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公开(公告)号：US11109489B2
公开(公告)日：2021-08-31
申请号：US16541789
申请日：2019-08-15
Applicant: RAYTHEON COMPANY
Inventor： Mikhail Pevzner , James E. Benedict , Andrew R. Southworth , Thomas V. Sikina , Kevin Wilder , Matthew Souza , Aaron Michael Torberg
Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.
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公开(公告)号：US10999938B1
公开(公告)日：2021-05-04
申请号：US16861326
申请日：2020-04-29
Applicant: Raytheon Company
Inventor： Mikhail Pevzner , Donald G. Hersey , Gregory G. Beninati , Thomas J. Tellinghuisen , James E. Benedict
Abstract: Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.
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公开(公告)号：US11497118B2
公开(公告)日：2022-11-08
申请号：US17174904
申请日：2021-02-12
Applicant: RAYTHEON COMPANY
Inventor： Channing Paige Favreau , James E. Benedict , Mikhail Pevzner , Thomas V. Sikina
Abstract: A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.
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公开(公告)号：US20220254750A1
公开(公告)日：2022-08-11
申请号：US17169098
申请日：2021-02-05
Applicant: Raytheon Company
Inventor： Patrick E. Boyle , James E. Benedict , Erika Klek , Mikhail Pevzner
IPC: H01L23/00
Abstract: Methods and apparatus for providing an interconnection including a stack of wirebond balls having a selected impedance. The wirebond balls may have a size, which may comprise a radius, configured for the selected impedance. The stack may comprise a number of wirebond balls configured for the selected impedance and/or may comprise a material selected for the selected impedance. In embodiments, the selected impedance is primarily resistive (e.g., 50 Ohms), such that the overall reactance is minimized.
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5.发明授权公开(公告)号：US11122692B1
公开(公告)日：2021-09-14
申请号：US16898930
申请日：2020-06-11
Applicant: RAYTHEON COMPANY
Inventor： James E. Benedict , Gregory G. Beninati , Mikhail Pevzner , Thomas V. Sikina , Andrew R. Southworth
Abstract: A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.
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Patent Agency Ranking
公开(公告)号：US11653484B2
公开(公告)日：2023-05-16
申请号：US16678211
申请日：2019-11-08
Applicant: RAYTHEON COMPANY
Inventor： Mikhail Pevzner , James E. Benedict , Andrew R. Southworth , Wade A. Schwanda
CPC classification number: H05K13/0409 , H05K3/38 , H05K3/465 , H05K3/4638 , H05K3/4679 , H05K13/0413 , B25J18/00 , B29C64/379 , B32B2457/08 , H05K3/0008 , H05K2203/167
Abstract: An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.
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公开(公告)号：US20210368629A1
公开(公告)日：2021-11-25
申请号：US17395977
申请日：2021-08-06
Applicant: RAYTHEON COMPANY
Inventor： Mikhail Pevzner , James E. Benedict , Andrew R. Southworth , Thomas V. Sikina , Kevin Wilder , Matthew Souza , Aaron Michael Torberg
Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.
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公开(公告)号：US20210305187A1
公开(公告)日：2021-09-30
申请号：US16836470
申请日：2020-03-31
Applicant: RAYTHEON COMPANY
Inventor： James E. Benedict , Paul A. Danello , Mikhail Pevzner , Thomas V. Sikina , Andrew R. Southworth
IPC: H01L23/00
Abstract: A process of fabricating an electromagnetic circuit includes providing a first sheet of dielectric material including a top surface having at least one conductive trace and depositing a solder bump on the at least one conductive trace. The process further includes applying a second sheet of dielectric material to the first sheet of dielectric material with bond film sandwiched in between, the second sheet of dielectric material having a through-hole providing access to the solder bump. The process further includes bonding the first and second dielectric materials to one another and removing bond film resin from the solder bump. The process further includes machining the solder bump by the drilling or milling process to achieve a desired amount of solder in the solder bump.
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公开(公告)号：US20210144892A1
公开(公告)日：2021-05-13
申请号：US16678211
申请日：2019-11-08
Applicant: RAYTHEON COMPANY
Inventor： Mikhail Pevzner , James E. Benedict , Andrew R. Southworth , Wade A. Schwanda
Abstract: An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.
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公开(公告)号：US11470725B2
公开(公告)日：2022-10-11
申请号：US17395977
申请日：2021-08-06
Applicant: RAYTHEON COMPANY
Inventor： Mikhail Pevzner , James E. Benedict , Andrew R. Southworth , Thomas V. Sikina , Kevin Wilder , Matthew Souza , Aaron Michael Torberg
Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.
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