Abstract:
A semiconductor device with a structure in which a plurality of chips are stacked includes: a chip area; a scribe lane at a circumference of the chip area; a dam structure that separates the chip area and the scribe lane; a detection wire that extends from the chip area to the scribe lane by passing through the dam structure; and a detection circuit in the chip area that is electrically connected to the detection wire and is configured to detect a defect in the scribe lane.
Abstract:
A memory device provides a first memory area and a second memory area. A smart buffer includes; a priority setting unit receiving sensing data and a corresponding weight, determining a priority of the sensing data based on the corresponding weight, and classifying the sensing data as first priority sensing data or second priority sensing data based on the priority, and a channel controller allocating a channel to a first channel group, allocating another channel to a second channel group, assigning the first channel group to process the first priority sensing data in relation to the first memory area, and assigning the second channel group to process the second priority sensing data in relation to the second memory area.
Abstract:
A memory device comprises a memory cell region including a first metal pad, and a peripheral circuit region including a second metal pad and vertically connected to the memory cell region by the first metal pad and the second metal pad, wherein the memory cell region includes a first memory area having first memory cells storing N-bit data and a second memory area having second memory cells storing M-bit data, where ‘M’ and ‘N’ are natural numbers and M is greater than N, and the peripheral circuit region includes a controller configured to read data stored in the first memory area using a first read operation, read data stored in the second memory area using a second read operation different from the first read operation, and selectively store data in one of the first memory area and the second memory area based on a frequency of use (FOU) of the data.
Abstract:
A nonvolatile memory system includes a nonvolatile memory device and a memory controller that controls the nonvolatile memory device. The nonvolatile memory device includes multiple memory blocks. Each of the memory blocks includes memory cells. Each of the memory cells has any one of an erase state and one of multiple different program states. An operation method of the nonvolatile memory system includes receiving a physical erase command from an external device. The operation method also includes performing a fast erase operation, responsive to the received physical erase command, with respect to at least one memory block so that first memory cells of the at least one memory block have a fast erase state different from the erase state.
Abstract:
A semiconductor device includes a substrate, an N-well area formed in the substrate, a first P-channel metal oxide semiconductor (PMOS) transistor having active regions formed in the N-well area, and a first N-channel metal oxide semiconductor (NMOS) transistor having active regions formed in the substrate. The first NMOS transistor includes a first N-type active region overlapping each of the substrate and the N-well area, when viewed from above a plane parallel to a top surface of the substrate.
Abstract:
An integrated circuit includes; a substrate including a single active region, a first active resistor formed on the substrate, and a transistor including a first junction area in the single active region. The first active resistor and the transistor are electrically connected through the first junction area. The first active resistor is formed between a first node and a second node included in the first junction area. The first node is connected to a first contact, and the second node is connected to a second contact.
Abstract:
A nonvolatile memory device includes a memory cell region including first pads and a peripheral circuit region including second pads. The regions comprises switches that are electrically connected with the pads, respectively, a test signal generator that generates test signals and to transmit the test signals to the switches, internal circuits that receive first signals through the pads and the switches, to perform operations based on the first signals, and to output second signals through the switches and the pads based on a result of the operations, and a switch controller that controls the switches so that the pads communicate with the test signal generator during a test operation and that the pads communicate with the internal circuits after a completion of the test operation. The peripheral circuit region is vertically connected to the memory cell region by the first metal pads and the second metal pads directly.
Abstract:
A storage device includes a nonvolatile memory device including memory blocks and a controller configured to control the nonvolatile memory device. Each of the memory blocks includes a plurality of cell strings each including at least one selection transistor and a plurality of memory cells stacked on a substrate in a direction perpendicular to the substrate. The controller controls the nonvolatile memory device to perform a read operation on some of selection transistors of a selected one of the memory blocks and to perform a program operation on the selection transistors of the selected memory block according to a result of the read operation.
Abstract:
A memory device includes; a memory cell array including a first memory block and a second memory block adjacently disposed in a first direction, driving signal lines respectively corresponding to vertically stacked word lines, and a pass transistor circuit including an odd number of pass transistor groups and connected between the driving signal lines and the memory cell array. One of the odd number of pass transistor groups includes a first pass transistor connected between a first word line of the first memory block and a first driving signal line among the driving signal lines, and a second pass transistor connected between a first word line of the second memory block and the first driving signal line adjacently disposed to the first pass transistor in a second direction.
Abstract:
A semiconductor device includes a substrate, an N-well area formed in the substrate, a first P-channel metal oxide semiconductor (PMOS) transistor having active regions formed in the N-well area, and a first N-channel metal oxide semiconductor (NMOS) transistor having active regions formed in the substrate. The first NMOS transistor includes a first N-type active region overlapping each of the substrate and the N-well area, when viewed from above a plane parallel to a top surface of the substrate.