Group III nitride compound semiconductor laser diode and method for
producing same
    4.
    发明授权
    Group III nitride compound semiconductor laser diode and method for producing same 失效
    III族氮化物半导体激光二极管及其制造方法

    公开(公告)号:US5604763A

    公开(公告)日:1997-02-18

    申请号:US423940

    申请日:1995-04-19

    IPC分类号: H01S5/02 H01S5/323 H01S3/19

    摘要: An improved laser diode is made of a gallium nitride compound semiconductor ((Al.sub.x Ga.sub.1-x).sub.y In.sub.1-y N; 0.ltoreq.x.ltoreq.1; 0.ltoreq.x.ltoreq.1) with a double heterojunction structure having the active layer held between layers having a greater band gap. The laser diode comprises mirror surfaces formed by cleaving the multi-layered coating and the sapphire substrate in directions parallel to (c axis) of the sapphire substrate. The intermediate zinc oxide (ZnO) layer is selectively removed by wet etching with a ZnO-selective liquid etchant so as to form gaps between the sapphire substrate and the bottom-most sub-layer of the semiconductor laser element layer. The semiconductor laser element layer is cleaved with the aid of the gaps, and the resulting planes of cleavage are used as the mirror surfaces of the laser cavity.

    摘要翻译: 改进的激光二极管由氮化镓化合物半导体((Al x Ga 1-x)y In 1-y N; 0 (c轴)平行的方向上切割多层涂层和蓝宝石衬底而形成的镜面。 通过用ZnO选择性液体蚀刻剂的湿蚀刻选择性地除去中间氧化锌(ZnO)层,以便在蓝宝石衬底和半导体激光元件层的最底层子层之间形成间隙。 借助于间隙切割半导体激光元件层,并将所得到的切割平面用作激光腔的镜面。

    Sapphireless group III nitride semiconductor and method for making same
    5.
    发明授权
    Sapphireless group III nitride semiconductor and method for making same 失效
    无蓝宝石III族氮化物半导体及其制造方法

    公开(公告)号:US5620557A

    公开(公告)日:1997-04-15

    申请号:US494846

    申请日:1995-06-26

    IPC分类号: C30B25/02 H01L33/32 H01L21/00

    摘要: A method of manufacturing two sapphireless layers (3a, 3b) at one time made of Group III nitride compound semiconductor satisfying the formula Al.sub.x Ga.sub.y In.sub.1-x-y N, inclusive of x=0, y=0, and x=y=0, and a LED (10) utilizing one of the semiconductor layers (3a, 3b) as a substrate (3) includes the steps of forming two zinc oxide (ZnO) intermediate layers (2a, 2b) on each side of a sapphire substrate (1), forming two Group III nitride compound semiconductor layers (3a, 3b) satisfying the formula Al.sub.x Ga.sub.y In.sub.1-x-y N, inclusive of x=0, y=0, and x=y=0, each laminated on each of the intermediate ZnO layers (2a, 2b), and separating the intermediate ZnO layers (2a, 2b) from the sapphire substrate (1) by etching with an etching liquid only for the ZnO layers (2a, 2b). At least one of the so-obtained Group III nitride compound layers is provided with n and p MOVPE layers (4, 5) formed thereon with electrodes (6, 7) on opposite sides to form an LED emitting in the 450 nm region and having a low device resistance.

    摘要翻译: 一次由满足公式Al x Ga y In 1-x-y N的III族氮化物化合物半导体制造两个蓝宝石层(3a,3b)的方法,包括x = 0,y = 0和x = y = 0,以及 利用半导体层(3a,3b)之一作为基板(3)的LED(10)包括在蓝宝石基板(1)的每一侧上形成两个氧化锌(ZnO)中间层(2a,2b)的步骤, 形成满足式Al x Ga y In 1-x-y N的两个III族氮化物化合物半导体层(3a,3b),包括x = 0,y = 0和x = y = 0,各层叠在每个中间ZnO层 ,2b),并且通过仅用于ZnO层(2a,2b)的蚀刻液蚀刻从中分离出中间ZnO层(2a,2b)和蓝宝石衬底(1)。 如此获得的III族氮化物化合物层中的至少一个设置有在其上形成有电极(6,7)的相对侧上的n和p个MOVPE层(4,5),以形成在450nm区域中发射的LED,并且具有 器件电阻低。

    Gallum nitride group compound semiconductor laser diode
    6.
    发明授权
    Gallum nitride group compound semiconductor laser diode 失效
    镓氮化物半导体激光二极管

    公开(公告)号:US5583879A

    公开(公告)日:1996-12-10

    申请号:US423946

    申请日:1995-04-19

    CPC分类号: H01S5/32341 H01S5/3086

    摘要: A gallium nitride group compound semiconductor laser diode (10) satisfying the formula (Al.sub.x Ga.sub.1-x).sub.y In.sub.1-y N, inclusive of 0.ltoreq.x.ltoreq.1 and 0.ltoreq.y.ltoreq.1 comprises by a double hetero-junction structure sandwiching an active layer (5) between layers (4, 6) having wider band gaps than the active layer (5). The active layer (5) may comprise magnesium (Mg) doped p-type conductive gallium nitride group compound semiconductor satisfying the formula (Al.sub.x Ga.sub.1-x).sub.y In.sub.1-y N, inclusive of 0.ltoreq.x.ltoreq.1 and 0.ltoreq.y.ltoreq.1 . In another embodiment, the active layer (5) is doped with silicon (Si).

    摘要翻译: 满足式(Al x Ga 1-x)y In 1-y N,包括0≤x≤1且0≤y≤1的氮化镓族化合物半导体激光二极管(10) 在具有比活性层(5)更宽的带隙的层(4,6)之间夹着有源层(5)的结结构结构。 有源层(5)可以包括满足式(Al x Ga 1-x)y In 1-y N的包含镁(Mg)的p型导电氮化镓族化合物半导体,包括0≤x≤1和0≤ y

    Semiconductor light-emitting device
    8.
    发明授权
    Semiconductor light-emitting device 失效
    半导体发光装置

    公开(公告)号:US6040588A

    公开(公告)日:2000-03-21

    申请号:US925325

    申请日:1997-09-08

    摘要: A semiconductor light-emitting device involving the steps of: forming a first semiconductor layer; forming a light-emitting layer of superlattice structure by laminating a barrier layer being made of In.sub.Y1 Ga.sub.1-Y1 N (Y1.gtoreq.0) and a quantum well layer being made of In.sub.Y2 Ga.sub.1-Y1 N (Y2>Y1 and Y2>0) on the first semiconductor layer; and forming a second semiconductor layer on the light-emitting layer, an uppermost barrier layer, which will become an uppermost layer of the light-emitting layer, is made thicker than the other barrier layers. Further, at the time of forming the second semiconductor layer, an upper surface of such uppermost barrier layer is caused to disappear so that the thickness of the uppermost barrier layer becomes substantially equal to those of the other barrier layers.

    摘要翻译: 一种半导体发光器件,包括以下步骤:形成第一半导体层; 通过层叠由InY1Ga1-Y1N(Y1> / = 0)构成的阻挡层和由InY2Ga1-Y1N(Y2> Y1和Y2> 0)构成的量子阱层,在第一层上形成超晶格结构的发光层 半导体层; 并且在发光层上形成第二半导体层,使作为发光层的最上层的最上层的阻挡层比其他阻挡层厚。 此外,在形成第二半导体层时,使最上层势垒层的上表面消失,使得最上阻挡层的厚度变得基本上等于其它势垒层的厚度。

    Semiconductor light-emitting device and manufacturing method thereof
    9.
    发明授权
    Semiconductor light-emitting device and manufacturing method thereof 失效
    半导体发光器件及其制造方法

    公开(公告)号:US06821800B2

    公开(公告)日:2004-11-23

    申请号:US10326398

    申请日:2002-12-23

    IPC分类号: H01L2100

    摘要: In a method of manufacturing a semiconductor light-emitting device involving the steps of: forming a first semiconductor layer; forming a light-emitting layer of superlattice structure by laminating a barrier layer being made of InY1Ga1-Y1N (Y1≧0) and a quantum well layer being made of InY2Ga1-Y2N (Y2>Y1 and Y2>0) on the first semiconductor layer; and forming a second semiconductor layer on the light-emitting layer, an uppermost barrier layer, which will become an uppermost layer of the light-emitting layer, is made thicker than the other barrier layers. Further, at the time of forming the second semiconductor layer, an upper surface of such uppermost barrier layer is caused to disappear so that the thickness of the uppermost barrier layer becomes substantially equal to those of the other barrier layers.

    摘要翻译: 在制造半导体发光器件的方法中,包括以下步骤:形成第一半导体层; 通过将由InY1Ga1-Y1N(Y1> = 0)构成的阻挡层和由InY2Ga1-Y2N(Y2> Y1和Y2> 0)构成的量子阱层层叠在第一半导体上形成超晶格结构的发光层 层; 并且在发光层上形成第二半导体层,使作为发光层的最上层的最上层的阻挡层比其他阻挡层厚。 此外,在形成第二半导体层时,使最上层势垒层的上表面消失,使得最上阻挡层的厚度变得基本上等于其它势垒层的厚度。

    Semiconductor light-emitting device and manufacturing method thereof
    10.
    发明授权
    Semiconductor light-emitting device and manufacturing method thereof 有权
    半导体发光器件及其制造方法

    公开(公告)号:US06541293B2

    公开(公告)日:2003-04-01

    申请号:US10158830

    申请日:2002-06-03

    IPC分类号: H01L2100

    摘要: In a method of manufacturing a semiconductor light-emitting device involving the steps of: forming a first semiconductor layer; forming a light-emitting layer of superlattice structure by laminating a barrier layer being made of InY1Ga1−Y1N (Y1≧0) and a quantum well layer being made of InY2Ga1−Y2N (Y2>Y1 and Y2 >0) on the first semiconductor layer; and forming a second semiconductor layer on the light-emitting layer, an uppermost barrier layer, which will become an uppermost layer of the light-emitting layer, is made thicker than the other barrier layers. Further, at the time of forming the second semiconductor layer, an upper surface of such uppermost barrier layer is caused to disappear so that the thickness of the uppermost barrier layer becomes substantially equal to those of the other barrier layers.

    摘要翻译: 在制造半导体发光器件的方法中,包括以下步骤:形成第一半导体层; 通过将由InY1Ga1-Y1N(Y1> = 0)构成的阻挡层和由InY2Ga1-Y2N(Y2> Y1和Y2> 0)构成的量子阱层层叠在第一半导体上形成超晶格结构的发光层 层; 并且在发光层上形成第二半导体层,使作为发光层的最上层的最上层的阻挡层比其他阻挡层厚。 此外,在形成第二半导体层时,使最上层势垒层的上表面消失,使得最上阻挡层的厚度变得基本上等于其它势垒层的厚度。