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公开(公告)号：US09060227B2
公开(公告)日：2015-06-16
申请号：US13659753
申请日：2012-10-24
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48137 , H04R1/021 , H04R1/04 , H04R19/005 , H04R19/04 , H04R31/006 , H04R2201/003 , H04R2201/029 , H05K9/0009 , H01L2924/00014
摘要： One or more embodiments are directed to encapsulating structure comprising: a substrate having a first surface and housing at least one conductive pad, which extends facing the first surface and is configured for being electrically coupled to a conduction terminal at a reference voltage; a cover member, set at a distance from and facing the first surface of the substrate; and housing walls, which extend between the substrate and the cover member. The substrate, the cover member, and the housing walls define a cavity, which is internal to the encapsulating structure and houses the conductive pad. Moreover present inside the cavity is at least one electrically conductive structure, which extends between, and in electrical contact with, the cover member and the conductive pad for connecting the cover member electrically to the conduction terminal.
摘要翻译： 一个或多个实施例涉及封装结构，包括：具有第一表面并且容纳至少一个导电焊盘的衬底，所述至少一个导电焊盘面向第一表面延伸并且被配置为在参考电压下电耦合到导通端子; 盖构件，其设置在离基板的第一表面一定距离处; 以及在基板和盖构件之间延伸的壳体壁。 衬底，盖构件和壳体壁限定空腔，其在封装结构内部并容纳导电垫。 此外，在腔内部还存在至少一个导电结构，其在盖构件和导电垫之间延伸并与之电接触，用于将盖构件电连接到导电端子。
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2.发明申请PROCESS FOR MANUFACTURING A LID FOR AN ELECTRONIC DEVICE PACKAGE, AND LID FOR AN ELECTRONIC DEVICE PACKAGE 有权用于制造用于电子设备包装的盖子和用于电子设备包装的方法公开(公告)号：US20140131819A1
公开(公告)日：2014-05-15
申请号：US14067402
申请日：2013-10-30
发明人： Alex Gritti , Paolo Crema
CPC分类号： B81C1/00261 , B81B3/0018 , B81B2201/0257 , B81B2207/093 , B81C1/00269 , B81C2203/0109 , B81C2203/035 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/15151 , H01L2924/00014
摘要： A process for manufacturing a packaged microelectromechanical device includes: forming a lid having a face and a cavity open on the face; coating the face of the lid and walls of the cavity with a metal layer containing copper; and coating the metal layer with a protective layer.
摘要翻译： 一种用于制造包装的微机电装置的方法包括：形成具有面和在所述面上敞开的腔的盖; 用包含铜的金属层涂覆盖的表面和腔的壁; 并用保护层涂覆金属层。
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公开(公告)号：US11945714B2
公开(公告)日：2024-04-02
申请号：US17390634
申请日：2021-07-30
发明人： Alex Gritti , Marco Del Sarto
CPC分类号： B81B7/0038 , B81C1/00285 , B81B2207/015 , B81C2203/0109
摘要： An electronic device comprises a “waterproof” package including a substrate of an organic material permeable to humidity and/or moisture as well as one or more electronic components arranged on the substrate. The substrate comprises a barrier layer capable of countering penetration of humidity and/or moisture into the package through the organic material substrate.
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公开(公告)号：US09822001B2
公开(公告)日：2017-11-21
申请号：US14067402
申请日：2013-10-30
发明人： Alex Gritti , Paolo Crema
CPC分类号： B81C1/00261 , B81B3/0018 , B81B2201/0257 , B81B2207/093 , B81C1/00269 , B81C2203/0109 , B81C2203/035 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/15151 , H01L2924/00014
摘要： A process for manufacturing a packaged microelectromechanical device includes: forming a lid having a face and a cavity open on the face; coating the face of the lid and walls of the cavity with a metal layer containing copper; and coating the metal layer with a protective layer.
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公开(公告)号：US09428380B2
公开(公告)日：2016-08-30
申请号：US14686540
申请日：2015-04-14
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48137 , H04R1/021 , H04R1/04 , H04R19/005 , H04R19/04 , H04R31/006 , H04R2201/003 , H04R2201/029 , H05K9/0009 , H01L2924/00014
摘要： One or more embodiments are directed to encapsulating structure comprising: a substrate having a first surface and housing at least one conductive pad, which extends facing the first surface and is configured for being electrically coupled to a conduction terminal at a reference voltage; a cover member, set at a distance from and facing the first surface of the substrate; and housing walls, which extend between the substrate and the cover member. The substrate, the cover member, and the housing walls define a cavity, which is internal to the encapsulating structure and houses the conductive pad. Moreover present inside the cavity is at least one electrically conductive structure, which extends between, and in electrical contact with, the cover member and the conductive pad for connecting the cover member electrically to the conduction terminal.
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公开(公告)号：US20220033251A1
公开(公告)日：2022-02-03
申请号：US17390634
申请日：2021-07-30
发明人： Alex Gritti , Marco Del Sarto
摘要： An electronic device comprises a “waterproof” package including a substrate of an organic material permeable to humidity and/or moisture as well as one or more electronic components arranged on the substrate. The substrate comprises a barrier layer capable of countering penetration of humidity and/or moisture into the package through the organic material substrate.
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公开(公告)号：US11309237B2
公开(公告)日：2022-04-19
申请号：US16586643
申请日：2019-09-27
IPC分类号： H01L23/498 , H01L23/31
摘要： The present disclosure is directed to a semiconductor package including a substrate having a lower surface with a plurality of slot structures. The plurality of slot structures are multi-layer structures that encourage the formation of solder joints. The semiconductor package is desirable for high reliability applications in which each solder joint termination should be checked by visual systems to ensure a proper electrical connection has been made.
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公开(公告)号：US10605684B2
公开(公告)日：2020-03-31
申请号：US15605559
申请日：2017-05-25
发明人： Alex Gritti , Marco Omar Ghidoni
摘要： A transducer modulus, comprising: a supporting substrate; a cap, which is arranged on the supporting substrate and defines a chamber therewith; a pressure transducer in the chamber; an acoustic transducer in the chamber; and a processing chip, or ASIC, operatively coupled to the pressure transducer and to the acoustic transducer. The pressure transducer and the acoustic transducer are arranged on top of one another to form a stack.
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公开(公告)号：US10225635B2
公开(公告)日：2019-03-05
申请号：US15143207
申请日：2016-04-29
摘要： A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
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公开(公告)号：US20150217993A1
公开(公告)日：2015-08-06
申请号：US14686540
申请日：2015-04-14
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48137 , H04R1/021 , H04R1/04 , H04R19/005 , H04R19/04 , H04R31/006 , H04R2201/003 , H04R2201/029 , H05K9/0009 , H01L2924/00014
摘要： One or more embodiments are directed to encapsulating structure comprising: a substrate having a first surface and housing at least one conductive pad, which extends facing the first surface and is configured for being electrically coupled to a conduction terminal at a reference voltage; a cover member, set at a distance from and facing the first surface of the substrate; and housing walls, which extend between the substrate and the cover member. The substrate, the cover member, and the housing walls define a cavity, which is internal to the encapsulating structure and houses the conductive pad. Moreover present inside the cavity is at least one electrically conductive structure, which extends between, and in electrical contact with, the cover member and the conductive pad for connecting the cover member electrically to the conduction terminal.
摘要翻译： 一个或多个实施例涉及封装结构，包括：具有第一表面并且容纳至少一个导电焊盘的衬底，所述至少一个导电焊盘面向第一表面延伸并且被配置为在参考电压下电耦合到导通端子; 盖构件，其设置在离基板的第一表面一定距离处; 以及在基板和盖构件之间延伸的壳体壁。 衬底，盖构件和壳体壁限定空腔，其在封装结构内部并容纳导电垫。 此外，在腔内部还存在至少一个导电结构，其在盖构件和导电垫之间延伸并与之电接触，用于将盖构件电连接到导电端子。
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