-
公开(公告)号：US20180006388A1
公开(公告)日：2018-01-04
申请号：US15708705
申请日：2017-09-19
Applicant: OLYMPUS CORPORATION
Inventor： Junya YAMADA
CPC classification number: H01R12/59 , H01B7/02 , H01R9/05 , H01R12/50 , H01R13/646 , H01R31/08 , H05K1/028 , H05K1/18 , H05K1/181 , H05K7/00
Abstract: An electronic circuit module includes: a substrate on which a wiring pattern having an electrode portion is formed; a cable having an external insulator and a conductor portion, at least a distal end side of the external insulator being removed to expose a conductor, an exposed portion of the conductor being defined as the conductor portion; and an electronic component having terminals at least on two opposed faces of the electronic component. At least one of the terminals of the electronic component is directly connected to the conductor portion, and is configured to be electrically connected to the electrode portion through the conductor portion.
-
公开(公告)号：US20160093991A1
公开(公告)日：2016-03-31
申请号：US14963403
申请日：2015-12-09
Applicant: OLYMPUS CORPORATION
Inventor： Keiichi KOBAYASHI , Junya YAMADA
IPC: H01R24/50
CPC classification number: H01R24/50 , H01R9/0515 , H01R12/53 , H01R12/57 , H01R24/38 , H01R2107/00
Abstract: A cable connection structure includes cables and a substrate having an electrode thereon. The cables are configured to be connected to the electrode. Each cable includes: a core wire formed of conductive material; a tubular inner insulator for covering an outer circumference of the core wire; a shield which extends along a longitudinal direction of the inner insulator and includes conductors for covering an outer circumference of the inner insulator, and has an exposed portion for exposing the inner insulator; and an outer insulator for covering an outer circumference of the shield. The shield including a region where the exposed portion is formed, the inner insulator, and the core wire are exposed in a stepped manner toward a distal end of each cable. The substrate includes a first electrode configured to be electrically connected to the core wire, and a second electrode configured to be electrically connected to the shield.
Abstract translation: 电缆连接结构包括电缆和其上具有电极的基板。 电缆被配置为连接到电极。 每个电缆包括：由导电材料形成的芯线; 用于覆盖芯线的外周的管状内绝缘体; 屏蔽件，其沿着所述内绝缘体的纵向方向延伸并且包括用于覆盖所述内绝缘体的外周的导体，并且具有用于暴露所述内绝缘体的暴露部分; 以及用于覆盖屏蔽件的外周的外绝缘体。 包括形成露出部分的区域，内绝缘体和芯线的屏蔽件以阶梯状的方式朝向每根电缆的远端露出。 基板包括被配置为电连接到芯线的第一电极和被配置为电连接到屏蔽的第二电极。
-
公开(公告)号：US20130314521A1
公开(公告)日：2013-11-28
申请号：US13954144
申请日：2013-07-30
Applicant: OLYMPUS CORPORATION
Inventor： Nau SATAKE , Hiroyuki MOTOHARA , Junya YAMADA , Takanori SEKIDO , Mikio NAKAMURA
IPC: H04N7/18
CPC classification number: H04N7/18 , A61B1/00096 , A61B1/0011 , A61B1/051 , G02B23/2423 , G02B23/2484
Abstract: An image pickup unit includes an image pickup device, an objective lens, and a prism that has a reflective surface. The image pickup unit includes: a projecting portion that is an area at which the image pickup device projects to the rear from the prism; a terminal portion provided on the projecting portion; a flexible printed wiring board that extends along the prism and the projecting portion; an image pickup device connection terminal portion formed on a face that faces the projecting portion of the flexible printed wiring board; and a cable connection terminal portion formed at an area that extends over the projecting portion of the flexible printed wiring board. The terminal portion and the image pickup device connection terminal portion are joined in an opposed state. An electronic component is mounted on a face on an opposite side to the reflective surface of the flexible printed wiring board.
Abstract translation: 图像拾取单元包括具有反射表面的图像拾取装置，物镜和棱镜。 图像拾取单元包括：突出部，其是图像拾取装置从棱镜向后突出的区域; 设置在突出部上的端子部; 柔性印刷布线板，其沿着棱镜和突出部分延伸; 形成在面对柔性印刷电路板的突出部分的面上的图像拾取装置连接端子部分; 以及电缆连接端子部，形成在柔性印刷电路板的突出部的上方延伸的区域。 端子部分和图像拾取装置连接端子部分处于相对的状态。 电子部件安装在与柔性印刷电路板的反射面相反的一侧的面上。
-
公开(公告)号：US20220409032A1
公开(公告)日：2022-12-29
申请号：US17898884
申请日：2022-08-30
Applicant: OLYMPUS CORPORATION
Inventor： Toru WAKABAYASHI , Junya YAMADA
Abstract: A distal end portion includes: an imager that is held by a metal lens frame; a distal end frame that is made of an electric insulating material and includes a through hole; an electrically conductive exterior portion; a first electrical conductor pattern that has a first end and a second end, the first end being in contact with the lens frame, the second end being connected to a first terminal that is in contact with the exterior portion; and a second electrical conductor pattern that is formed independently of the first electrical conductor pattern, and has a first end and a second end, the first end of the second electrical conductor pattern being in contact with the lens frame, the second end of the second electrical conductor pattern being connected to a second terminal that is not in contact with the exterior portion.
-
Patent Agency Ranking
公开(公告)号：US20230007769A1
公开(公告)日：2023-01-05
申请号：US17944294
申请日：2022-09-14
Applicant: OLYMPUS CORPORATION
Inventor： Junya YAMADA , Hiroyuki MOTOHARA
Abstract: An electronic module includes a three-dimensional wiring board including a cavity portion in which a bottom surface and four wall surfaces are formed, a plurality of electrodes being provided on the bottom surface, and a plurality of electronic components mounted on the plurality of electrodes and including a plurality of chip components and an image pickup module configured to pick up an image in an opening section direction of the cavity portion. A wall surface among the four wall surfaces that corresponds to a direction in which the plurality of chip components are arrayed is an inclined surface having an inclination with respect to the bottom surface.
-
6.发明申请SEMICONDUCTOR DEVICE CONNECTION STRUCTURE, ULTRASONIC MODULE, AND ULTRASONIC ENDOSCOPE SYSTEM HAVING ULTRASONIC MODULE 有权半导体器件连接结构，超声波模块和具超声波模块的超声内窥镜系统公开(公告)号：US20150279764A1
公开(公告)日：2015-10-01
申请号：US14738334
申请日：2015-06-12
Applicant: OLYMPUS CORPORATION
Inventor： Junya YAMADA
IPC: H01L23/498 , A61B8/12 , A61B8/00
CPC classification number: H01L23/4985 , A61B8/12 , A61B8/445 , A61B8/4483 , A61B8/4494 , B06B1/0622 , H01L23/498 , H01L23/49838 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor device connection structure includes: a semiconductor element having a plate shape and including an external connection electrode on a surface of the semiconductor element; a support member which is stacked on the semiconductor element to be adhered to the semiconductor element and of which adhesion surface has a column shape that is substantially same as that of the semiconductor element, a thickness of the support member in a stacking direction being larger than that of the semiconductor element; and a flexible board configured to be electrically connected to the external connection electrode. The flexible board is arranged on a side surface of the semiconductor element and on a side surface of the support member and is adhered only to the side surface of the support member with an adhesive.
Abstract translation: 半导体器件连接结构包括：半导体元件，其具有板状，并且在半导体元件的表面上包括外部连接电极; 叠层在所述半导体元件上以与所述半导体元件粘合并且所述粘合表面具有与所述半导体元件基本相同的列形状的支撑构件，所述支撑构件在层叠方向上的厚度大于 半导体元件的; 以及被配置为电连接到外部连接电极的柔性板。 柔性基板配置在半导体元件的侧面和支撑部件的侧面上，并且仅用粘合剂粘附在支撑部件的侧面。
-
公开(公告)号：US20160372848A1
公开(公告)日：2016-12-22
申请号：US15255504
申请日：2016-09-02
Applicant: OLYMPUS CORPORATION
Inventor： Junya YAMADA
CPC classification number: H01R12/598 , A61B1/00124 , A61B8/12 , H01R9/0515 , H01R12/592 , H01R12/62 , H05K1/117 , H05K3/3405 , H05K2201/0919 , H05K2201/09809 , H05K2201/09845 , H05K2201/10287 , H05K2201/10356
Abstract: A cable connection structure includes a substrate and a coaxial cable connected to the substrate. The coaxial cable has: a conductor; an inner insulator that coats an outer periphery of the conductor; a shield that coats an outer periphery of the inner insulator; and an outer insulator that coats an outer periphery of the shield. The substrate has: a plate-shaped insulating base material; a conductor connection electrode to which the conductor is connected; and a shield connection electrode to which the shield is connected. A ground is provided on a back surface of the base material opposite to where the conductor connection electrode is formed. The shield connection electrode is an exposed portion of the ground. At a connection part of the substrate to which the coaxial cable is connected, the shield connection electrode, the base material, and the conductor connection electrode are bared in a stepwise fashion.
Abstract translation: 电缆连接结构包括基板和连接到基板的同轴电缆。 同轴电缆具有：导线; 覆盖导体外周的内绝缘体; 覆盖所述内绝缘体的外周的屏蔽体; 以及外罩，该外绝缘体涂覆该护罩的外周。 基板具有：板状绝缘基材; 连接导体的导体连接电极; 以及屏蔽连接电极，屏蔽件连接到该屏蔽连接电极。 在与形成导体连接电极的相反侧的基材的背面上设置有接地。 屏蔽连接电极是地面的暴露部分。 在与同轴电缆连接的基板的连接部分，屏蔽连接电极，基体材料和导体连接电极以逐步的方式露出。
-
8.发明申请公开(公告)号：US20180132704A1
公开(公告)日：2018-05-17
申请号：US15869248
申请日：2018-01-12
Applicant: OLYMPUS CORPORATION
Inventor： Junya YAMADA , Takanori SEKIDO , Yukie YOSHIZAWA
CPC classification number: A61B1/00124 , A61B1/0011 , A61B1/00114 , A61B1/00128 , A61B1/0052 , A61B1/012 , A61B1/051 , H01R12/53 , H01R12/57 , H01R12/7005 , H01R43/02 , H04N7/10 , H04N7/18
Abstract: A cable connection structure includes: a plurality of cables including at least one coaxial cable including a central conductor, an inner insulator, and an outer conductor exposed stepwise at a distal end portion; an aligning member that is in contact with side surfaces of exposed conductive portions of the cables positioned at least at both ends, of the plurality of cables, to align the cables such that axial directions become parallel and outer sheaths of the adjacent cables are in contact with each other; and a board on which an electrode portion that connects the conductive portions of the plurality of cables are arranged. The conductive portions of the plurality of cables are electrically and mechanically connected to the electrode portion of the board via a conductive connecting member and the aligning member.
-
9.发明申请CABLE CONNECTION STRUCTURE, ULTRASONIC PROBE, AND ULTRASONIC ENDOSCOPE SYSTEM 审中-公开电缆连接结构，超声波探头和超声内窥镜系统公开(公告)号：US20150011891A1
公开(公告)日：2015-01-08
申请号：US14494980
申请日：2014-09-24
Applicant: OLYMPUS CORPORATION
Inventor： Junya YAMADA
IPC: H01R13/447 , H01R35/02 , A61B8/12 , H05K1/02 , A61B8/00 , H01R13/655 , H05K1/11
CPC classification number: H01R13/447 , A61B1/00114 , A61B1/00124 , A61B8/12 , A61B8/445 , A61B8/4494 , G01N29/24 , G01N29/32 , G01N2291/2636 , H01R12/598 , H01R12/61 , H01R13/655 , H01R35/02 , H05K1/0215 , H05K1/111
Abstract: A cable connection structure for connecting a plurality of cables to an electrode provided on a substrate includes an extended portion that is provided integrally with the plurality of cables, extends from the plurality of cables, and covers at least a connection part between the plurality of cables and the electrode.
Abstract translation: 用于将多个电缆连接到设置在基板上的电极的电缆连接结构包括与所述多根电缆一体设置的延伸部分，从所述多根电缆延伸，并且至少覆盖所述多条电缆之间的连接部分 和电极。
-
-
-
-
-
-
-
-
Search Results
9
records
(took 0.012 seconds)
