，另一端构成外部引出电极的外部连接部。 多个电子部件安装在柔性基板的安装部上。 柔性基板在其第一弯曲部分处弯曲以与固态图像感测装置成锐角并且在其第二弯曲部分处弯曲以与外部连接部分成锐角。 两个锐角是交替的角度，固态图像感测装置具有字母Z的横截面。
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7.发明授权Optical device and method for fabricating the same, camera module using optical device, and electronic equipment mounting camera module 有权光学装置及其制造方法，使用光学装置的相机模块和安装摄像机模块的电子设备公开(公告)号：US07923798B2
公开(公告)日：2011-04-12
申请号：US12045522
申请日：2008-03-10
IPC分类号： H01L31/0232 , H01L31/18
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14627 , H01L27/14632 , H01L2224/05001 , H01L2224/05009 , H01L2224/05567 , H01L2224/13 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/48464 , H01L2924/00014 , H04N5/2257 , H01L2224/05599 , H01L2224/05099
摘要： An optical device includes a light receiving element chip having: an active region formed on a principal plane of a substrate and made by arranging a plurality of light receiving pixels; a circuit region disposed around an outer circumference of the active region; a penetrating conductor provided to penetrate the substrate in the thickness direction of the substrate; and an external connection terminal provided on a back surface of the substrate facing the principal plane thereof and connected to the penetrating conductor. The optical device further includes a microlens, a planarization film, and a transparent protective film formed on the planarization film.
摘要翻译： 光学装置包括：光接收元件芯片，其具有：形成在基板的主平面上并通过布置多个光接收像素而制成的有源区; 设置在所述有源区域的外周的电路区域; 穿透导体，其设置成在所述基板的厚度方向上穿透所述基板; 以及外部连接端子，其设置在所述基板的与所述基板的主面相对的背面，并与所述贯通导体连接。 光学器件还包括形成在平坦化膜上的微透镜，平坦化膜和透明保护膜。
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公开(公告)号：US20070206455A1
公开(公告)日：2007-09-06
申请号：US11708472
申请日：2007-02-21
IPC分类号： G11B7/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/49171 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , Y10T29/49117 , H01L2224/85 , H01L2924/00014
摘要： An optical device includes a substrate, an optical element, a translucent component, a plurality of first terminals and a sealant. The sealant is located lower than the top surface of the translucent component. The top surface of the translucent component is exposed out of the sealant, while the side surface of the translucent component is covered with the sealant.
摘要翻译： 光学装置包括基板，光学元件，半透明部件，多个第一端子和密封剂。 密封剂位于比半透明组件的顶表面更低的位置。 半透明部件的顶面从密封剂露出，而半透明部件的侧表面被密封剂覆盖。
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9.发明申请Optical device, optical device apparatus, camera module, and optical device manufacturing method 有权光学装置，光学装置装置，相机模块和光学装置的制造方法公开(公告)号：US20070019101A1
公开(公告)日：2007-01-25
申请号：US11490232
申请日：2006-07-21
IPC分类号： G02B13/16
CPC分类号： H01L27/14632 , G02B3/0006 , G02B3/0056 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L27/14687 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： An optical device includes an optical element, a transparent member arranged on the optical element, and a transparent resin adhesive for causing the transparent member to adhere and be fixed onto a circuit formation face of the optical element. The optical device includes a light detecting region having a plurality of micro lenses, a peripheral circuit region formed in the outer peripheral part of the light detecting region, and an electrode region formed at the outer peripheral part of the peripheral circuit region. A roughed region in a saw-toothed shape in section is formed in part of a face of the transparent member which adheres to the optical element, the part being overlapped with the outer peripheral part of the light detecting region as viewed in plan.
摘要翻译： 光学装置包括光学元件，布置在光学元件上的透明构件和用于使透明构件粘附并固定到光学元件的电路形成面上的透明树脂粘合剂。 光学装置包括具有多个微透镜的光检测区域，形成在光检测区域的外周部分中的外围电路区域和形成在外围电路区域的外周部分处的电极区域。 如图所示，锯齿状形状的粗糙区域形成在粘附于光学元件的透明构件的表面的一部分中，该部分与光检测区域的外周部分重叠。
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10.发明授权Optical device, optical device apparatus, camera module, and optical device manufacturing method 有权光学装置，光学装置装置，相机模块和光学装置的制造方法公开(公告)号：US07789575B2
公开(公告)日：2010-09-07
申请号：US11490232
申请日：2006-07-21
CPC分类号： H01L27/14632 , G02B3/0006 , G02B3/0056 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L27/14687 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： An optical device includes an optical element, a transparent member arranged on the optical element, and a transparent resin adhesive for causing the transparent member to adhere and be fixed onto a circuit formation face of the optical element. The optical device includes a light detecting region having a plurality of micro lenses, a peripheral circuit region formed in the outer peripheral part of the light detecting region, and an electrode region formed at the outer peripheral part of the peripheral circuit region. A roughed region in a saw-toothed shape in section is formed in part of a face of the transparent member which adheres to the optical element, the part being overlapped with the outer peripheral part of the light detecting region as viewed in plan.
摘要翻译： 光学装置包括光学元件，布置在光学元件上的透明构件和用于使透明构件粘附并固定到光学元件的电路形成面上的透明树脂粘合剂。 光学装置包括具有多个微透镜的光检测区域，形成在光检测区域的外周部分中的外围电路区域和形成在外围电路区域的外周部分处的电极区域。 如图所示，锯齿状形状的粗糙区域形成在粘附于光学元件的透明构件的表面的一部分中，该部分与光检测区域的外周部分重叠。
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