摘要:
The polyimide film of this invention is formed from a polyimide, which is prepared by reacting a diamino compound represented by the general formula (1): ##STR1## wherein X represents a hydrocarbon group having 1 to 20 carbon atoms or a sulfur atom; R represents each independently a halogen atom, a hydrocarbon group having 1 to 6 carbon atoms or a halogen-containing hydrocarbon group having 1 to 6 carbon atoms; a represents each independently an integer of 0 to 4; with a tetracarboxylic dianhydride represented by the general formula (2) ##STR2## wherein Y represents a tetravalent organic group having 2 or more carbon atoms. The polyimide film obtained can be applied favorably to a flexible printed circuit board without adhesion layer, a protective coating for electronic parts and electric wires, or a heat resistant adhesive.
摘要:
A polyimide represented by the general formula (1): ##STR1## wherein Y represents a hydrocarbon group having 4 to 20 carbon atoms or a sulfur atom; each of R.sub.1 to R.sub.4, R.sub.i and R.sub.j represents a halogen atom, a hydrocarbon group having 1 to 6 carbon atoms or a halogen-containing hydrocarbon group having 1 to 6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4; and X represents a tetravalent organic group having 2 or more carbon atoms.
摘要翻译:由通式(1)表示的聚酰亚胺:其中Y表示碳原子数为4〜20的烃基或硫原子, R 1至R 4中的每一个,R 1和R j表示卤素原子,具有1至6个碳原子的烃基或具有1至6个碳原子的含卤素烃基; a,b,c,d,e和f中的每一个表示满足+ b = 4,c + d 4和e + f 4的0〜4的整数; X表示具有2个以上碳原子的四价有机基团。
摘要:
The present invention provides an improved epoxy resin composition comprising an epoxy resin and a novel imide compound represented by the formula ##STR1## wherein X represents an --NH.sub.2 group and/or --OH group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms, R.sub.2 represent a hydrogen atom, an alkyl or alkoxy group having from 1 to 20 carbon atoms or hydroxyl group, and each of m and n represents a number of from 0 to 30.
摘要:
An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: ##STR1## with a carbonyl compound represented by the general formula: ##STR2## which aryl ester compound can give, when used as a curing agent for an epoxy resin, a cured product having a low dielectric constant and a low dielectric loss tangent; an epoxy resin composition comprising as the essential components an epoxy resin, said aryl ester compound and a cure accelerator; and a copper-clad laminate using the epoxy resin composition. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent and is excellent in adhesiveness as compared with conventional ones, and hence, is suitable for multilayer printed wiring board for high speed operation, especially at high-frequency region.
摘要:
The present invention provides an improved epoxy resin composition comprising an epoxy resin and a novel imide compound represented by the formula ##STR1## wherein X represents an --NH.sub.2 group and/or --OH group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms, R.sub.2 represents a hydrogen atom, an alkyl or alkoxy group having from 1 to 20 carbon atoms or hydroxyl group, and each of m and n represents a number of from 0 to 30.
摘要:
An epoxy resin composition is disclosed as containing, as essential components, an epoxy resin, an aryl ester compound obtained from a polyhydric phenol representedd by a formula (4) with a carbonyl compound represented by a general formula (2) and a cure accelerator. When cured, the resulting product has low dielectric constant and a low dielectric loss tangent. A copper-clad laminate formed using the described composition has a low dielectric constant and a low dielectric loss tangent. The copper-clad laminate exhibits excellent adhesiveness characteristics and is suitable for use in multilayer printed wiring boards in high speed operations, particularly in the high frequency region.
摘要:
A copper clad laminate is disclosed as being obtained by thermoforming a prepreg and a copper foil. As disclosed, the pre-preg (uncured) includes a substrate impregnated with an epoxy resin, an aryl ester compound and a curing agent. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent. It is suitable for a multilayer printed wiring board for high speed operation, especially at high-frequency region.
摘要:
An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.
摘要翻译:由式(1)表示的不饱和酰亚胺化合物:其中Q是含4-20个碳原子的含脂环结构的烃基; R 1,R 2,R 3,R 4,R 1和R 3中的每一个表示氢原子,卤素原子,具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a,b,c,d,e和f中的每一个表示满足+ b = 4,c + d 4和e + f 4的0〜4的整数,D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团,制备式(1)的不饱和酰亚胺化合物的方法和用于制备式(1)的不饱和酰亚胺化合物的中间体。 式(1)的不饱和酰亚胺化合物在有机溶剂中很好溶解,可以得到耐热性,吸水性和柔软性优异的固化产物。
摘要:
A valve operating mechanism for an internal combustion engine has a low-speed cam for operating the intake or exhaust valves during low-speed operation of the engine and a high-speed cam for operating the intake or exhaust valves during high-speed operation of the engine. A low-speed lubricating oil passage is provided for supplying lubricating oil to the low-speed cam and a separate high-speed lubricating oil passage is provided for supplying lubricating oil to the high-speed cam. A control valve is connected to said low-speed and high-speed lubricating oil passages for selectively supplying maximum oil pressure to the high-speed lubricating oil passage during high-speed operation while restricting the rate of flow of oil during low-speed operation of the engine and supplying maximum oil pressure to the low-speed lubricating oil passage during low-speed operation of the engine while restricting or eliminating the oil supplied thereto during high-speed operation.
摘要:
A sheet member discharge mechanism comprising an upper discharge roller and a lower discharge roller for conveying a sheet member in a predetermined direction while nipping it therebetween. A push-down member is disposed downstream of the nipping portion between the upper discharge roller and the lower discharge roller as viewed in a direction of conveying the sheet member, the push-down member being allowed to move between an ascended position and a descended position and is urged to the descended position. The push-down member is moved to the ascended position by the sheet member acting upon the push-down member while the sheet member is being conveyed by the upper discharge roller and the lower discharge roller that work in cooperation. The push-down member moves to the descended position to push down the trailing edge of the sheet member after the trailing edge of the sheet member has passed the nipping portion between the upper discharge roller and the lower discharge roller.