公开(公告)号：US11495467B2

公开(公告)日：2022-11-08

申请号：US17115313

申请日：2020-12-08

Applicant: SEMES CO., LTD.

Inventor： Jung Suk Goh ,  Jae Seong Lee ,  Do Youn Lim ,  Kuk Saeng Kim ,  Young Dae Chung ,  Tae Shin Kim ,  Jee Young Lee ,  Won Geun Kim ,  Ji Hoon Jeong ,  Kwang Sup Kim ,  Pil Kyun Heo ,  Yoon Ki Sa ,  Ye Rim Yeon ,  Hyun Yoon ,  Do Yeon Kim ,  Yong Jun Seo ,  Byeong Geun Kim ,  Young Je Um

IPC: H01L21/26 ,  H01L21/311 ,  H01L21/67 ,  H01L21/66

Abstract: Method and apparatus for etching a thin layer including silicon nitride formed on a substrate are disclosed. Etchant including phosphoric acid and water is supplied on the substrate so that a liquid layer is formed on the substrate. The thin layer is etched by reaction between the thin layer and the etchant. Thickness of the liquid layer is measured to detect variation in the thickness of the liquid layer while etching the thin layer. Variation in the concentration of the phosphoric acid and the water is calculated based on the variation in the thickness of the liquid layer. Water is supplied on the substrate based on the variation in the concentration of the phosphoric acid and the water so that the concentration of the phosphoric acid and the water becomes a predetermined value.

公开(公告)号：US11149234B2

公开(公告)日：2021-10-19

申请号：US16250069

申请日：2019-01-17

Applicant: Samsung Electronics Co., Ltd. ,  SEMES Co., Ltd.

Inventor： Mi Hyun Park ,  Jung-Min Oh ,  Young-Hoo Kim ,  Hyo San Lee ,  Tae Keun Kim ,  Ye Rim Yeon ,  Hae Rim Oh ,  Ji Soo Jeong ,  Min Hee Cho

IPC: B08B3/10 ,  C11D11/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  C11D17/00 ,  C11D3/28 ,  C11D3/20 ,  C11D3/34 ,  C11D3/32 ,  C11D1/14 ,  C11D1/12 ,  C11D1/29

Abstract: A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28 M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.35.

公开(公告)号：US11715651B2

公开(公告)日：2023-08-01

申请号：US17079445

申请日：2020-10-24

Applicant: SEMES CO., LTD.

Inventor： Young Dae Chung ,  Won Geun Kim ,  Jee Young Lee ,  Ji Hoon Jeong ,  Tae Shin Kim ,  Jung Suk Goh ,  Cheng Bin Cui ,  Ye Rim Yeon

IPC: H01L21/67

CPC classification number: H01L21/6708 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/67253

Abstract: A substrate treatment apparatus includes a substrate support unit, a chemical supply unit supplying a chemical solution onto an upper surface of a substrate supported on the substrate support unit, a laser irradiation unit applying a laser pulse to the substrate to heat the substrate, and a controller controlling the laser irradiation unit to emit the laser pulse such that the substrate is repeatedly heated and cooled to maintain a preset temperature.

公开(公告)号：US11135624B2

公开(公告)日：2021-10-05

申请号：US16379294

申请日：2019-04-09

Applicant: SEMES CO., LTD.

Inventor： Mi Young Jo ,  Da Jeong Kim ,  Ye Rim Yeon ,  Jun Taek Koo

IPC: B08B7/00 ,  H01L21/02 ,  H01L21/67 ,  B08B3/10 ,  H01L21/324

Abstract: An embodiment of the present invention provides a substrate cleaning method including: supplying of a liquid cleaning solution containing a thermoreactive polymer resin in a solvent to a substrate; trapping of particles by gelling the liquid cleaning solution by phase transition through first heat treatment; liquefying of the gel-state cleaning solution with the particle trapped therein by phase transition through second heat treatment; and removing of the liquefied cleaning solution by supplying a rinse solution.