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公开(公告)号：US10978628B2
公开(公告)日：2021-04-13
申请号：US16475064
申请日：2017-12-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stephan Haslbeck , Dirk Becker
IPC: H01L33/62 , H01L25/16 , H01L31/0203 , H01L33/48
Abstract: A device and a connection carrier are disclosed. In an embodiment a device includes a connection carrier, a frame and an encapsulation body, wherein the connection carrier, the encapsulation body and/or the frame have different thermal expansion coefficients, a semiconductor chip mechanically and electronically connected to the connection carrier and a metal layer arranged between the connection carrier and the frame, wherein the encapsulation body surrounds the semiconductor chip and is adjacent to the connection carrier and the frame, wherein the metal layer is not in electrically conductive connection, and wherein the metal layer projects beyond the frame in a lateral direction.
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公开(公告)号：US10978597B2
公开(公告)日：2021-04-13
申请号：US16339523
申请日：2017-10-05
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Dirk Becker , Matthias Sperl
IPC: H01L29/16 , H01L31/02 , H01L25/16 , H01L33/44 , H01L33/48 , H01L33/62 , H01L31/16 , H01L33/00 , H01L33/58
Abstract: A sensor includes a printed circuit board; at least one semiconductor chip arranged on the printed circuit board and includes a front-side contact, wherein the semiconductor chip is a radiation-detecting semiconductor chip; an embedding layer arranged on the printed circuit board and laterally adjoining the at least one semiconductor chip; and a contact layer connected to the front-side contact of the at least one semiconductor chip.
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公开(公告)号：US10205071B2
公开(公告)日：2019-02-12
申请号：US15577045
申请日：2016-05-19
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Andreas Biebersdorf , Dirk Becker , Bernd Barchmann , Björn Hoxhold , Philipp Schlosser , Andreas Waldschik
Abstract: A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top. The carrier has a metallic core material and at least on the carrier top a metal layer. A dielectric mirror is applied to the core material. At least two holes are formed through the carrier. A ceramic layer with a thickness of at most 150 μm at least on the carrier underside and in the holes is produced. The ceramic layer includes the core material as a component. Metallic contact layers are applied to at least subregions of the ceramic layer on the carrier underside and in the holes so that the carrier top electrically connects to the carrier underside through the holes. At least one radiation-emitting semiconductor chip is applied to the carrier top and the semiconductor chip is electronically bonded to the contact layers.
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Patent Agency Ranking
公开(公告)号：US20190326496A1
公开(公告)日：2019-10-24
申请号：US16475064
申请日：2017-12-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stephan Haslbeck , Dirk Becker
IPC: H01L33/62 , H01L25/16 , H01L31/0203 , H01L33/48
Abstract: A device and a connection carrier are disclosed. In an embodiment a device includes a connection carrier, a frame and an encapsulation body, wherein the connection carrier, the encapsulation body and/or the frame have different thermal expansion coefficients, a semiconductor chip mechanically and electronically connected to the connection carrier and a metal layer arranged between the connection carrier and the frame, wherein the encapsulation body surrounds the semiconductor chip and is adjacent to the connection carrier and the frame, wherein the metal layer is not in electrically conductive connection, and wherein the metal layer projects beyond the frame in a lateral direction.
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公开(公告)号：US20190237593A1
公开(公告)日：2019-08-01
申请号：US16339582
申请日：2017-10-05
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Dirk Becker , Matthias Sperl
IPC: H01L31/0232 , H01L31/18 , H01L31/02 , H01L31/0203 , H01L25/16
CPC classification number: H01L31/02327 , H01L25/167 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/167 , H01L31/1876 , H01L33/62 , Y02P70/521
Abstract: A method of producing sensors includes providing a carrier plate; arranging semiconductor chips on the carrier plate, wherein the semiconductor chips include at least radiation-detecting semiconductor chips; providing radiation-transmissive optical elements on the carrier plate provided with the semiconductor chips, wherein a plurality of radiation-transmissive optical elements are provided jointly on the carrier plate provided with the semiconductor chips; and singulating the carrier plate provided with the semiconductor chips and the radiation-transmissive optical elements, thereby forming separate sensors including a section of the carrier plate, at least one radiation-detecting semiconductor chip and at least one radiation-transmissive optical element.
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公开(公告)号：US20200116829A1
公开(公告)日：2020-04-16
申请号：US16483037
申请日：2018-01-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Dirk Becker , Martin Haushalter , Claus Jaeger
Abstract: A measuring arrangement having an optical transmitter and an optical receiver are disclosed. In an embodiment a measuring arrangement includes an optical transmitter configured to transmit electromagnetic measuring radiation into a transmission space, an optical receiver configured to receive measuring radiation reflected by an object in a reception space and a covering configured to reduce reception of an interference radiation by the receiver, wherein the interference radiation is measuring radiation not reflected by the object.
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公开(公告)号：US20190237590A1
公开(公告)日：2019-08-01
申请号：US16339523
申请日：2017-10-05
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Dirk Becker , Matthias Sperl
CPC classification number: H01L31/02002 , H01L25/167 , H01L31/16 , H01L33/0025 , H01L33/0095 , H01L33/44 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2933/0033 , H01L2933/0066
Abstract: A sensor includes a printed circuit board; at least one semiconductor chip arranged on the printed circuit board and includes a front-side contact, wherein the semiconductor chip is a radiation-detecting semiconductor chip; an embedding layer arranged on the printed circuit board and laterally adjoining the at least one semiconductor chip; and a contact layer connected to the front-side contact of the at least one semiconductor chip.
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8.发明申请公开(公告)号：US20180145234A1
公开(公告)日：2018-05-24
申请号：US15577045
申请日：2016-05-19
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Andreas Biebersdorf , Dirk Becker , Bernd Barchmann , Björn Hoxhold , Philipp Schlosser , Andreas Waldschik
IPC: H01L33/60 , H01L33/62 , H01L33/00 , H01L25/075
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/005 , H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48137 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2933/0033 , H01L2933/0075 , H01L2924/00012 , H01L2224/4554
Abstract: A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top, wherein the carrier has a metallic core material and at least on the carrier top a metal layer and following this a dielectric mirror are applied to the core material, forming at least two holes through the carrier, producing a ceramic layer with a thickness of at most 150 μm at least on the carrier underside and in the holes, wherein the ceramic layer includes the core material as a component, applying metallic contact layers to at least subregions of the ceramic layer on the carrier underside and in the holes so that the carrier top electrically connects to the carrier underside through the holes, and applying at least one radiation-emitting semiconductor chip to the carrier top and electrical bonding of the semiconductor chip to the contact layers.
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