LANGE COUPLER AND FABRICATION METHOD
    2.
    发明申请
    LANGE COUPLER AND FABRICATION METHOD 有权
    LANGE COUPLER和制造方法

    公开(公告)号:US20130229239A1

    公开(公告)日:2013-09-05

    申请号:US13781564

    申请日:2013-02-28

    Applicant: NXP B.V.

    CPC classification number: H01P5/186

    Abstract: A Lange coupler comprises an unbroken peripheral ground conductor surrounding input, through, coupled and isolated conductor strips coupled to input, through, coupled and isolated ports of the Lange coupler respectively, wherein the peripheral ground conductor and input and through conductor strips are arranged on a first metal layer.

    Abstract translation: Lange耦合器包括一个不间断的外围接地导体,其围绕分别耦合到兰格耦合器的输入,通过,耦合和隔离端口的输入,通过,耦合和隔离的导体条,其中外围接地导体和输入和通过导体条布置在 第一金属层。

    MULTI BEAM FORMER
    3.
    发明申请
    MULTI BEAM FORMER 审中-公开

    公开(公告)号:US20170331528A1

    公开(公告)日:2017-11-16

    申请号:US15590665

    申请日:2017-05-09

    Applicant: NXP B.V.

    Abstract: A multi-beam-former for an antenna array is described, the multi-beam former comprises N transceiver terminals for connecting a transmitter and/or receiver and N antenna terminals for connecting to a respective antenna and a plurality of couplers and matrix phase shifters arranged in an N×N Butler matrix configuration between the N transceiver terminals and the N antenna terminals. At least some of the matrix phase shifters include a switchable matrix phase shifter configured to switch between a respective first phase shift value and a respective second phase shift value; a plurality of bypassable phase shifters arranged between at least some of the couplers and the antenna terminals and configured to switch between a respective further phase shift value and a zero phase shift. The multi-beam former is operable to select one of M different beam angles for a signal, wherein M is greater than N.

    Lange coupler and fabrication method
    4.
    发明授权
    Lange coupler and fabrication method 有权
    兰格耦合器和制造方法

    公开(公告)号:US09160052B2

    公开(公告)日:2015-10-13

    申请号:US13781564

    申请日:2013-02-28

    Applicant: NXP B.V.

    CPC classification number: H01P5/186

    Abstract: A Lange coupler comprises an unbroken peripheral ground conductor surrounding input, through, coupled and isolated conductor strips coupled to input, through, coupled and isolated ports of the Lange coupler respectively, wherein the peripheral ground conductor and input and through conductor strips are arranged on a first metal layer.

    Abstract translation: Lange耦合器包括一个不间断的外围接地导体,其围绕分别耦合到兰格耦合器的输入,通过,耦合和隔离端口的输入,通过,耦合和隔离的导体条,其中外围接地导体和输入和通过导体条布置在 第一金属层。

    Integrated circuit
    5.
    发明授权

    公开(公告)号:US10403540B2

    公开(公告)日:2019-09-03

    申请号:US14479561

    申请日:2014-09-08

    Applicant: NXP B.V.

    Abstract: An integrated circuit for a packaged device is proposed. The circuit comprises: a circuit having first and second electromagnetic radiating elements fabricated on a die; a package substrate comprising an upper surface and a lower surface; and a grounding layer provided on the lower surface of the package substrate, the grounding layer being adapted to connect to a grounding plane of a printed circuit board. The die is mounted on the upper surface of the package substrate. The grounding layer comprises a void, at least a portion of the void being positioned so as to at least partially electromagnetically isolate the first electromagnetic radiating element from the second electromagnetic radiating element.

    INTEGRATED CIRCUIT
    6.
    发明申请
    INTEGRATED CIRCUIT 审中-公开
    集成电路

    公开(公告)号:US20150070240A1

    公开(公告)日:2015-03-12

    申请号:US14479561

    申请日:2014-09-08

    Applicant: NXP B.V.

    Abstract: An integrated circuit for a packaged device is proposed. The circuit comprises: a circuit having first and second electromagnetic radiating elements fabricated on a die; a package substrate comprising an upper surface and a lower surface; and a grounding layer provided on the lower surface of the package substrate, the grounding layer being adapted to connect to a grounding plane of a printed circuit board. The die is mounted on the upper surface of the package substrate. The grounding layer comprises a void, at least a portion of the void being positioned so as to at least partially electromagnetically isolate the first electromagnetic radiating element from the second electromagnetic radiating element.

    Abstract translation: 提出了一种用于封装器件的集成电路。 该电路包括:具有在模具上制造的第一和第二电磁辐射元件的电路; 封装基板,包括上表面和下表面; 以及设置在所述封装基板的下表面上的接地层,所述接地层适于连接到印刷电路板的接地平面。 模具安装在封装基板的上表面上。 所述接地层包括空隙,所述空隙的至少一部分被定位成至少部分地将所述第一电磁辐射元件与所述第二电磁辐射元件电磁隔离。

    WIRELESS MOBILE COMMUNICATION DEVICE HAVING AN ENSURED SHORT RANGE FUNCTIONALITY
    7.
    发明申请
    WIRELESS MOBILE COMMUNICATION DEVICE HAVING AN ENSURED SHORT RANGE FUNCTIONALITY 审中-公开
    具有确保短距离功能的无线手机通信设备

    公开(公告)号:US20130122816A1

    公开(公告)日:2013-05-16

    申请号:US13738661

    申请日:2013-01-10

    Applicant: NXP B.V.

    Abstract: A wireless mobile communication device having short range functionality that is designed to always be capable of short range functionality, including secure short range functionality by having a first and second energy source where charging of the second energy source may be achieved by the voltage induced by the received short range signal.

    Abstract translation: 一种具有短距离功能的无线移动通信设备,其被设计为总是能够进行短距离功能,包括通过具有第一和第二能量源的安全的短距离功能,其中第二能量源的充电可以通过由 收到短距离信号。

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