摘要:
A method of acquiring an offset deflection amount for a shaped beam, includes forming reference images of first and second figures which can be shaped by first and second aperture plates placed on a lithography apparatus; forming, using design data of a mark, a reference image of the mark; forming a first convolution reference image obtained by a convolution calculation of the reference image of the mark and the reference image of the first figure and a second convolution reference image obtained by a convolution calculation of the reference image of the mark and the reference image of the second figure; respectively scanning over the mark with charged particle beams having shaped into the first and second figures by using the first and second aperture plates to acquire optical images of the first and second figures; forming a first convolution synthesis image obtained by a convolution calculation of the first convolution reference image and the optical image of the first figure and a second convolution synthesis image obtained by a convolution calculation of the second convolution reference image and the optical image of the second figure; calculating center-of-gravity positions of the first and second convolution synthesis images; and calculating an offset deflection amount for the charged particle beam having shaped into the second figure to match reference positions of the first and second figures based on the center-of-gravity positions of the first and second convolution synthesis images to output a result calculated.
摘要:
A lithography apparatus includes a unit irradiating a charged particle beam; first and second aperture plate members configured to shape the beam; first and second coils configured to be arranged between the unit and the first aperture plate member, to temporarily deflect the beam, to change a direction of the beam after the temporarily deflecting, and to deflect the beam to a position where the beam passes through the first aperture plate member by the changing; a lens configured to be arranged between the first and second aperture plate members and to control a focal position of the beam having passed through the first aperture plate member; and a unit configured to calculate a difference between positions of the beam on the second aperture plate member obtained by different sets of amounts of deflection at a same focal position when a combination of one of focal positions of the beam controlled by the lens and one of sets of amounts of deflection of the beam obtained by the first and second coils is changed.
摘要:
A focusing method of a charged particle beam includes measuring a first set value to focus a beam on a position of a reference plane by using a lens coil, acquiring a first factor to change a set value of an electrostatic lens depending on a distance and a second factor to change a set value of the coil depending on a distance, measuring a level distribution of a target plane, correcting the first set value by using the second factor to correct a focal point position of the beam in the coil from the position of the reference plane to an intermediate level position of the level distribution of the target plane, and correcting a second set value of the lens depending on a level position of the target plane by using the first factor to correct a focal point position of the beam by the lens.
摘要:
A method of acquiring an offset deflection amount for a shaped beam, includes forming reference images of first and second figures which can be shaped by first and second aperture plates placed on a lithography apparatus, and a reference image of a mark; forming first and second convolution reference images based on the reference images of the mark and of the first and second figures; scanning over the mark with charged particle beams shaped into the first and second figures to acquire optical images of the first and second figures; forming first and second convolution synthesis images based on the first convolution reference image and respectively the optical images of the first and second figures; and calculating an offset deflection amount for the charged particle beam shaped into the second figure to match reference positions of the first and second figures based on center-of-gravity positions of the first and second convolution synthesis images.
摘要:
A lithography apparatus includes a unit irradiating a charged particle beam; first and second aperture plate members configured to shape the beam; first and second coils configured to be arranged between the unit and the first aperture plate member, to temporarily deflect the beam, to change a direction of the beam after the temporarily deflecting, and to deflect the beam to a position where the beam passes through the first aperture plate member by the changing; a lens configured to be arranged between the first and second aperture plate members and to control a focal position of the beam having passed through the first aperture plate member; and a unit configured to calculate a difference between positions of the beam on the second aperture plate member obtained by different sets of amounts of deflection at a same focal position when a combination of one of focal positions of the beam controlled by the lens and one of sets of amounts of deflection of the beam obtained by the first and second coils is changed.
摘要:
A focusing method of a charged particle beam includes measuring a first set value to focus a beam on a position of a reference plane by using a lens coil, acquiring a first factor to change a set value of an electrostatic lens depending on a distance and a second factor to change a set value of the coil depending on a distance, measuring a level distribution of a target plane, correcting the first set value by using the second factor to correct a focal point position of the beam in the coil from the position of the reference plane to an intermediate level position of the level distribution of the target plane, and correcting a second set value of the lens depending on a level position of the target plane by using the first factor to correct a focal point position of the beam by the lens.
摘要:
A method of obtaining a deflection aberration correcting voltage. The method includes writing predetermined patterns at a plurality of focus height positions such that a dose is used as a variable. Dimensional variations of width sizes of the predetermined patterns written at the plurality of focus height positions such that the dose is used as the variable are measured. Further, effective resolutions of the written predetermined patterns are calculated by using the dimensional variations. The method further includes, on the basis of a focus height position at which a minimum effective resolution of the predetermined patterns is obtained, calculating a correcting voltage to correct deflection aberration and outputting the correcting voltage. The correcting voltage is used when a charged particle beam is deflected.
摘要:
A deflector for an equipment of electron beam lithography, the deflector including a plurality of control electrodes arranged symmetrically relative to the center axis of an irradiated electron beam, the electrodes configured to control the electron beam by applying voltages respectively, a plurality of molding substrates arranged symmetrically relative to the center axis of the electron beam configured to face outer peripheral surfaces of the plurality of control electrodes and a plurality of earth electrodes arranged respectively at the plurality of molding substrates. The deflector can suppress generation of cross talks with an improved accuracy of controlling an electron beam.
摘要:
There is provided a charged beam drawing apparatus which includes main/sub two-stage deflectors, divides a main deflection drawing region on a sample into sub deflection drawing regions determined by the deflection width of the sub deflector, selects one of the sub deflection drawing regions by use of the main deflector and draws shots in the selected sub deflection drawing region by use of the sub deflector. A sub deflection driving unit includes a sub deflection sensitivity correction circuit, a sub deflection astigmatic correction circuit, an adder circuit which adds an output of the sub deflection sensitivity correction circuit and an output of the sub deflection astigmatic correction circuit, and a deflection amplifier which additionally applies an output of the adder circuit to the sub deflector.
摘要:
A charged beam applying apparatus comprises a column at least having a charged beam generation section and optical system for controlling the charged beam and a chamber for holding a specimen in place which is exposed with the charged beam. At least one inner portion of the column is formed of a specific material whose an atomic number is equal or less than 22. When a contamination is cleaned off in the column through the utilization of an oxidation effect, an oxide film is sometimes formed inside the column. The electric charging of the oxide film causes a beam control error. The specific material such as the metal of the atomic number causes very much less such error. This is because such specific material involves less emission of secondary electrons and less electric charging in the oxide film formed.