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公开(公告)号：US20180302976A1
公开(公告)日：2018-10-18
申请号：US15763736
申请日：2016-09-29
发明人： Hiroshi Maenaka , Osamu Inui
CPC分类号： H05K1/0207 , B32B15/08 , B32B15/092 , B32B15/20 , B32B27/20 , B32B27/26 , B32B27/281 , B32B27/302 , B32B27/34 , B32B27/40 , B32B27/42 , B32B2250/44 , B32B2264/10 , B32B2264/102 , B32B2307/206 , B32B2307/30 , B32B2307/304 , B32B2307/306 , B32B2307/308 , B32B2307/538 , B32B2307/54 , B32B2307/732 , B32B2307/734 , B32B2307/748 , B32B2457/08 , H05K1/02 , H05K1/0204 , H05K1/0209 , H05K1/0284 , H05K1/0373 , H05K2201/068 , H05K2201/09745
摘要： There is provided a laminated body capable of lowering thermal resistance and capable of suppressing peeling off after a cooling/heating cycle. The laminated body according to the present invention includes an insulating resin layer, a first metal material being a metal foil or a metal plate, and a second metal material being a metal foil or a metal plate, the first metal material is layered on a first surface of the insulating resin layer and the second metal material is layered on a second surface opposite to the first surface of the insulating resin layer, the thickness of the insulating resin layer is 200 μm or less, the total thickness of the first metal material and the second metal material is 200 μm or more, the ratio of the thickness of the first metal material to the thickness of the second metal material is 0.2 or more and 5 or less, and the ratio of the surface area of a surface opposite to the insulating resin layer side of the first metal material to the surface area of a surface opposite to the insulating resin layer side of the second metal material is 0.5 or more and 2 or less.
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2.发明申请METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT 审中-公开制造固化膜的方法，制造电子元件的方法和电子元件公开(公告)号：US20160046813A1
公开(公告)日：2016-02-18
申请号：US14778859
申请日：2014-11-05
发明人： Mitsuru Tanikawa , Takashi Watanabe , Michihisa Ueda , Shigeru Nakamura , Hiroshi Maenaka , Ryosuke Takahashi , Takanori Inoue , Yoshito Fujita , Osamu Inui
IPC分类号： C09D4/00 , H05K1/02 , H05K3/28 , C09D163/00 , B05C11/10
CPC分类号： C09D4/00 , B41J3/407 , B41J11/002 , C09D11/101 , C09D11/30 , C09D11/52 , H05K3/287 , H05K2203/013 , H05K2203/0577
摘要： Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film.The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.
摘要翻译： 本发明提供一种固化物膜的制造方法，其能够提高精细固化物膜的形成精度，并且还能够提高固化物膜的密合性。 根据本发明的可固化膜的制造方法包括使用喷墨装置涂布光固化性和可热固化也为液体状的固化性组合物的涂布工序，第一光照射工序中，固化性组合物 用来自第一光照射部分的光照射加热步骤，其中加热了照射光的预固化产物膜，喷墨装置具有用于储存可固化组合物的墨水罐，排出部分和循环流动路径 并且在涂布步骤中，在喷墨装置中循环时施加可固化组合物。
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公开(公告)号：US11492528B2
公开(公告)日：2022-11-08
申请号：US16623172
申请日：2018-06-21
发明人： Yuko Kawahara , Keigo Oowashi , Kouji Ashiba , Rui Zhang , Osamu Inui , Hiroshi Maenaka
IPC分类号： B32B7/06 , B32B15/09 , B32B15/20 , B32B27/08 , B32B27/20 , B32B27/34 , B32B27/36 , B32B27/06 , B32B27/18 , C09K5/14 , C08K7/00 , C08K3/08 , C08K3/38 , H05K3/38 , H05K7/20 , B32B37/10 , H01L23/373 , H05K1/03
摘要： Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.
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公开(公告)号：US20200181358A1
公开(公告)日：2020-06-11
申请号：US16623261
申请日：2018-06-21
发明人： Yuko Kawahara , Keigo Oowashi , Kouji Ashiba , Rui Zhang , Kazuyuki Yahara , Osamu Inui , Hiroshi Maenaka
摘要： Provided is a resin material capable of effectively enhancing insulation properties, adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.90 or less, second inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.95 or more, third inorganic particles having an average aspect ratio of more than 2, and a binder resin.
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公开(公告)号：US11459443B2
公开(公告)日：2022-10-04
申请号：US16623261
申请日：2018-06-21
发明人： Yuko Kawahara , Keigo Oowashi , Kouji Ashiba , Rui Zhang , Kazuyuki Yahara , Osamu Inui , Hiroshi Maenaka
摘要： Provided is a resin material capable of effectively enhancing insulation properties, adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.90 or less, second inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.95 or more, third inorganic particles having an average aspect ratio of more than 2, and a binder resin.
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公开(公告)号：US20160049297A1
公开(公告)日：2016-02-18
申请号：US14778935
申请日：2014-11-18
发明人： Mitsuru Tanikawa , Takashi Watanabe , Michihisa Ueda , Shigeru Nakamura , Hiroshi Maenaka , Ryosuke Takahashi , Takanori Inoue , Yoshito Fujita
CPC分类号： H01L21/02288 , C08F220/10 , C09J4/00 , C09J5/00 , C09J2205/31 , H01L21/52 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L2224/27318 , H01L2224/29101 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2224/83862 , H01L2224/83874 , H01L2224/83885 , H01L2224/8592 , H01L2924/00014 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Provided is a method for producing an electronic component, which is capable of forming a cured adhesive layer easily with high accuracy.The method for producing a curable film electronic component according to the present invention includes an application step in which an adhesive is applied onto a first electronic component body using an ink jet device to form an adhesive layer, a first light irradiation step in which an adhesive layer is irradiated with light from a first light irradiation part, an attachment step in which a second electronic component body is disposed on the adhesive layer irradiated with light and attached, and a step in which the adhesive layer is cured by heating, thereby giving an electronic component, the ink jet device includes an ink tank to store the adhesive, a discharge part, and a circulation flow path part, and in the application step, the adhesive is applied while being circulated in the ink jet device.
摘要翻译： 提供一种能够容易地以高精度形成固化的粘合剂层的电子部件的制造方法。 根据本发明的可固化膜电子部件的制造方法包括使用喷墨装置将粘合剂涂布在第一电子部件主体上以形成粘合剂层的涂布步骤，第一光照射步骤，其中粘合剂 用来自第一光照射部分的光照射层，其中将第二电子部件主体设置在被照射的光附着的粘合剂层上的安装步骤，以及粘合剂层通过加热固化的步骤， 电子部件，喷墨装置包括用于存储粘合剂的墨水罐，排出部分和循环流动路径部分，并且在施加步骤中，粘合剂在喷墨装置中循环的同时施加。
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公开(公告)号：US20220098419A1
公开(公告)日：2022-03-31
申请号：US17548454
申请日：2021-12-10
发明人： Mitsuru Tanikawa , Takashi Watanabe , Michihisa Ueda , Shigeru Nakamura , Hiroshi Maenaka , Ryosuke Takahashi , Takanori Inoue , Yoshito Fujita , Osamu Inui
IPC分类号： C09D4/00 , H05K3/28 , B41J3/407 , C09D11/52 , B41J11/00 , C09D11/101 , C09D11/30 , B05D3/06 , B05D1/26
摘要： Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film.
The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.-
公开(公告)号：US11220604B2
公开(公告)日：2022-01-11
申请号：US14778859
申请日：2014-11-05
发明人： Mitsuru Tanikawa , Takashi Watanabe , Michihisa Ueda , Shigeru Nakamura , Hiroshi Maenaka , Ryosuke Takahashi , Takanori Inoue , Yoshito Fujita , Osamu Inui
IPC分类号： C09D4/00 , H05K1/02 , H05K3/28 , C09D163/00 , B05C11/10 , B41J3/407 , C09D11/52 , B41J11/00 , C09D11/101 , C09D11/30 , B05D3/06 , B05D1/26
摘要： Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film. The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.
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公开(公告)号：US20210139761A1
公开(公告)日：2021-05-13
申请号：US16623172
申请日：2018-06-21
发明人： Yuko Kawahara , Keigo Oowashi , Kouji Ashiba , Rui Zhang , Osamu Inui , Hiroshi Maenaka
IPC分类号： C09K5/14 , C08K3/08 , C08K3/38 , B32B27/20 , B32B27/36 , B32B27/34 , B32B27/08 , B32B7/06 , B32B15/09 , B32B15/20
摘要： Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.
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公开(公告)号：US10477671B2
公开(公告)日：2019-11-12
申请号：US15763736
申请日：2016-09-29
发明人： Hiroshi Maenaka , Osamu Inui
IPC分类号： H05K1/02 , B32B15/08 , H05K1/03 , B32B15/092 , B32B15/20 , B32B27/20 , B32B27/26 , B32B27/28 , B32B27/30 , B32B27/34 , B32B27/40 , B32B27/42
摘要： There is provided a laminated body capable of lowering thermal resistance and capable of suppressing peeling off after a cooling/heating cycle. The laminated body according to the present invention includes an insulating resin layer, a first metal material being a metal foil or a metal plate, and a second metal material being a metal foil or a metal plate, the first metal material is layered on a first surface of the insulating resin layer and the second metal material is layered on a second surface opposite to the first surface of the insulating resin layer, the thickness of the insulating resin layer is 200 μm or less, the total thickness of the first metal material and the second metal material is 200 μm or more, the ratio of the thickness of the first metal material to the thickness of the second metal material is 0.2 or more and 5 or less, and the ratio of the surface area of a surface opposite to the insulating resin layer side of the first metal material to the surface area of a surface opposite to the insulating resin layer side of the second metal material is 0.5 or more and 2 or less.
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