Semiconductor light-emitting device and manufacturing method thereof
    2.
    发明授权
    Semiconductor light-emitting device and manufacturing method thereof 失效
    半导体发光器件及其制造方法

    公开(公告)号:US06821800B2

    公开(公告)日:2004-11-23

    申请号:US10326398

    申请日:2002-12-23

    IPC分类号: H01L2100

    摘要: In a method of manufacturing a semiconductor light-emitting device involving the steps of: forming a first semiconductor layer; forming a light-emitting layer of superlattice structure by laminating a barrier layer being made of InY1Ga1-Y1N (Y1≧0) and a quantum well layer being made of InY2Ga1-Y2N (Y2>Y1 and Y2>0) on the first semiconductor layer; and forming a second semiconductor layer on the light-emitting layer, an uppermost barrier layer, which will become an uppermost layer of the light-emitting layer, is made thicker than the other barrier layers. Further, at the time of forming the second semiconductor layer, an upper surface of such uppermost barrier layer is caused to disappear so that the thickness of the uppermost barrier layer becomes substantially equal to those of the other barrier layers.

    摘要翻译: 在制造半导体发光器件的方法中,包括以下步骤:形成第一半导体层; 通过将由InY1Ga1-Y1N(Y1> = 0)构成的阻挡层和由InY2Ga1-Y2N(Y2> Y1和Y2> 0)构成的量子阱层层叠在第一半导体上形成超晶格结构的发光层 层; 并且在发光层上形成第二半导体层,使作为发光层的最上层的最上层的阻挡层比其他阻挡层厚。 此外,在形成第二半导体层时,使最上层势垒层的上表面消失,使得最上阻挡层的厚度变得基本上等于其它势垒层的厚度。

    Semiconductor light-emitting device and manufacturing method thereof
    3.
    发明授权
    Semiconductor light-emitting device and manufacturing method thereof 有权
    半导体发光器件及其制造方法

    公开(公告)号:US06541293B2

    公开(公告)日:2003-04-01

    申请号:US10158830

    申请日:2002-06-03

    IPC分类号: H01L2100

    摘要: In a method of manufacturing a semiconductor light-emitting device involving the steps of: forming a first semiconductor layer; forming a light-emitting layer of superlattice structure by laminating a barrier layer being made of InY1Ga1−Y1N (Y1≧0) and a quantum well layer being made of InY2Ga1−Y2N (Y2>Y1 and Y2 >0) on the first semiconductor layer; and forming a second semiconductor layer on the light-emitting layer, an uppermost barrier layer, which will become an uppermost layer of the light-emitting layer, is made thicker than the other barrier layers. Further, at the time of forming the second semiconductor layer, an upper surface of such uppermost barrier layer is caused to disappear so that the thickness of the uppermost barrier layer becomes substantially equal to those of the other barrier layers.

    摘要翻译: 在制造半导体发光器件的方法中,包括以下步骤:形成第一半导体层; 通过将由InY1Ga1-Y1N(Y1> = 0)构成的阻挡层和由InY2Ga1-Y2N(Y2> Y1和Y2> 0)构成的量子阱层层叠在第一半导体上形成超晶格结构的发光层 层; 并且在发光层上形成第二半导体层,使作为发光层的最上层的最上层的阻挡层比其他阻挡层厚。 此外,在形成第二半导体层时,使最上层势垒层的上表面消失,使得最上阻挡层的厚度变得基本上等于其它势垒层的厚度。

    Semiconductor light-emitting device and manufacturing method thereof
    4.
    发明授权
    Semiconductor light-emitting device and manufacturing method thereof 有权
    半导体发光器件及其制造方法

    公开(公告)号:US06420733B2

    公开(公告)日:2002-07-16

    申请号:US09922687

    申请日:2001-08-07

    IPC分类号: H01L3300

    摘要: In a method of manufacturing a semiconductor light-emitting device involving the steps of: forming a first semiconductor layer; forming a light-emitting layer of superlattice structure by laminating a barrier layer being made of InY1Ga1−Y1N (Y1≧0) and a quantum well layer being made of InY2Ga1−Y2N (Y2>Y1 and Y2>0) on the first semiconductor layer; and forming a second semiconductor layer on the light- emitting layer, an uppermost barrier layer, which will become an uppermost layer of the light-emitting layer, is made thicker than the other barrier layers. Further, at the time of forming the second semiconductor layer, an upper surface of such uppermost barrier layer is caused to disappear so that the thickness of the uppermost barrier layer becomes substantially equal to those of the other barrier layers.

    摘要翻译: 在制造半导体发光器件的方法中,包括以下步骤:形成第一半导体层; 通过将由InY1Ga1-Y1N(Y1> = 0)构成的阻挡层和由InY2Ga1-Y2N(Y2> Y1和Y2> 0)构成的量子阱层层叠在第一半导体上形成超晶格结构的发光层 层; 并且在发光层上形成第二半导体层,使作为发光层的最上层的最上层的阻挡层比其他势垒层厚。 此外,在形成第二半导体层时,使最上层势垒层的上表面消失,使得最上阻挡层的厚度变得基本上等于其它势垒层的厚度。

    Semiconductor light-emitting device
    5.
    发明授权
    Semiconductor light-emitting device 失效
    半导体发光装置

    公开(公告)号:US6040588A

    公开(公告)日:2000-03-21

    申请号:US925325

    申请日:1997-09-08

    摘要: A semiconductor light-emitting device involving the steps of: forming a first semiconductor layer; forming a light-emitting layer of superlattice structure by laminating a barrier layer being made of In.sub.Y1 Ga.sub.1-Y1 N (Y1.gtoreq.0) and a quantum well layer being made of In.sub.Y2 Ga.sub.1-Y1 N (Y2>Y1 and Y2>0) on the first semiconductor layer; and forming a second semiconductor layer on the light-emitting layer, an uppermost barrier layer, which will become an uppermost layer of the light-emitting layer, is made thicker than the other barrier layers. Further, at the time of forming the second semiconductor layer, an upper surface of such uppermost barrier layer is caused to disappear so that the thickness of the uppermost barrier layer becomes substantially equal to those of the other barrier layers.

    摘要翻译: 一种半导体发光器件,包括以下步骤:形成第一半导体层; 通过层叠由InY1Ga1-Y1N(Y1> / = 0)构成的阻挡层和由InY2Ga1-Y1N(Y2> Y1和Y2> 0)构成的量子阱层,在第一层上形成超晶格结构的发光层 半导体层; 并且在发光层上形成第二半导体层,使作为发光层的最上层的最上层的阻挡层比其他阻挡层厚。 此外,在形成第二半导体层时,使最上层势垒层的上表面消失,使得最上阻挡层的厚度变得基本上等于其它势垒层的厚度。

    Method for manufacturing group III nitride compound semiconductor laser diodes
    8.
    发明授权
    Method for manufacturing group III nitride compound semiconductor laser diodes 失效
    制造III族氮化物半导体激光二极管的方法

    公开(公告)号:US06486068B2

    公开(公告)日:2002-11-26

    申请号:US09004608

    申请日:1998-01-08

    IPC分类号: H01L21302

    摘要: A method for manufacturing a laser diode using Group III nitride compound semiconductor comprising a buffer layer 2, an n+ layer 3, a cladding layer 4, an active layer 5, a p-type cladding layer 61, a contact layer 62, an SiO2 layer 9, an electrode 7 which is formed on the window formed in a portion of the SiO2 layer 9, and an electrode 8 which is formed on a portion of the n+ layer 3 by etching a portion of 4 layers from the contact layer 62 down to the cladding layer 4. One pair of opposite facets S of a cavity is formed by RIBE, and then the facets are etched by gas cluster ion beam etching using Ar gas. As a result, the facets S are flatted and the mirror reflection of the facets S is improved.

    摘要翻译: 一种使用III族氮化物化合物半导体制造激光二极管的方法,包括缓冲层2,n +层3,包覆层4,有源层5,p型覆层61,接触层62,SiO 2层 如图9所示,形成在形成在SiO 2层9的一部分上的窗口上的电极7和通过从接触层62蚀刻4层的一部分而形成在n +层3的一部分上的电极8, 通过RIBE形成空腔的一对相对面S,然后通过使用Ar气体的气体簇离子束蚀刻蚀刻该刻面。 结果,小面S变平,并且小面S的镜面反射得到改善。

    Group III nitride compound semiconductor laser
    9.
    发明授权
    Group III nitride compound semiconductor laser 失效
    III族氮化物化合物半导体激光器

    公开(公告)号:US06680957B1

    公开(公告)日:2004-01-20

    申请号:US09515493

    申请日:2000-02-29

    IPC分类号: H01S500

    摘要: A semiconductor laser 101 comprises a sapphire substrate 1, an AlN buffer layer 2, Si-doped GaN n-layer 3, Si-doped Al0.1Ga0.9N n-cladding layer 4, Si-doped GaN n-guide layer 5, an active layer 6 having multiple quantum well (MQW) structure in which about 35 Å in thickness of GaN barrier layer 62 and about 35 Å in thickness of Ga0.95In0.05N well layer 61 are laminated alternately, Mg-doped GaN p-guide layer 7, Mg-doped Al0.1Ga0.9N p-cladding layer 8, and Mg-doped GaN p-contact layer 9 are formed successively thereon. A ridged hole injection part B which contacts to a ridged resonator part A is formed to have the same width as the width w of an Ni electrode 10. Holes transmitted from the Ni electrode 10 are injected to the active layer 6 with high current density, and electric current threshold for laser oscillation can be decreased. Electric current threshold can be improved more effectively by forming also the p-guide layer 7 to have the same width as the width w of the Ni electrode 10.

    摘要翻译: 半导体激光器101包括蓝宝石衬底1,AlN缓冲层2,掺杂Si的GaN n层3,掺杂Si的Al 0.1 Ga 0.9 N n包层4,掺杂Si的GaN n引导层5, 具有多个量子阱(MQW)结构的有源层6,其中厚度约为35的GaN阻挡层62和约35厚度的Ga0.95In0.05N阱层61交替层叠,掺杂Mg的GaN p引导层 如图7所示,依次形成Mg掺杂的Al 0.1 Ga 0.9 N p包覆层8和Mg掺杂的GaN p接触层9。 与脊状谐振器部件A接触的脊状空穴注入部分B形成为具有与Ni电极10的宽度w相同的宽度。从Ni电极10传输的孔以高电流密度注入到有源层6中, 可以降低激光振荡的电流阈值。 也可以通过将p导向层7形成为具有与Ni电极10的宽度w相同的宽度来更有效地提高电流阈值。

    Methods for manufacturing group III nitride compound semiconductor laser
diodes
    10.
    发明授权
    Methods for manufacturing group III nitride compound semiconductor laser diodes 失效
    制造III族氮化物半导体激光二极管的方法

    公开(公告)号:US5953581A

    公开(公告)日:1999-09-14

    申请号:US840895

    申请日:1997-04-17

    CPC分类号: H01S5/32308 H01S5/0203

    摘要: As a method for manufacturing a laser diode using a group III nitride compound semiconductor, independent dry etching process for forming electrodes and mirror facets are adopted. A portion of an upper semiconductor layer is etched for forming a window. An electrode for a lower semiconductor layer is formed through the window. After electrodes are formed, then, etching is carried out for forming mirror facets of laser cavity. This method realizes high oscillation, because the method enhances parallel and vertical degrees of the mirror facets. Further, cleanness of the mirror facets are improved, because they are formed after the electrodes are formed. The method further lowers resistivity of lower semiconductor layer, because its thickness can be controlled easily without etching excessively. As a result, luminous efficiency is improved.

    摘要翻译: 作为使用III族氮化物化合物半导体制造激光二极管的方法,采用用于形成电极和镜面的独立的干蚀刻工艺。 上部半导体层的一部分被蚀刻以形成窗口。 通过窗口形成下半导体层用电极。 在形成电极之后,进行蚀刻以形成激光腔的镜面。 该方法实现了高振荡,因为该方法增强了镜面的平行和垂直度。 此外,改善了镜面的清洁度,因为它们在形成电极之后形成。 该方法进一步降低下半导体层的电阻率,因为其厚度可以容易地控制,而不会过度蚀刻。 结果,发光效率提高。