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公开(公告)号:US20220169498A1
公开(公告)日:2022-06-02
申请号:US17534286
申请日:2021-11-23
Inventor: Enri DUQI , Lorenzo BALDO , Paolo FERRARI , Benedetto Vigna , Flavio Francesco VILLA , Laura Maria CASTOLDI , Ilaria GELMI
IPC: B81B7/00
Abstract: A semiconductor device includes: a substrate; a transduction microstructure integrated in the substrate; a cap joined to the substrate and having a first face adjacent to the substrate and a second, outer, face; and a channel extending through the cap from the second face to the first face and communicating with the transduction microstructure. A protective membrane made of porous polycrystalline silicon permeable to aeriform substances is set across the channel.
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2.
公开(公告)号:US20240199415A1
公开(公告)日:2024-06-20
申请号:US18084811
申请日:2022-12-20
Applicant: STMicroelectronics International N.V.
Inventor: Federico VERCESI , Andrea NOMELLINI , Paolo FERRARI
CPC classification number: B81C1/00285 , B81B7/0038 , B81B2201/0235 , B81B2201/0242 , B81B2203/0315 , B81B2207/07 , B81C2201/0109 , B81C2201/0132 , B81C2201/0178 , B81C2203/0118
Abstract: Disclosed herein is a process flow for forming a MEMS IMU including an accelerometer and a gyroscope each located in a separate sealed cavity maintained at a different pressure. Formation of the MEMS IMU includes the use of a first vHF release to etch a sacrificial layer underneath a structural layer containing the accelerometer and gyroscope and capping the device under formation to set both cavities at a first pressure. The floor of one of the cavities is formed to including a gas permeable layer. Formation further includes forming a chimney underneath the gas permeable layer and then performing a second vHF release to etch through the gas permeable layer and expose the cavity containing the gas permeable layer so that its pressure may be set to be different than that of the other cavity when the chimney is sealed.
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公开(公告)号:US20250002332A1
公开(公告)日:2025-01-02
申请号:US18745739
申请日:2024-06-17
Applicant: STMicroelectronics International N.V.
Inventor: Giorgio ALLEGATO , Paolo FERRARI , Laura OGGIONI
IPC: B81B7/02 , B81C3/00 , G01C19/5783 , G01L9/00
Abstract: Described herein is a microelectromechanical sensor device, comprising: a stack of a first die that integrates a pressure-detection structure and a second die that integrates an inertial detection structure, the first die constituting a cap for the inertial detection structure and being bonded to the second die so as to define a hermetic cavity. The first die has a first substrate, having a front surface and a rear surface that is bonded to said second die, a buried cavity being buried and entirely contained in the first substrate and being arranged in a position corresponding to the front surface, from which it is separated by a membrane. In particular, the aforesaid buried cavity is distinct and separate from the hermetic cavity.
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4.
公开(公告)号:US20230301191A1
公开(公告)日:2023-09-21
申请号:US18323262
申请日:2023-05-24
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Paolo FERRARI , Flavio Francesco VILLA , Lucia ZULLINO , Andrea NOMELLINI , Luca SEGHIZZI , Luca ZANOTTI , Bruno MURARI , Martina SCOLARI
IPC: H10N10/855 , H10N10/01 , H10N10/17
CPC classification number: H10N10/855 , H10N10/01 , H10N10/17
Abstract: A method of fabricating a thermoelectric converter that includes providing a layer of a Silicon-based material having a first surface and a second surface, opposite to and separated from the first surface by a Silicon-based material layer thickness; forming a plurality of first thermoelectrically active elements of a first thermoelectric semiconductor material having a first Seebeck coefficient, and forming a plurality of second thermoelectrically active elements of a second thermoelectric semiconductor material having a second Seebeck coefficient, wherein the first and second thermoelectrically active elements are formed to extend through the Silicon-based material layer thickness, from the first surface to the second surface; forming electrically conductive interconnections in correspondence of the first surface and of the second surface of the layer of Silicon-based material, for electrically interconnecting the plurality of first thermoelectrically active elements and the plurality of second thermoelectrically active elements, and forming an input electrical terminal and an output electrical terminal electrically connected to the electrically conductive interconnections, wherein the first thermoelectric semiconductor material and the second thermoelectric semiconductor material comprise Silicon-based materials selected among porous Silicon or polycrystalline SiGe or polycrystalline Silicon.
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公开(公告)号:US20240124299A1
公开(公告)日:2024-04-18
申请号:US18486044
申请日:2023-10-12
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Paolo FERRARI , Flavio Francesco VILLA
CPC classification number: B81C1/00269 , B81B3/0021 , B81B2201/0235 , B81B2201/0242 , B81C2203/0118 , B81C2203/0145
Abstract: Process for manufacturing a MEMS device, including: forming a dielectric region which coats part of a semiconductive substrate of a first semiconductive wafer; forming a region which is permeable to gases and coats the dielectric region; coupling the first semiconductive wafer to a second semiconductive wafer so as to form a first chamber, which houses a first movable mass and has a pressure equal to a first value, and a second chamber, which houses a second movable mass and has a pressure equal to the first value, the permeable region facing the second chamber; selectively removing a portion of the semiconductor substrate and an underlying portion of the dielectric region, so as to expose a part of the permeable region, so as to allow gas exchanges through the permeable region; placing the first and the second semiconductive wafers in an environment with a pressure equal to a second value, so that the pressure in the second chamber becomes equal to the second value; and subsequently forming, on the exposed part of the permeable region, a sealing region impermeable to gases.
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公开(公告)号:US20230064114A1
公开(公告)日:2023-03-02
申请号:US17821717
申请日:2022-08-23
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Paolo FERRARI , Flavio Francesco VILLA , Roberto CAMPEDELLI , Luca LAMAGNA , Enri DUQI , Mikel AZPEITIA URQUIA , Silvia NICOLI , Maria Carolina TURI
Abstract: The present disclosure is directed to a method for manufacturing a micro-electro-mechanical device. The method includes the steps of forming, on a substrate, a first protection layer of crystallized aluminum oxide, impermeable to HF; forming, on the first protection layer, a sacrificial layer of silicon oxide removable with HF; forming, on the sacrificial layer, a second protection layer of crystallized aluminum oxide; exposing a sacrificial portion of the sacrificial layer; forming, on the sacrificial portion, a first membrane layer of a porous material, permeable to HF; forming a cavity by removing the sacrificial portion through the first membrane layer; and sealing pores of the first membrane layer by forming a second membrane layer on the first membrane layer.
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7.
公开(公告)号:US20230389426A1
公开(公告)日:2023-11-30
申请号:US18318612
申请日:2023-05-16
Applicant: STMicroelectronics S.r.l.
Inventor: Paolo FERRARI , Flavio Francesco VILLA , Marco DEL SARTO
Abstract: MEMS thermoelectric generator comprising: a thermoelectric cell including one or more thermoelectric elements partially extending on a cavity of the thermoelectric cell; a thermoplastic layer extending on the thermoelectric cell and having a top surface and a bottom surface opposite to each other along a first axis, the bottom surface facing the thermoelectric cell and the thermoplastic layer being of thermally insulating material and configured to be processed through laser direct structuring, LDS, technique; a heat sink configured to exchange heat with the thermoelectric cell interposed, along the first axis, between the heat sink and the thermoplastic layer; and a thermal via of metal material, extending through the thermoplastic layer from the top surface to the bottom surface so that it is superimposed, along the first axis, on the cavity, wherein the thermoelectric cell may exchange heat with a thermal source through the thermal via.
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公开(公告)号:US20220411256A1
公开(公告)日:2022-12-29
申请号:US17843483
申请日:2022-06-17
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Paolo FERRARI , Flavio Francesco VILLA , Enri DUQI , Igor VARISCO , Filippo D'ERCOLI
Abstract: MEMS device formed in a semiconductor body which is monolithic and has a first and a second main surface. A buried cavity extends into the semiconductor body below and at a distance from the first main surface. A diaphragm extends between the buried cavity and the first main surface of the semiconductor body and has a buried face facing the buried cavity. A diaphragm insulating layer extends on the buried face of the diaphragm and a lateral insulating region extends into the semiconductor body along a closed line, between the first main surface and the diaphragm insulating layer, above the buried cavity. The lateral insulating region laterally delimits the diaphragm and forms, with the diaphragm insulating layer, a diaphragm insulating region which delimits the diaphragm and electrically insulates it from the rest of the wafer.
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公开(公告)号:US20210359189A1
公开(公告)日:2021-11-18
申请号:US17321252
申请日:2021-05-14
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Paolo FERRARI , Flavio Francesco VILLA , Lucia ZULLINO , Andrea NOMELLINI , Luca SEGHIZZI , Luca ZANOTTI , Bruno MURARI , Martina SCOLARI
Abstract: A method of fabricating a thermoelectric converter that includes providing a layer of a Silicon-based material having a first surface and a second surface, opposite to and separated from the first surface by a Silicon-based material layer thickness; forming a plurality of first thermoelectrically active elements of a first thermoelectric semiconductor material having a first Seebeck coefficient, and forming a plurality of second thermoelectrically active elements of a second thermoelectric semiconductor material having a second Seebeck coefficient, wherein the first and second thermoelectrically active elements are formed to extend through the Silicon-based material layer thickness, from the first surface to the second surface; forming electrically conductive interconnections in correspondence of the first surface and of the second surface of the layer of Silicon-based material, for electrically interconnecting the plurality of first thermoelectrically active elements and the plurality of second thermoelectrically active elements, and forming an input electrical terminal and an output electrical terminal electrically connected to the electrically conductive interconnections, wherein the first thermoelectric semiconductor material and the second thermoelectric semiconductor material comprise Silicon-based materials selected among porous Silicon or polycrystalline SiGe or polycrystalline Silicon.
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公开(公告)号:US20210242387A1
公开(公告)日:2021-08-05
申请号:US17158904
申请日:2021-01-26
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Paolo FERRARI , Flavio Francesco VILLA , Luca ZANOTTI , Andrea NOMELLINI , Luca SEGHIZZI
Abstract: A thermoelectric generator includes a substrate and one or more thermoelectric elements on the substrate and each configured to convert a thermal drop across the thermoelectric elements into an electric potential by Seebeck effect. The thermoelectric generator includes a cavity between the substrate and the thermoelectric elements. The thermoelectric generator includes, within the cavity, a support structure for supporting the thermoelectric elements. The support structure has a thermal conductivity lower than a thermal conductivity of the substrate.
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