Surface acoustic wave device and method of fabricating the same
    7.
    发明授权
    Surface acoustic wave device and method of fabricating the same 有权
    表面声波装置及其制造方法

    公开(公告)号:US07227429B2

    公开(公告)日:2007-06-05

    申请号:US10809926

    申请日:2004-03-26

    IPC分类号: H03H9/72 H03H9/64 H03H3/08

    摘要: A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.

    摘要翻译: 声表面波装置包括具有第一表面的压电基片,其上设有梳状电极,与其连接的第一焊盘和第一膜。 第一膜定位成围绕梳状电极。 基底基板具有第二表面,第二焊盘在其上连接到第一焊盘,并且提供连接到第一膜的第二膜。 通过表面激活工艺连接的第一和第二膜限定了其中梳状电极和第一和第二焊盘被气密地密封的空腔。