公开(公告)号：US09780273B2

公开(公告)日：2017-10-03

申请号：US14784414

申请日：2014-04-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Boris Eichenberg ,  Michael Zitzlsperger

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/54 ,  H01L33/48 ,  H01L33/52

CPC classification number: H01L33/62 ,  H01L33/48 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

Abstract: An optoelectronic component includes a carrier substrate; at least one light emitting semiconductor chip arranged on a surface of the carrier substrate; and a frame part at least laterally partly surrounding the light emitting semiconductor chip; and comprising an injection-molded body, and wherein the frame part includes an injection-molded body and a diaphragm part, the diaphragm part including a protuberance enclosed by the injection-molded body.

公开(公告)号：US09554439B2

公开(公告)日：2017-01-24

申请号：US14410565

申请日：2013-06-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Boris Eichenberg ,  Jürgen Holz

IPC: H05B37/00 ,  H05B41/00 ,  H05B33/08 ,  H01L25/075 ,  B60Q1/14 ,  H01L25/16

CPC classification number: H05B33/089 ,  B60Q1/1415 ,  H01L25/0753 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2924/1301 ,  H05B33/0827 ,  H05B33/0845 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lighting device comprising a plurality of components (2) provided for generating radiation, a plurality of row lines (Z1, Z2) and a plurality of column lines (S1, S2, . . . , S5) is specified, wherein the components are in each case electrically conductively connected to a row line and to a column line and the lighting device is provided for the simultaneous operation of at least two components. A lighting arrangement comprising such a lighting device and a method for operating a lighting device are furthermore specified.

Abstract translation: 一种照明装置，其特征在于，具有多个用于产生辐射的部件（2），多条行线（Z1，Z2）和多条列线（S1，S2，...，S5） 在每种情况下电导体连接到行线和列线，并且照明装置被设置用于至少两个部件的同时操作。 此外，还规定了包括这种照明装置的照明装置和用于操作照明装置的方法。

公开(公告)号：US09553078B2

公开(公告)日：2017-01-24

申请号：US14411425

申请日：2013-05-31

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Boris Eichenberg ,  Jürgen Holz

IPC: F21V9/16 ,  H01L33/50 ,  H01L25/075 ,  H01L33/48 ,  H01L33/54 ,  F21S8/10 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L25/0753 ,  F21S41/141 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

Abstract: A light-emitting diode module includes a carrier and a plurality of optoelectronic semiconductor chips mounted on a carrier top and configured to generate primary radiation. The semiconductor chips are arranged in part at a first distance and in part at a second, greater distance from one another. Between the adjacent semiconductor chips arranged at the first distance from one another there is located a radiation-transmissive first filling for optical coupling. Between the adjacent semiconductor chips arranged at the second distance from one another there is located a radiation-opaque second filling for optical isolation.

Abstract translation: 发光二极管模块包括载体和安装在载体顶部上并被配置为产生初级辐射的多个光电子半导体芯片。 半导体芯片部分地布置在第一距离处，并且部分地彼此相距更远的距离地布置。 在彼此之间以第一距离布置的相邻半导体芯片之间，设置用于光耦合的辐射透射式第一填充物。 在以彼此相距第二距离布置的相邻半导体芯片之间设置用于光学隔离的辐射不透明的第二填充物。

公开(公告)号：US20160064634A1

公开(公告)日：2016-03-03

申请号：US14784414

申请日：2014-04-16

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Boris Eichenberg ,  Michael Zitzlsperger

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/48 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

Abstract: An optoelectronic component includes a carrier substrate; at least one light emitting semiconductor chip arranged on a surface of the carrier substrate; and a frame part at least laterally partly surrounding the light emitting semiconductor chip; and comprising an injection-molded body, and wherein the frame part includes an injection-molded body and a diaphragm part, the diaphragm part including a protuberance enclosed by the injection-molded body.

Abstract translation: 光电子部件包括载体基板; 布置在所述载体基板的表面上的至少一个发光半导体芯片; 以及至少横向部分地围绕所述发光半导体芯片的框架部分; 并且包括注射成型体，并且其中所述框架部分包括注射成型体和隔膜部，所述隔膜部包括由所述注射成型体包围的突起。

公开(公告)号：US20150228630A1

公开(公告)日：2015-08-13

申请号：US14411425

申请日：2013-05-31

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Boris Eichenberg ,  Jürgen Holz

IPC: H01L25/075 ,  H01L33/50 ,  F21S8/10 ,  H01L33/60 ,  H01L33/62 ,  H01L33/56 ,  H01L33/48 ,  H01L33/54

CPC classification number: H01L25/0753 ,  F21S41/141 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

Abstract: A light-emitting diode module includes a carrier and a plurality of optoelectronic semiconductor chips mounted on a carrier top and configured to generate primary radiation. The semiconductor chips are arranged in part at a first distance and in part at a second, greater distance from one another. Between the adjacent semiconductor chips arranged at the first distance from one another there is located a radiation-transmissive first filling for optical coupling. Between the adjacent semiconductor chips arranged at the second distance from one another there is located a radiation-opaque second filling for optical isolation.

Abstract translation: 发光二极管模块包括载体和安装在载体顶部上并被配置为产生初级辐射的多个光电子半导体芯片。 半导体芯片部分地布置在第一距离处，并且部分地彼此相距更远的距离地布置。 在彼此之间以第一距离布置的相邻半导体芯片之间，设置用于光耦合的辐射透射式第一填充物。 在以彼此相距第二距离布置的相邻半导体芯片之间设置用于光学隔离的辐射不透明的第二填充物。

公开(公告)号：US10299341B2

公开(公告)日：2019-05-21

申请号：US15882842

申请日：2018-01-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Boris Eichenberg ,  Juergen Holz

IPC: B60Q1/02 ,  H05B33/08 ,  H01L25/075 ,  B60Q1/14 ,  H01L25/16

Abstract: A lighting device comprising a plurality of components (2) provided for generating radiation, a plurality of row lines (Z1, Z2) and a plurality of column lines (S1, S2, . . . , S5) is specified, wherein the components are in each case electrically conductively connected to a row line and to a column line and the lighting device is provided for the simultaneous operation of at least two components. A lighting arrangement comprising such a lighting device and a method for operating a lighting device are furthermore specified.

公开(公告)号：US09918368B2

公开(公告)日：2018-03-13

申请号：US15387553

申请日：2016-12-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Boris Eichenberg ,  Jürgen Holz

IPC: B60Q1/02 ,  H05B33/08 ,  B60Q1/14

CPC classification number: H05B33/089 ,  B60Q1/1415 ,  H01L25/0753 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2924/1301 ,  H05B33/0827 ,  H05B33/0845 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lighting device comprising a plurality of components (2) provided for generating radiation, a plurality of row lines (Z1, Z2) and a plurality of column lines (S1, S2, . . . , S5) is specified, wherein the components are in each case electrically conductively connected to a row line and to a column line and the lighting device is provided for the simultaneous operation of at least two components. A lighting arrangement comprising such a lighting device and a method for operating a lighting device are furthermore specified.

公开(公告)号：US20160181483A1

公开(公告)日：2016-06-23

申请号：US14908257

申请日：2014-07-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Boris Eichenberg ,  Herbert Brunner ,  Simon Jerebic

IPC: H01L33/50

CPC classification number: H01L33/505 ,  H01L2933/0041

Abstract: A method of producing a converter element for an optoelectronic component includes arranging a plurality of converter laminae on a carrier, forming a molded body, wherein the converter laminae are embedded into the molded body, and top sides and undersides of the converter laminae remain at least partly not covered by the molded body; and dividing the molded body to obtain a converter element.

Abstract translation: 一种制造用于光电子部件的转换器元件的方法包括在载体上布置多个转换器层，形成模制体，其中转换器层被嵌入到模制体中，并且转换器层的顶侧和下侧保持至少 部分不被成型体覆盖; 并分割成型体以获得转化元件。