MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR

    公开(公告)号:US20190304699A1

    公开(公告)日:2019-10-03

    申请号:US16443908

    申请日:2019-06-18

    Abstract: In a multilayer capacitor, a multilayer capacitor main body includes first and second main surfaces, first and second side surfaces, and first and second end surfaces, the first and second main surfaces extending in a length direction and a width direction, the first and second side surfaces extending in the length direction and a thickness direction, and the first and second end surfaces extending in the width direction and the thickness direction. The second main surface is depressed in a portion extending from opposite ends of the second main surface toward a center of the second main surface in the length direction.

    MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR
    3.
    发明申请
    MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR 审中-公开
    多层电容器的多层电容器和安装结构

    公开(公告)号:US20160049253A1

    公开(公告)日:2016-02-18

    申请号:US14813204

    申请日:2015-07-30

    CPC classification number: H01G4/30 H01G4/012 H01G4/12 H01G4/232

    Abstract: In a multilayer capacitor, both a minimum distance in a thickness direction between a first effective portion of a first inner electrode and a second main surface and a minimum distance in the thickness direction between a second effective portion of a second inner electrode and the second main surface are shorter than any of a dimension in the thickness direction of a first extending portion of the first inner electrode, a dimension in the thickness direction of a second extending portion of the first inner electrode and a dimension in the thickness direction of the third extending portion of the second inner electrode.

    Abstract translation: 在层叠电容器中,在第一内部电极的第一有效部分和第二主要表面之间的厚度方向上的最小距离和第二内部电极的第二有效部分与第二主体之间的厚度方向上的最小距离 表面比第一内部电极的第一延伸部分的厚度方向上的尺寸小,第一内部电极的第二延伸部分的厚度方向上的尺寸和第三延伸部分的厚度方向上的尺寸 第二内部电极的一部分。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF MULTILAYER CERAMIC ELECTRONIC COMPONENT

    公开(公告)号:US20250054704A1

    公开(公告)日:2025-02-13

    申请号:US18932730

    申请日:2024-10-31

    Abstract: A multilayer ceramic electronic component includes a multilayer body with laminated ceramic layers and internal electrode layers, a first and second main surface opposing each other in a lamination direction, a first and second side surface opposing each other in a width direction, a first and second end surface opposing each other in a length direction, and external electrodes. The internal electrode layers include first and second internal electrode layers alternately laminated with the ceramic layers and exposed to the first and second end surfaces and first and second side surfaces. Each of the first and second external electrodes includes a dense region, and where an area ratio of a conductive component is high and a sparse region where an area ratio of the conductive component is lower than the dense region, and the dense region is located closer to a multilayer body side than the sparse region.

    MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR

    公开(公告)号:US20180182552A1

    公开(公告)日:2018-06-28

    申请号:US15850114

    申请日:2017-12-21

    Abstract: A multilayer ceramic capacitor includes a substantially cuboid laminated body including ceramic layers and internal electrode layers laminated, and two or more exposed regions where the plurality of internal electrode layers are exposed, and external electrodes, wherein at least one of the external electrodes is an external electrode with resistance, the internal electrode layers include a first internal electrode layer and a second internal electrode layer opposed to the first internal electrode layer in the lamination direction, and the external electrode with resistance includes a thin film electrode layer in direct contact with the internal electrode layer in the exposed region, a resistive electrode layer provided on the thin film electrode layer, and an upper electrode layer provided on the resistive electrode layer, which has a lower electrical resistivity lower than the resistive electrode layer.

    MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR

    公开(公告)号:US20180012705A1

    公开(公告)日:2018-01-11

    申请号:US15713785

    申请日:2017-09-25

    CPC classification number: H01G4/30 H01G4/012 H01G4/232

    Abstract: In a multilayer capacitor, a multilayer capacitor main body includes first and second main surfaces, first and second side surfaces, and first and second end surfaces, the first and second main surfaces extending in a length direction and a width direction, the first and second side surfaces extending in the length direction and a thickness direction, and the first and second end surfaces extending in the width direction and the thickness direction. The second main surface is depressed in a portion extending from opposite ends of the second main surface toward a center of the second main surface in the length direction.

    SERIES OF ELECTRONIC COMPONENTS STORED IN A TAPE, MANUFACTURING METHOD FOR SERIES OF ELECTRONIC COMPONENTS STORED IN A TAPE, AND ELECTRONIC COMPONENT
    10.
    发明申请
    SERIES OF ELECTRONIC COMPONENTS STORED IN A TAPE, MANUFACTURING METHOD FOR SERIES OF ELECTRONIC COMPONENTS STORED IN A TAPE, AND ELECTRONIC COMPONENT 有权
    存储在胶带中的电子部件系列,存储在胶带中的电子部件系列的制造方法和电子部件

    公开(公告)号:US20160128244A1

    公开(公告)日:2016-05-05

    申请号:US14872375

    申请日:2015-10-01

    Abstract: A series of electronic components stored in a tape include a plurality of electronic components each arranged such that a first main surface faces a bottom surface of a cavity. In each electronic component, on a first side surface, a thickness in a width direction of a first terminal electrode at a first main surface side is smaller than a thickness in the width direction of the first terminal electrode at a second main surface side, and on a second side surface, a thickness in the width direction of a second terminal electrode at the first main surface side is smaller than a thickness in the width direction of the second terminal electrode at the second main surface side.

    Abstract translation: 存储在带中的一系列电子部件包括多个电子部件,每个电子部件被布置为使得第一主表面面向空腔的底表面。 在每个电子部件中,在第一侧面上,第一主面侧的第一端子电极的宽度方向的厚度小于第二主面侧的第一端子电极的宽度方向的厚度, 在第二侧面上,第一主面侧的第二端子电极的宽度方向的厚度小于第二主面侧的第二端子电极的宽度方向的厚度。

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