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公开(公告)号：US10374196B2
公开(公告)日：2019-08-06
申请号：US15306966
申请日：2015-04-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： David Racz , Guenter Spath , Markus Richter
Abstract: A lighting device and a method for producing a lighting device are disclosed. In an embodiment, the lighting device includes a carrier, at least one optoelectronic illuminant arranged on the carrier, the illuminant configured to emit light into an emission area and a color scattering layer located in the emission area, the color scattering layer configured to generate a color by scattering of light at a surface of the color scattering layer facing away from the illuminant.
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Patent Agency Ranking
公开(公告)号：US20170054110A1
公开(公告)日：2017-02-23
申请号：US15306966
申请日：2015-04-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： David Racz , Guenter Spath , Markus Richter
CPC classification number: H01L51/5268 , H01L25/0753 , H01L27/0248 , H01L27/322 , H01L33/44 , H01L33/505 , H01L51/5237 , H01L51/5275 , H01L51/56 , H01L2924/0002 , H01L2924/00
Abstract: A lighting device and a method for producing a lighting device are disclosed. In an embodiment, the lighting device includes a carrier, at least one optoelectronic illuminant arranged on the carrier, the illuminant configured to emit light into an emission area and a color scattering layer located in the emission area, the color scattering layer configured to generate a color by scattering of light at a surface of the color scattering layer facing away from the illuminant.
Abstract translation: 公开了一种照明装置和照明装置的制造方法。 在一个实施例中，照明装置包括载体，布置在载体上的至少一个光电发光体，配置成将光发射到发射区域中的光源和位于发射区域中的彩色散射层，该彩色散射层被配置为产生 在彩色散射层的背离光源的表面散射光的颜色。
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3.发明授权公开(公告)号：US09362466B2
公开(公告)日：2016-06-07
申请号：US14493257
申请日：2014-09-22
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Hans-Christoph Gallmeier , Michael Kruppa , Raimund Schwarz , Guenter Spath
CPC classification number: H01L33/507 , H01L33/38 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48465 , H01L2933/0033 , H01L2933/0041 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
Abstract: A method for manufacturing an optoelectronic semiconductor component, comprising: providing a semiconductor chip in a composite wafer, comprising an active side for emitting a primary radiation and a contact terminal which is arranged on the active side; depositing a coupling element on the active side; attaching a luminescence conversion element, for converting part of the primary radiation into a secondary radiation, to the coupling element.
Abstract translation: 一种制造光电子半导体部件的方法，包括：在复合晶片中提供半导体芯片，其包括用于发射初级辐射的有源侧和布置在所述有源侧的接触端子; 在活动侧上沉积耦合元件; 附接用于将一次辐射的一部分转换成二次辐射的发光转换元件连接到耦合元件。
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公开(公告)号：US10276748B2
公开(公告)日：2019-04-30
申请号：US15514814
申请日：2015-10-07
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Mathias Kaempf , Simon Jerebic , Ingo Neudecker , Guenter Spath , Michael Huber , Korbinian Perzlmaier
Abstract: Disclosed is a radiation-emitting semi-conductor chip (1) comprising an epitaxial semi-conductor layer sequence (3) which emits electromagnetic radiation in operation. The epitaxial semi-conductor layer sequence (3) is applied on a a transparent substrate (4), wherein the substrate (4) has a first main surface (8) facing the semi-conductor layer sequence (3), a second main surface (9) facing away from the semi-conductor layer sequence (3) and a first lateral flank (10) arranged between the first main surface (8) and the second main surface (9), and the lateral flank (10) has a decoupling structure which is formed in a targeted manner from separating tracks. Also disclosed is a method for producing the semi-conductor chip, and a component comprising such a semi-conductor chip.
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公开(公告)号：US10115869B2
公开(公告)日：2018-10-30
申请号：US15030359
申请日：2014-10-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Mathias Kaempf , Simon Jerebic , Ingo Neudecker , Guenter Spath , Michael Huber
Abstract: The invention relates to an optoelectronic semiconductor chip (10) comprising a carrier (2) and a semiconductor body (1) having an active layer (13) provided for generating electromagnetic radiation. Said carrier (2) has a first main surface (2A) facing the semiconductor body, a second main surface (2B) facing away from the semiconductor body, and a sidewall (2C) arranged between the first main surface and the second main surface. The carrier (2) has a structured region (21, 22, 23, 2C) for enlarging the total surface area of the sidewall, wherein the structured region has singulation traces. The invention also relates to an optoelectronic component (100) comprising such a semiconductor chip and a method for producing a plurality of such semiconductor chips are specified.
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6.发明申请公开(公告)号：US20150008471A1
公开(公告)日：2015-01-08
申请号：US14493257
申请日：2014-09-22
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Hans-Christoph GALLMEIER , Michael Kruppa , Raimund Schwarz , Guenter Spath
CPC classification number: H01L33/507 , H01L33/38 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48465 , H01L2933/0033 , H01L2933/0041 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
Abstract: A method for manufacturing an optoelectronic semiconductor component, comprising: providing a semiconductor chip in a composite wafer, comprising an active side for emitting a primary radiation and a contact terminal which is arranged on the active side; depositing a coupling element on the active side; attaching a luminescence conversion element, for converting part of the primary radiation into a secondary radiation, to the coupling element.
Abstract translation: 一种制造光电子半导体部件的方法，包括：在复合晶片中提供半导体芯片，其包括用于发射初级辐射的有源侧和布置在所述有源侧的接触端子; 在活动侧上沉积耦合元件; 附接用于将一次辐射的一部分转换成二次辐射的发光转换元件连接到耦合元件。
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