公开(公告)号：US20190127218A1

公开(公告)日：2019-05-02

申请号：US16233682

申请日：2018-12-27

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Marco Omar GHIDONI ,  Roberto BRIOSCHI

IPC: B81B7/02 ,  H04R1/04 ,  H04R1/40 ,  B81B7/00 ,  B81C1/00 ,  H04R19/00

CPC classification number: B81B7/02 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/07 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/0023 ,  H04R1/04 ,  H04R1/406 ,  H04R19/005 ,  H04R2201/003

Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.

公开(公告)号：US20180149538A1

公开(公告)日：2018-05-31

申请号：US15605559

申请日：2017-05-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alex GRITTI ,  Marco Omar GHIDONI

IPC: G01L19/00 ,  G01L19/14 ,  G01L9/08 ,  G01L11/06

CPC classification number: G01L19/0092 ,  G01L9/0045 ,  G01L9/0054 ,  G01L9/08 ,  G01L11/06 ,  G01L19/147 ,  G01L2019/0053 ,  H04R19/005 ,  H04R2201/003

Abstract: A transducer modulus, comprising: a supporting substrate; a cap, which is arranged on the supporting substrate and defines a chamber therewith; a pressure transducer in the chamber; an acoustic transducer in the chamber; and a processing chip, or ASIC, operatively coupled to the pressure transducer and to the acoustic transducer. The pressure transducer and the acoustic transducer are arranged on top of one another to form a stack.

公开(公告)号：US20170318396A1

公开(公告)日：2017-11-02

申请号：US15377627

申请日：2016-12-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto BRIOSCHI ,  Marco Omar GHIDONI

IPC: H04R19/04 ,  B81C1/00 ,  H04R31/00 ,  H04R1/44 ,  H04R7/06 ,  H04R19/00 ,  B81B7/04

CPC classification number: H04R19/04 ,  B06B1/0292 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2201/047 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/44 ,  H04R3/005 ,  H04R7/06 ,  H04R19/005 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

公开(公告)号：US20210310877A1

公开(公告)日：2021-10-07

申请号：US17219433

申请日：2021-03-31

Applicant: STMicroelectronics S.r.l.

Inventor： Massimiliano PESATURO ,  Marco Omar GHIDONI

IPC: G01K7/01 ,  H05K1/18

Abstract: An ambient temperature sensor is provided that may be coupled to a PCB. The ambient temperature sensor includes a package including a first cap and an insulating structure. The insulating structure is formed of thermally insulating material, and the first cap and the insulating structure delimit a first cavity. A semiconductor device is included and generates an electrical signal indicative of a temperature. The semiconductor device is fixed on top of the insulating structure and arranged within the first cavity. The package may be coupled to the PCB so that the insulating structure is interposed between the semiconductor device and the PCB. The insulating structure delimits a second cavity, which extends below the semiconductor device and is open laterally.

公开(公告)号：US20210163283A1

公开(公告)日：2021-06-03

申请号：US17102973

申请日：2020-11-24

Applicant: STMicroelectronics S.r.l.

Inventor： Marco Omar GHIDONI

IPC: B81B7/00

Abstract: A packaged environmental sensor includes a supporting structure and a sensor die, which incorporates an environmental sensor and is arranged on a first side of the supporting structure. A control chip is coupled to the sensor die and is arranged on a second side of the supporting structure opposite to the first side. A lid is bonded to the first side of the supporting structure and is open towards the outside in a direction opposite to the supporting structure. The sensor die is housed within the lid.

公开(公告)号：US20170313579A1

公开(公告)日：2017-11-02

申请号：US15362556

申请日：2016-11-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Marco Omar GHIDONI ,  Roberto BRIOSCHI

IPC: B81B7/02 ,  H04R1/04

CPC classification number: B81B7/02 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/07 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/0023 ,  H04R1/04 ,  H04R1/406 ,  H04R19/005 ,  H04R2201/003

Abstract: A transducer module, comprising: a supporting substrate, having a first side and a second side; a cap, which extends over the first side of the supporting substrate and defines therewith a first chamber and a second chamber internally isolated from one another; a first transducer in the first chamber; a second transducer in the second chamber; and a control chip, which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.