公开(公告)号：US10483444B2

公开(公告)日：2019-11-19

申请号：US15757141

申请日：2016-08-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Harald Jäger ,  Jürgen Moosburger ,  Herbert Brunner

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/54 ,  H01L33/50 ,  H01L23/00 ,  H01L33/48 ,  H01L33/52

Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier including two metal layers, wherein the metal layers are detachable from one another, securing an optoelectronic semiconductor chip on the first metal layer of the carrier, and mechanically detaching the second metal layer from the first metal layer.

公开(公告)号：US20150327360A1

公开(公告)日：2015-11-12

申请号：US14405823

申请日：2013-06-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Knörr ,  Herbert Brunner

IPC: H05K1/02 ,  H05K1/18 ,  B23K1/008 ,  B23K1/00 ,  B23K1/08

CPC classification number: H05K1/0271 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/08 ,  H01L23/3735 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K1/181 ,  H01L2924/00

Abstract: A mounting carrier for semiconductor chips includes a second main surface provided for mounting of semiconductor chips, and a first main surface opposite to the second main surface. The mounting carrier also includes a mounting body, wherein the mounting body includes a first metallization on the side facing the first main surface and the first main surface includes a structure having a plurality of columnar structural elements.

Abstract translation: 用于半导体芯片的安装载体包括用于安装半导体芯片的第二主表面和与第二主表面相对的第一主表面。 安装托架还包括安装体，其中安装体在面向第一主表面的一侧包括第一金属化，第一主表面包括具有多个柱状结构元件的结构。

公开(公告)号：US20150255313A1

公开(公告)日：2015-09-10

申请号：US14436578

申请日：2013-10-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Martin Brandl ,  Markus Boss ,  Markus Pindl ,  Simon Jerebic ,  Herbert Brunner ,  Tobias Gebuhr

IPC: H01L21/56 ,  H01L21/78

CPC classification number: H01L21/563 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: Optoelectronic semiconductor devices and methods for producing optoelectronic semiconductor devices are disclosed. In an embodiment the method includes applying a plurality of arrangements of electrically conductive first and second contact elements on an auxiliary carrier, applying an optoelectronic semiconductor chip on the second contact element of each arrangement and electrically conductively connecting the optoelectronic semiconductor chip to the first contact element for each arrangement. The method further includes encapsulating the first contact elements and the second contact elements with an encapsulation material to form an encapsulation body and singulating the encapsulation body into a plurality of optoelectronic semiconductor devices, wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each first contact element, and wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each second contact element.

Abstract translation: 公开了用于制造光电半导体器件的光电半导体器件和方法。 在一个实施例中，该方法包括在辅助载体上施加导电的第一和第二接触元件的多个布置，在每个布置的第二接触元件上施加光电子半导体芯片，并将光电子半导体芯片导电连接到第一接触元件 为每个安排。 该方法还包括用封装材料封装第一接触元件和第二接触元件以形成封装主体，并将封装主体分成多个光电子半导体器件，其中封装材料与下侧齐平，面向辅助载体 的每个第一接触元件，并且其中所述封装材料与每个第二接触元件的面向所述辅助载体的底面齐平。

公开(公告)号：US09554458B2

公开(公告)日：2017-01-24

申请号：US14405823

申请日：2013-06-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Knörr ,  Herbert Brunner

IPC: B23K31/02 ,  H05K1/02 ,  B23K1/00 ,  B23K1/08 ,  B23K1/008 ,  H05K1/18 ,  H01L23/498 ,  H01L23/373

CPC classification number: H05K1/0271 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/08 ,  H01L23/3735 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K1/181 ,  H01L2924/00

Abstract: A mounting carrier for semiconductor chips includes a second main surface provided for mounting of semiconductor chips, and a first main surface opposite to the second main surface. The mounting carrier also includes a mounting body, wherein the mounting body includes a first metallization on the side facing the first main surface and the first main surface includes a structure having a plurality of columnar structural elements.

Abstract translation: 用于半导体芯片的安装载体包括用于安装半导体芯片的第二主表面和与第二主表面相对的第一主表面。 安装托架还包括安装体，其中安装体在面向第一主表面的一侧包括第一金属化，第一主表面包括具有多个柱状结构元件的结构。

公开(公告)号：US20150200339A1

公开(公告)日：2015-07-16

申请号：US14420310

申请日：2013-07-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ales Markytan ,  Christian Gärtner ,  Hans-Christoph Gallmeier ,  Ion Stoll ,  Herbert Brunner ,  Thomas Schlereth

IPC: H01L33/50

CPC classification number: H01L33/501 ,  H01L33/504 ,  H01L33/505 ,  H01L33/508 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In at least one embodiment, the semiconductor component includes an optoelectronic semiconductors chip. Furthermore, the semiconductor component includes a conversion-medium lamina, which is fitted to a main radiation side of the semiconductor chip and is designed for converting a primary radiation into a secondary radiation. The conversion-medium lamina includes a matrix material and conversion-medium particles embedded therein. Furthermore, the conversion-medium lamina includes a conversion layer. The conversion-medium particles are situated in the at least one conversion layer. The conversion-medium particles, alone or together with diffusion-medium particles optionally present, make up a proportion by volume of at least 50% of the conversion layer. Furthermore, the conversion-medium lamina includes a binder layer containing the conversion-medium particles with a proportion by volume of at most 2.5%.

Abstract translation: 在至少一个实施例中，半导体部件包括光电子半导体芯片。 此外，半导体部件包括转换介质层，其被安装到半导体芯片的主辐射侧，并被设计用于将初级辐射转换成次级辐射。 转化介质层包括嵌入其中的基质材料和转化介质颗粒。 此外，转换介质层包括转化层。 转化介质颗粒位于至少一个转化层中。 任选存在的单独或与扩散介质颗粒一起的转化介质颗粒占转化层的至少50％的体积比例。 此外，转化介质层包括含有体积比至多2.5％的转化介质颗粒的粘合剂层。

公开(公告)号：US12249804B2

公开(公告)日：2025-03-11

申请号：US17627296

申请日：2020-06-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Boss ,  Herbert Brunner

IPC: H01S5/00 ,  H01S5/0232 ,  H01S5/02326 ,  H01S5/02345 ,  H01S5/068 ,  H01S5/02253

Abstract: The invention relates to an optoelectronic component comprising a housing, an optoelectronic semiconductor chip and an optical element. The housing comprises a lead frame which has two external electrical contact points and two contact portions. The housing also comprises a housing body in which the lead frame is embedded, wherein each contact portion extends laterally out of one of the external electrical contact points in each case to a mounting surface of the housing, and therefore contact surfaces of the contact portions are exposed on the mounting surface. An electrical contact structure of the optical element is electrically conductively connected to the contact surfaces of the contact portions.

公开(公告)号：US20220278501A1

公开(公告)日：2022-09-01

申请号：US17627296

申请日：2020-06-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Boss ,  Herbert Brunner

IPC: H01S5/0232 ,  H01S5/02326 ,  H01S5/02345

Abstract: The invention relates to an optoelectronic component comprising a housing, an optoelectronic semiconductor chip and an optical element. The housing comprises a lead frame which has two external electrical contact points and two contact portions. The housing also comprises a housing body in which the lead frame is embedded, wherein each contact portion extends laterally out of one of the external electrical contact points in each case to a mounting surface of the housing, and therefore contact surfaces of the contact portions are exposed on the mounting surface. An electrical contact structure of the optical element is electrically conductively connected to the contact surfaces of the contact portions.

公开(公告)号：US09406847B2

公开(公告)日：2016-08-02

申请号：US14420310

申请日：2013-07-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ales Markytan ,  Christian Gärtner ,  Hans-Christoph Gallmeier ,  Ion Stoll ,  Herbert Brunner ,  Thomas Schlereth

IPC: H01L33/50

CPC classification number: H01L33/501 ,  H01L33/504 ,  H01L33/505 ,  H01L33/508 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In at least one embodiment, the semiconductor component includes an optoelectronic semiconductors chip. Furthermore, the semiconductor component includes a conversion-medium lamina, which is fitted to a main radiation side of the semiconductor chip and is designed for converting a primary radiation into a secondary radiation. The conversion-medium lamina includes a matrix material and conversion-medium particles embedded therein. Furthermore, the conversion-medium lamina includes a conversion layer. The conversion-medium particles are situated in the at least one conversion layer. The conversion-medium particles, alone or together with diffusion-medium particles optionally present, make up a proportion by volume of at least 50% of the conversion layer. Furthermore, the conversion-medium lamina includes a binder layer containing the conversion-medium particles with a proportion by volume of at most 2.5%.

Abstract translation: 在至少一个实施例中，半导体部件包括光电子半导体芯片。 此外，半导体部件包括转换介质层，其被安装到半导体芯片的主辐射侧，并被设计用于将初级辐射转换成次级辐射。 转化介质层包括嵌入其中的基质材料和转化介质颗粒。 此外，转换介质层包括转化层。 转化介质颗粒位于至少一个转化层中。 任选存在的单独或与扩散介质颗粒一起的转化介质颗粒占转化层的至少50％的体积比例。 此外，转化介质层包括含有体积比至多2.5％的转化介质颗粒的粘合剂层。

公开(公告)号：US20160181483A1

公开(公告)日：2016-06-23

申请号：US14908257

申请日：2014-07-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Boris Eichenberg ,  Herbert Brunner ,  Simon Jerebic

IPC: H01L33/50

CPC classification number: H01L33/505 ,  H01L2933/0041

Abstract: A method of producing a converter element for an optoelectronic component includes arranging a plurality of converter laminae on a carrier, forming a molded body, wherein the converter laminae are embedded into the molded body, and top sides and undersides of the converter laminae remain at least partly not covered by the molded body; and dividing the molded body to obtain a converter element.

Abstract translation: 一种制造用于光电子部件的转换器元件的方法包括在载体上布置多个转换器层，形成模制体，其中转换器层被嵌入到模制体中，并且转换器层的顶侧和下侧保持至少 部分不被成型体覆盖; 并分割成型体以获得转化元件。

公开(公告)号：US20180261742A1

公开(公告)日：2018-09-13

申请号：US15757141

申请日：2016-08-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Harald Jäger ,  Jürgen Moosburger ,  Herbert Brunner

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/50 ,  H01L23/00

Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier including two metal layers, wherein the metal layers are detachable from one another, securing an optoelectronic semiconductor chip on the first metal layer of the carrier, and mechanically detaching the second metal layer from the first metal layer.