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    COMPACT LEADFRAME PACKAGE
    6.
    发明申请
    COMPACT LEADFRAME PACKAGE 有权

    公开(公告)号：US20220084913A1

    公开(公告)日：2022-03-17

    申请号：US17537318

    申请日：2021-11-29

    Applicant: STMICROELECTRONICS, INC.

    Inventor： Jefferson TALLEDO

    IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31

    Abstract: Generally described, one or more embodiments are directed to a leadframe package having a plurality of leads, a die pad, a semiconductor die coupled to the die pad, and encapsulation material. An inner portion of the die pad includes a perimeter portion that includes a plurality of protrusions that are spaced apart from each other. The protrusions aid in locking the die pad in the encapsulation material. The plurality of leads includes upper portions and base portions. The base portion of the plurality of leads are offset (or staggered) relative to the plurality of protrusions of the die pad. In particular, the base portions extend longitudinally toward the die pad and are located between respective protrusions. The upper portions of the leads include lead locks that extend beyond the base portions in a direction of adjacent leads. The lead locks and the protrusion in the die pad aid in locking the leads and the die pad in the encapsulation material.

    LEADFRAME PACKAGE WITH SIDE SOLDER BALL CONTACT AND METHOD OF MANUFACTURING
    7.
    发明申请
    LEADFRAME PACKAGE WITH SIDE SOLDER BALL CONTACT AND METHOD OF MANUFACTURING 有权

    公开(公告)号：US20210050282A1

    公开(公告)日：2021-02-18

    申请号：US17073190

    申请日：2020-10-16

    Applicant: STMICROELECTRONICS, INC.

    Inventor： Jefferson TALLEDO ,  Tito MANGAOANG

    IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

    Abstract: The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.

    DIE WITH METALLIZED SIDEWALL AND METHOD OF MANUFACTURING
    8.
    发明申请
    DIE WITH METALLIZED SIDEWALL AND METHOD OF MANUFACTURING 审中-公开

    公开(公告)号：US20180204786A1

    公开(公告)日：2018-07-19

    申请号：US15408979

    申请日：2017-01-18

    Applicant: STMicroelectronics, Inc.

    Inventor： Rennier RODRIGUEZ ,  Aiza Marie AGUDON ,  Jefferson TALLEDO

    IPC: H01L23/495 ,  H01L21/683 ,  H01L23/00 ,  H01L23/58 ,  H01L21/78

    Abstract: The present disclosure is directed to a die having a metallized sidewall and methods of manufacturing the same. A contiguous metal layer is applied to each edge of a backside of a wafer. The wafer is cut at a base of a plurality of channels formed in the backside to create individual die each having a flange that is part of a sidewall of the die and includes a portion that is covered by the metal layer. When an individual die is coupled to a die pad, a semiconductive glue bonds the metal layer on the sidewall and a backside of the die to the die pad, which decreases the risk of delamination along the sides of the die. The flange also prevents the glue from contacting the active side of the die by acting as a barrier against adhesive creep of the glue up the sidewall of the die.

    LEADFRAME WITH PAD ANCHORING MEMBERS AND METHOD OF FORMING THE SAME
    9.
    发明申请
    LEADFRAME WITH PAD ANCHORING MEMBERS AND METHOD OF FORMING THE SAME 有权

    公开(公告)号：US20210257315A1

    公开(公告)日：2021-08-19

    申请号：US17306363

    申请日：2021-05-03

    Applicant: STMICROELECTRONICS, INC.

    Inventor： Jefferson TALLEDO

    IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56 ,  H01L21/48

    Abstract: A leadframe having extensions around an outer edge of a die pad are disclosed. More specifically, leadframes are created with a flange formed at the outer edge of the die pad and extending away from the die pad. The flange is bent, such that it is positioned at an angle with respect to the die pad. Leadframes are also created with anchoring posts formed adjacent the outer edge of the die pad and extending away from the die pad. The anchoring posts have a central thickness that is less than a thickness of first and second portions opposite the central portion. When the leadframe is incorporated into a package, molding compound completely surrounds each flange or anchoring post, which increases the bond strength between the leadframe and the molding compound due to increased contact area. The net result is a reduced possibility of delamination at edges of the die pad.

    SEMICONDUCTOR PACKAGE WITH FLEXIBLE INTERCONNECT
    10.
    发明申请
    SEMICONDUCTOR PACKAGE WITH FLEXIBLE INTERCONNECT 有权

    公开(公告)号：US20210032098A1

    公开(公告)日：2021-02-04

    申请号：US16934981

    申请日：2020-07-21

    Applicant: STMICROELECTRONICS, INC.

    Inventor： Jefferson TALLEDO

    IPC: B81B7/00 ,  B81C1/00

    Abstract: A cavity type semiconductor package with a substrate and a cap is disclosed. The semiconductor package includes a first semiconductor die coupled to the substrate and a layer of flexible material on a surface of the cap. A trace is on the layer of flexible material. The cap is coupled to the substrate with the layer of flexible material and the trace between the cap and the substrate. A second semiconductor die is coupled to the layer of flexible material and the trace on the cap. The cap further includes an aperture to expose the second semiconductor die to the ambient environment. The layer of flexible material absorbs stress during operation cycles of the package induced by the different coefficient of thermal expansions of the cap and the substrate to reduce the likelihood of separation of the cap from the substrate.

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